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Emerging Technologies in various domains, including Microelectronics, Nanotechnology, Smart Materials, Micro-Electro-Mechanical Systems, Biomedical engin., New Energies …, all raise issues related to thermal effects and interactions. Their importance is continuously increasing, tending to be a dominant factor in new technologies.

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Consisting of topical symposia, the MRS meeting offers materials researchers the opportunity to present their work, get information on up-to-the minute developments in their field, and network. In addition, the Materials Research Society has established the MRS Workshop Series, which offers highly focused and compelling subjects, designed to allow full attention to one topic over a two to three day period. Workshops generally allow for greater interaction between speakers and audience than is typical in a meeting symposium.

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Each year, SEMI-THERM honors a person as a Significant Contributor to the field of semiconductor thermal management. The THERMI award is intended to recognize a recipient’s history of contributions to crucial thermal issues affecting the performance of semiconductor devices and systems.

Nominations are solicited from the community at large. The THERMI winner is selected from among the nominations by past SEMI-THERM chairs and past THERMI winners.

Learn more from SEMI-THERM.

The 2011 6SigmaDC event will host an extended agenda, with an open day of presentations and talks from 6SigmaDC users Facebook, Intel and other industry heavyweights.

Attendees will be educated on the new standards, processes and technologies that bridge the gaps between IT and Facilities, supplier and end-user, design and operations and the micro and macro scales in managing the data center. The second and third day of the conference will provide specialized training and tutorials for 6SigmaDC users. Click the links above to view detailed schedules.

Learn more from Future Facilities.

The 25th annual European Workshop on Thermal and ECLS Software, organised by the Analysis and Verification Section of the Thermal Division, ESTEC, will be held on:

Tuesday 8th and Wednesday 9th November 2011
at ESTEC, Noordwijk, the Netherlands.

The goals of the Workshop are:

1. to promote the exchange of views and experiences amongst the users of European thermal/ECLS engineering analysis tools and related methodologies
2. to provide a forum for contact between end users and software developers
3. to present developments on thermal/ECLS engineering analysis tools and to solicit feedbac

to present new methodologies, standardisation activities, etc.

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Future Facilities welcomes you to a live web presentation detailing airflow management basics, their effects, and the best ways to implement them.

What data center management practice is mostly overlooked but can have the single biggest impact on data center efficiency, IT resilience and data center longevity? The answer: airflow management. Proper airflow management can increase overall data center efficiency by 25-30%, enable more precise control of the IT environment, and add years to the useful life of the data center. No other single data center management practice has an impact this significant.

Given the stakes, why is proper airflow management so overlooked?

The answer is twofold. Firstly, the industry suffers from a lack of good information about airflow management as it simply was not that important until recent years. Secondly, proper airflow management, on the surface, appears difficult to achieve as it requires cooperation and coordination between two groups that typically do not interact: IT and facilities.
However, given that the useful life of your data center literally hangs in the balance, proper airflow management deserves another look.

Our presenters will discuss airflow management basics and answer questions such as:

•  How does the absence of proper airflow management put data center longevity and resilience at risk?
•  What is proper airflow management? Is it difficult and costly to implement?
•  I already use blanking panels and containment, what else do I need to do?
•  Why is airflow management equally important for IT and facilities?
•  How much do I stand to I gain by incorporating airflow management practices?

Learn more from Future Facilities.

IEEE International Electric Vehicle Conference (IEVC) organizers are seeking technical papers on the technology, standards and engineering of electric vehicles. Of specific interest for this conference are papers related but not limited to the following areas:

• EV system architecture concepts for passenger, service and utility vehicles (BEV, PHEV, HEV, FCEV)
• Innovations in EV component design
• EV motor drives and controllers
• EV high voltage wiring
• Heating and cooling systems for EV’s
• Innovations in EV energy storage solutions (e.g. battery chemistry, ultra capacitor, fuel cell, battery management system)
• EV systems modeling, simulation and testing
• AC and DC conductive charging, wireless charging, smart charging, fast charging
• Power grid and renewable energy resource interfacing for EV mass deployment
• Design for manufacturing for EV mass production
• EV fleet and infrastructure asset management
• Design for EV maintainability
• Information Technology and Communication services for the EV ecosystem
• Global standards development for EVs and their impact on EV deployment, R&D and manufacturing
• Trends in EV deployment, supply chain and manufacturing
• EV-related educational programs for engineers, legislators and the public

Accepted papers will be presented during the inaugural conference, March 4-8, 2012, at

the TD Convention Center in Greenville, S.C. They will also be published in conference proceedings and available through the IEEE Xplore digital library.

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Mark your calendars! October 10, 2011 is the deadline to submit an abstract and/or a Professional Development Course (PDC) proposal about new developments and technology related to the following:

• Advanced Packaging
• Applied Reliability
• Assembly and Manufacturing Technology
• Electronic Components & RF
• Emerging Technologies
• Interconnections
• Materials & Processing
• Modeling & Simulation
• Optoelectronics
• Interactive Presentations (formerly Posters)

Submission Guidelines
The content must be original, previously unpublished, non-confidential and without commercial content.

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Alternative energy, in particular solar PV, is a major growth area for new companies, materials companies, equipment suppliers and EMS providers in the electronics industry, both in the panels and balance of plant manufacture. Despite recent painful bankruptcy filings by prominent solar PV companies, there is solid growth and strong government investment to develop the next generation thin-film cells under the SunShot and other programs.

This presentation looks at the growth of this industry segment, some of the gaps and showstoppers identified in the iNEMI roadmap and some of the new technology that is quietly enabling many of these developments.

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Data Center World is the largest global event of its kind and has been named one of the 50 fastest growing tradeshows in the U.S. It is the leading educational conference for data center professionals.

Data Center World is presented by AFCOM, the premier data center association representing 4,500 of the largest data centers around the world.

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This free 1-day event is dedicated to the protection of our country’s critical warfare computing environments. You’ll learn strategies and best practices for securing command IT systems and get tactics for identifying, and responding to, cyber threats and effective risk mitigation techniques to avoid them. Major General Alan Lynn, Chief of Signal for the US Army Signal Corps and Commanding General of the Signal Center of Excellence and Fort Gordon, will address “The New Direction in Cyber for the US Army Signal Corps.”  Richard Hale, DISA’s Chief Information Assurance Executive, joins former DISA CIO John Garing to discuss “Data Center Consolidation and Securing Data at Rest.”  Daniel Bradford, Deputy to the Commander & Senior Technical Director, NETCOM/9th Signal Command, U.S. Army; SES has also been confirmed to participate, joining an already powerful roster of speakers including DoD CIO Rob Carey, Former Army CIO/G-6 Jeff Sorenson, and Dr. Bob Childs of National Defense University iCollege.

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Nordson ASYMTEK will host a free technical seminar on conformal coating, dispensing and jetting applications and innovations and the fluids, equipment and manufacturing techniques to implement them. The conformal coating seminar will be on Wednesday, September 14 and the dispensing and jetting seminar will be Thursday, September 15.

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Subjects of Particular Interest include Packaging, Thermal Packaging Materials, Analysis and Modeling, Experimental Work, Thermal Design Process and Multidisciplinary Thermal Management.

Selection of papers for presentation is solely based on an extended abstract. The abstract should provide a complete summary of the proposed paper comprising work or results not previously presented or published. Submitted abstracts should be between 2 and 5 pages of single spaced text giving the key results, findings and conclusions. Abstract deadline is September 12, 2011.

Learn more from SEMI-THERM.