The simplest of compact thermal models (CTMs) is a one resistor type. Of these the most widely quoted is Theta_ja (ok, ok, and Theta_jma, more on that variant later). Knowing the power dissipation of the component as well as the ambient temperature is in theory all that is required to determine the junction temperature from […]
November 5th, 2009
October 23rd, 2009
I read in the news this last week that Sir Tim Berners-Lee, a Brit and the inventor of the World Wide Web, has confessed that the // in a web address were actually “unnecessary”…
and it seems that polar ice will be gone in the summer, perhaps by as early as 2020, opening the arctic […]
October 12th, 2009
Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted […]
October 8th, 2009
If you’re guessing it’s a chip package, you’re right – got it in one. Well done!
OK, so what type of package is it?
If you’re thinking it’s a silly question as you don’t know anything about the package, other than I’ve told you its black – that was a hint that it’s an encapsulated plastic part […]