Industries

Satellite Cooling System Paves Way for More Compact Sensor Systems

September 1st, 2015

A team of scientists from Lockheed Martin have produced a small satellite cooling system, the high power Microcryocooler, which is the lightest on the market and three times more powerful than the company’s first design.…read more

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Non-drip Epoxy Paste Cures Optically Clear

September 1st, 2015

Master Bond Inc. introduces the Master Bond EP21NDCL – a new two component non-drip epoxy paste that cures optically clear in thin sections. It is ideal for bonding, coating and sealing applications in aerospace, electrical,…read more

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Graphene Grown From Tea Tree Extract

August 25th, 2015

Scientists have successfully grown high-quality graphene from a tea tree plant known as Melaleuca alternifolia. This plant is commonly used to make oils and medicine. The scientists’ paper has been published in a recent issue…read more

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Atom Cooling Technique Discovered

August 25th, 2015

A team of researchers from the University of Southampton have successfully used matter waves to cool molecules that cannot be handled by typical laser methods. This is the first demonstration of this technique, which was…read more

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Solid-state CPU Cooler Offers Advanced Cooling

August 24th, 2015

Phononic unveils a new solid-state CPU cooler, the Phononic model HEX 1.0. The small package, with dimensions of 4.3″ x 3.5″ x 3.5″, offers an advanced cooling performance despite its tiny size. “Unlike traditional heatsink/fan…read more

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New Adhesives Ideal for Bonding and Encapsulating Semiconductors

August 24th, 2015

DELO introduces new one-component epoxy resins that can withstand temperatures up to 250 degrees Celsius. These new anhydride-based adhesives are ideal for bonding and encapsulating sensors and semiconductors, according to the company. The adhesives were…read more

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TIM with EMI Absorption Capabilities Announced

August 24th, 2015

Henkel introduces the first ever low-stress thermal interface material with EMI absorption capabilities, known as the Gap Pad EMI 1.0. “The latest in its line of BERGQUIST GAP PAD products, Henkel’s GAP PAD EMI 1.0…read more

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‘Wonder Material’ Graphene: Possible Solution for Energy Storage

August 17th, 2015

Graphene has been suggested as a possible solution in new energy storage techniques, leading researchers to suggest either adjusting Li-ion batteries, or using graphene as an energy storage medium itself. According to the an article…read more

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Electronic Devices Made Faster by Graphene Nanoribbon Technique

August 17th, 2015

Graphene could be used for the next generation of faster, more energy-efficient electronics. According to engineers from the University of Wisconsin-Madison, they have developed “a way to grow graphene nanoribbons with desirable semiconducting properties directly…read more

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Liquid-cooled Primergy Server to Cut Energy Costs in Half

August 12th, 2015

Fujitsu unveiled a new liquid-cooled Primergy server, the Primergy CX400 M1, which will cut energy costs in half and increase density in data centers by five times. “Fujitsu is revolutionizing data center design, and is…read more

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University Joins Research Project to Develop Heat-resistant Electrical Systems for Vehicles

August 11th, 2015

The University of Arkansas announces it will help lead an $18.5 million dollar engineering research center to develop new electrical systems for vehicles that are more powerful, efficient and heat-resistant. The university houses a 7,000-square-foot…read more

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Penn State Engineers Developed New Heat-Resistant Polymer

August 11th, 2015

A group of Penn State engineers have produced lightweight, flexible dielectric polymers that are heat resistant and easily manufactured. Because of its resistance to heat, the new polymer is ideal for use in power electronics…read more

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Air Force Inquires About New Thermal Management Solutions for Future Aircraft

August 11th, 2015

The U.S. Air Force is looking into new thermal management techniques to cool the electronics in future fighter aircraft. “Officials of the Air Force Research Laboratory at Wright-Patterson Air Force Base, Ohio, issued a broad…read more

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First Hybrid Temperature Chamber Introduced to Industry

August 10th, 2015

TotalTemp Technologies, Inc. introduces a hybrid benchtop chamber for thermal testing that combines both convection and thermal conduction in one unit. It is the first hybrid temperature chamber on the market. The HBC-SD49 Hybrid Benchtop…read more

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