Industries

Visitors Encouraged to Visit New Website Launch

June 21st, 2016

(June 20, 2016) IMS has recently launched a newly redesigned website with improved functionality. The company’s mission to provide the electronics manufacturing industries with the highest quality devices and components is clearer, according to IMS,…read more

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Special Adhesives to Better Medical Equipment

June 21st, 2016

(June 13, 2016) Device manufacturers are making more accurate, compact medical equipment with electronics technology. MedicalPlasticsNews.com reported that they are using “pressure-sensitive adhesives (PSAs)” which were “developed as a heat sink attachment method to eliminate…read more

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Two New Approaches to Thermal Management Problems

June 21st, 2016

(June 14, 2016) Recent research is looking at two opposite physical effects to keep chips cool by possibly distributing process loads across multiple cores. According to NewElectronics.co.uk, the National Physical Laboratory (NPL) is conducting two…read more

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A Cooler Microchip Design with a Black Semiconductor

June 13th, 2016

(June 12, 2016) Researchers and scientists at the University of California-Berkeley have found that layered, crystalline black phosphorus could “lead to a new microchip design that lets heat flow away and keeps electrons moving,” said…read more

Posted in Coolers, Design, Design, Materials, Compounds, Adhesives, Substrates, News, Semiconductor | Comments Off on A Cooler Microchip Design with a Black Semiconductor

Controlling the Heating and Cooling in Graphene

June 13th, 2016

(May 17, 2016) “Researchers from University of Groningen and the University of Manchester have now, for the first time, directly detected the Peltier effect in graphene that is either one or two atoms thick [and]…read more

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Microfluidic Cooling Could Be Answer to Heat Buildup in Microchips

June 13th, 2016

(June 4, 2016) DARPA is seeking out solutions for the massive problem of heat buildup in microchips. They think they found it in microfluidic cooling. They’ve initiated a program called ICECool Applications (Intra/Interchip Enhanced Cooling), according to…read more

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Sizes Added to Backward-Curved Impeller Line

June 8th, 2016

Rosenberg has recently expanded its high-efficiency E-Series backward-curved impellers to now include sizes from 12.4 to 22 inches with either AC or EC motors. The unique airfoil blade impeller increases energy efficiency by up to…read more

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New Cooling Fan Blade Design

June 8th, 2016

Cradle has released their new simpler, faster solution for fan design, SmartBlades. SmartBlades simplifies axial cooling fan design by automating generation of blade geometry CAD data. Engineers adjust parameters for blade number, profile, and twist.…read more

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New PWM Controller for Fans Released

June 8th, 2016

SANYO DENKI has recently released their “San Ace PWM controller”, which controls fan speed through PWM. This contributes to reduced system power consumption and the fan noise. Up to four PWM-input fans can be connected…read more

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How to Choose the Right Solution for Effective Heat Management

June 7th, 2016

(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,”…read more

Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, News, Research, Semiconductor | Comments Off on How to Choose the Right Solution for Effective Heat Management

Laser Storage in Data Centers Could Mean Less Heating

June 7th, 2016

(June 3, 2016) Davide Bossini from the University of Tokyo has found a possible solution to control the demand for smaller, faster, devices to store, manage, and process data in data centers without compromising cooling.…read more

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Custom Liquid Cooling System for Data Centers

June 7th, 2016

(June 2, 2016) “A special unit within Dell that makes custom tech for operators of the world’s largest data centers, has designed a water-based system for cooling custom server chips it developed” for eBay with…read more

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High Temperature Analogue and Mixed Signal Electronics May Become Silicon Carbide-Based

May 31st, 2016

(May 24, 2016) Recently, SiC (Silicon carbide) has been recognized as a material that can be “used for small signal electronics – such as analogue and mixed-signal devices – making possible the locating of monitoring…read more

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New Orders for Indian Satellites’ Heat Pipes

May 31st, 2016

(May 27, 2016) More orders have been secured by Avasarala Technologies Ltd, the city-based tier-1 supplier of critical components to strategic sectors, to supply heat pipes for Indian satellites. “As an import-substitute component, the pipes…read more

Posted in Aerospace, Heat Pipes, News | Comments Off on New Orders for Indian Satellites’ Heat Pipes