Industries

Cold Forged Heat Sinks Boost Thermal Management of LEDs

August 19th, 2014

GlacialTech Inc. has introduced Igloo FR210 and Igloo FR210HP, two new cold forging thermal modules designed for 80W LED thermal management applications. The Igloo FR210HP differs from the Igloo FR210 in that it optimized for…read more

Laser Cooling Yields More Sensitive Microscopes

August 19th, 2014

By cooling a nanowire probe using lasers, Australian scientists have discovered a way of dramatically improving atomic microscope sensitivity by up to 20 times, allowing them to register forces as small as that of an…read more

One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

Cooling Enhancement Boosts Operation of Laser Power Amplifier

August 5th, 2014

By enhancing the cooling system of a thin disk laser power amplifier with an optically-transparent heat sink, researchers at the U.S. Army Research Laboratory have successfully extended the device’s power scaling up to two and…read more

New Theory Suggests Magnets May Initiate ‘Wireless’ Cooling

July 28th, 2014

 A new theory describing the motion of tiny particles within magnets could mean the onset of effective, long-distance cooling. According to researchers at MIT, these quasi-particles, known as magnons, represent a collective rotation of electrons’…read more

Silica Additive Helps Solar Cells Cool Themselves

July 25th, 2014

Researchers at Stanford University in California may have overcome a major obstacle in the development of efficient, long-lasting solar cells with a silica additive designed to help the cells cool themselves.  Solar cells, which convert…read more

Scientists Explore the Pseudogap Phase of High-Temperature Superconductors

July 24th, 2014

Physicists at Binghamton University have identified an important feature of the pseudogap phase of copper-oxide high-temperature superconductors – a remarkable density wave state that may be a trait of all cuprates. The research, published this…read more

Conductive Crystal Structure Stops Heat Transfer

July 21st, 2014

European scientists have released new research on a perfect crystalline structure that breaks the rules of physics by stopping heat transfer instead of allowing it to travel through the material. This theoretical explanation of how…read more

Nanodiamonds Boost Thermal Conductivity of Thermoplastics

July 18th, 2014

Carbodeon has announced the release of new nanodiamond-enhanced thermoplastics, which offer a 20-100 percent improvement in thermal conductivity compared to traditional materials. The new uDiamond® products can achieve a 20 percent increase in polymer thermal…read more

Micro Motors, Fans and Blowers Cool Medical and Commercial Devices

July 17th, 2014

Pelonis Technologies, Inc., a manufacturer of axial AC and brushless C fans and motors, has announced a new line of micro motors, fans and blowers for cooling medical devices and compact commercial electronic devices. The…read more

Porous Materials May Boost Thermoelectric Devices

July 17th, 2014

Greek scientists have released a new study demonstrating how porous substances can act as effective thermoelectric materials, opening the door to the use of such materials in future devices. In recent years, researchers have been…read more

High-Pressure Torsion Method Could Yield More Efficient Thermoelectric Devices

July 14th, 2014

Scientists at Kyushu University in Japan have developed a novel way of reducing the thermoconductivity of crystalline silicon using high-pressure torsion that could result in a more efficient thermoelectric device. Thermoelectric energy devices, which rely…read more

Spin Waves Transport Heat in Insulating Materials

July 8th, 2014

An international team of researchers has designed a nanoscale cooling element that utilizes fundamental subatomic properties to transport heat in electrical insulators. The technology, which could help dissipate heat in future miniature computer chips, relies…read more

Phase-Change TIM Offers Good Alternative to Grease

July 7th, 2014

Universal Science has introduced a new phase change thermal interface material that offers a cleaner, more effective alternative to thermal grease. With 4.0 w/mK thermal conductivity, UniPhase 4000-COB is ideal for use in a wide…read more