Industries

New USB Type-C Connectors and Cable Assemblies

May 2nd, 2016

Heilind Electronics has recently added Molex USB Type-C shielded I/O connectors and cable assemblies to its stock. The Type-C connectors offer a “more compact design” with “greater PCB savings, while allowing high-frequency mating in data,…read more

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Industry’s First Portable Measurement Equipment to Improve Thermal Efficiency

May 2nd, 2016

SANYO DENKI has recently developed and launched the first portable measuring equipment that measures the system impedance and operating airflow of devices. The San Ace Airflow Tester claims to “improve the thermal efficiency of a…read more

Posted in Blowers / Fans / Filters, Free Air Cooling, New Products, Research, Test & Measurement | Comments Off on Industry’s First Portable Measurement Equipment to Improve Thermal Efficiency

Software Update Leads to Device Failure by Overheating

May 2nd, 2016

(April 29, 2016) The new Nextfit Robin, an Android-based smartphone, experienced a major cooling malfunction after a recent software update which resulted in the phones overheating. The device normally heats up a bit when performing everyday…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Coolers, Design, Design, News, Plastics, Power, Software/Modeling | Comments Off on Software Update Leads to Device Failure by Overheating

Graphene Nanoflakes Better Dissipates Electronics’ Heat

May 2nd, 2016

(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more

Posted in Aerospace, Automotive, Computer, Data Centers, Defense, Heat Exchanger, Industrial, IT Products, Materials, Compounds, Adhesives, Substrates, Medical, News, Research, Test & Measurement, TIMs | Comments Off on Graphene Nanoflakes Better Dissipates Electronics’ Heat

BIG Thermal Test for the JWST Test Model

April 25th, 2016

(April 22nd, 2016) The James Webb Space Telescope had an “observatory core” test model twin of itself constructed for the biggest thermal test Goddard mechanical integration technician, Chris Matthews, has ever had. Matthews’ team of…read more

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Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

Posted in Aerospace, Automotive, Computer, Coolers, Defense, Materials, Compounds, Adhesives, Substrates, Medical, News, Semiconductor | Comments Off on Potential Electronics Cooling Application of Carbon Nanotubes

New “Form-In-Place” Product with Process Demonstration Video

April 22nd, 2016

JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech…read more

Posted in Computer, Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Thermal Imaging | Comments Off on New “Form-In-Place” Product with Process Demonstration Video

New Website for Unique Product Line

April 18th, 2016

Developer of cooling solutions for high-powered electronics, QuantaCool,  has selected Schubert b2b to design a new website to support the company as it goes to market with its PolarBox™, PolarRak™ and PolarMax™ product lines. “QuantaCool’s…read more

Posted in Computer, Data Centers, Heat Pipes, LED / Lighting, New Products, Refrigeration | Comments Off on New Website for Unique Product Line

New System Improves Lead Times

April 18th, 2016

A manufacturer of thermoelectric air conditioners, TECA Corporation, has recently implemented a new program to improve lead times. President of TECA, Mike Mikalauskis, said, “We were able to pair new software with a more streamlined…read more

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Metal Inverse Opals Could Better Cool Electronics

April 18th, 2016

(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal…read more

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New Approach to Simulate Nanoscale Thermoelectric Materials

April 18th, 2016

(April 7th, 2016) A research group led by Joe Feser, assistant professor in the Department of Mechanical Engineering at the University of Delaware, has developed a new approach to simulating nanoscale heat transfer in materials,…read more

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Small EHD Pump Solution May Cool Space Hardware

April 18th, 2016

(April 13th, 2016) Michal Talmor, a Ph.D. candidate in mechanical engineering at the Worcester Polytechnic Institute (WPI) in Worcester, Massachusetts, is focused on bringing electrohydrodynamic (EHD)-based thermal control to space exploration devices. Now in the…read more

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Application of Diamond Heat Spreaders for the Thermal Management of GaN Devices

April 14th, 2016

Application of Diamond Heat Spreaders for the Thermal Management of GaN Devices Thomas Obeloer*, Bruce Bolliger Element Six Technologies 3901 Burton Drive, Santa Clara, CA 95054 *thomas.obeloer@e6.com   Yong Han, Boon Long Lau, Gongyue Tang,…read more

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Thermal Facts and Fairy Tales: Automated Meshing Philosophy?

April 14th, 2016

Thermal Facts and Fairy Tales: Automated Meshing Philosophy? Peter Rodgers Fairy tales are a well-established way to convey science and technology education. For example, a recent textbook [1] has documented how a range of Victorian-era…read more

Posted in Articles, CFD Software, Computer, Liquid Cooling, Software/Modeling, Test & Measurement | Comments Off on Thermal Facts and Fairy Tales: Automated Meshing Philosophy?