Industries

Thermal Material Provides Both Compressibility and Conformability with Phase-Change Ability

April 17th, 2014

AI Technology, Inc. has released COOL-PAD™ CPR7154, a thermal interface material that dispenses like a thermal pad but exhibits characteristics like that of a grease or gel when device temperatures increase to above 45°C. Ideal…read more

Flexible Thermoelectric Generator Could Power Wearable Devices Using Body Heat

April 11th, 2014

Researchers have developed a new thermoelectric generator that could replace batteries as a more versatile power source. As interest grows in wearable electronics like Google Glass, smartwatches and fitness trackers, finding a suitable, long-lasting reliable…read more

Microchips Tolerate Extreme Temperatures in Industrial Applications

April 4th, 2014

German scientists have successfully fabricated compact microchips able to tolerate temperatures up to 300°C in an achievement that could have significant implications for the geothermal and oil production industries. Drill bits and borehole probes employed…read more

Polymer-Based Thermal Interface Material Cools Devices at 200°C

April 3rd, 2014

Scientists have developed a new polymer-based thermal interface material (TIM) capable of conducing heat 20 times better than conventional polymer. Reliable in temperatures of up to 200°C, the modified material can be fabricated on heat…read more

Liquid Cold Plate Cools Power Electronics

March 27th, 2014

Thermal management company GCoreLab has introduced a new generation of cold plates for the cooling of power electronics. The new XtremeChill liquid cold plate utilizes GCoreLab’s patented oblique fin technology, which offers superior thermal cooling…read more

Researchers Pinpoint Heat Movement in Nanostructures

March 25th, 2014

Researchers at Cornell University have developed a new method of precisely measuring the subtle movement of heat in nanostructures. Heat flows at the nanoscale differently than at larger scales, the researchers say, and understanding how…read more

Liquid Cooling System to Cut Data Center Cooling Costs

March 21st, 2014

An associate professor of mechanical engineering at the University of Wisconsin-Madison has developed a liquid cooling system he says is safer than water cooling and could cut cooling costs of data centers by up to…read more

Heat Exchangers Cool Electrical and Electronic Enclosures

March 21st, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom…read more

Bergquist Talks TIMs at Semi-Therm 30

March 14th, 2014

Graphene Improves Copper Film Thermal Conductivity

March 11th, 2014

The placement of a single atomic plane of graphene on the surface of a copper film can significantly increase the film’s thermal conductivity, making the hybrid material ideal for more demanding thermal management applications, according…read more

Magnetically-Stimulated Flow Patterns Could Boost Heat Transfer

March 11th, 2014

Magnetically-stimulated fluid flow patterns may offer a new method for handling difficult heat transfer problems by overcoming natural convection limits, according to new research from scientists at Sandia National Laboratories. Convection cooling, which refers to…read more

Gummy Electrolyte Could Reduce Battery Fire Hazard

March 10th, 2014

Researchers at Washington State University have developed a new conductive gum-like material that could improve the safety of lithium ion batteries. Used in laptops, smartphones and other electronic devices, lithium ion batteries are capable of…read more

Nanoscale Pillars May Improve Thermoelectric Materials

March 10th, 2014

Researchers at the University of Colorado Boulder say a new method of improving thermoelectric materials could lead to the development of better solar panels, more energy-efficient cooling equipment and effective devices that could turn waste…read more

Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation

March 10th, 2014

Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and…read more