Industries

Doctoral Candidate’s Research Could Improve Efficiency of Data Centers

May 26th, 2015

Husam Alissa, a Binghamton University doctoral candidate in mechanical engineering, has been working to improve the efficiency of data centers at the university’s Center for Energy-Smart Electronic Systems (ES2). Alissa’s work focuses on reducing overheating,…read more

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

May 26th, 2015

Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center…read more

Posted in Articles, CFD Software, Coolers, Data Centers, Design, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, Refrigeration | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

Posted in Articles, Coolers, Data Centers, Design, Enclosures, Heat Exchanger, Heat Pipes | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

Data Center Energy Savings: Total Liquid Cooling versus Indirect Liquid Cooling

May 21st, 2015

By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible…read more

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New Gap Filler Improves Heat Management in Automotive Electronics

May 20th, 2015

Dow Corning introduces the TC-4525, a thermally conductive gap filler that offers advanced heat management in automotive electronics. This gap filler is two-part silicone, soft, compressible and cost-effective. It can be used directly from its…read more

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A Simple Method to Understand Trade-Offs in Data Center Cooling

May 20th, 2015

By: Dustin W. Demetriou, PhD Cooling and thermal management are critical to data center reliability. Many organizations see cooling as a differentiating factor in the lifecycle cost of their data center. Recent industry guidelines [1]…read more

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Gartner Data Center, Infrastructure & Operations Management Conference

May 12th, 2015

Gartner Data Center, Infrastructure & Operations Management Conference December 7 – 10, 2015 Las Vegas, NV This event will cover mobile, cloud, storage and other IT forces that are making new demands on the data…read more

Posted in Calendar, Data Centers | Comments Off on Gartner Data Center, Infrastructure & Operations Management Conference

Report: Images on Forum Show How Liquid Cooling is Incorporated into New Products

May 12th, 2015

Three images have appeared on an Asian video card forum named Chiphell of new AMD Fiji GPUs, showcasing compact PCBs pre-fitted with a liquid-cooling heatsink and loop connectors. It has not yet been determined if…read more

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Chinese Company Creates Data Center Tech Advances

May 12th, 2015

Shanghai Data Solution, a company owned by the Chinese government, says it is making large strides in the data center industry. “Shanghai Data Solution (SDS) built its first small network communications site in 2001, and…read more

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LED China 2015

May 12th, 2015

LED China 2015 September 16-19, 2015 Shanghai, China LED China is the world’s largest LED and LED lighting exhibition. It will be be held at Shanghai New International Expo Centre (SNIEC). The event is projected to…read more

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High Static Pressure Fan Offers 1.4 Times Static Pressure

May 11th, 2015

Sanyo Denki introduces its new San Ace 40 9HV type high static pressure fan. The fan type offers the highest static pressure in the industry – 1.4 times the static pressure than conventional DC fans,…read more

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UPenn Physicists Discover New Material that May Cool Computers

May 5th, 2015

Heat emitted from computers, laptops and other electronic devices during use is regularly caused by numerous transistors overcrowded in the devices. This also expels large amounts of wasted heat energy. A pair of physicists from…read more

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Cooling System for Computer Processors Could Save Consumers Billions

May 5th, 2015

A patented passive cooling system for computer processors could save U.S. consumers more than 6.3 billion dollars in electricity costs per year. The system is currently being manufactured at the University of Alabama in Huntsville…read more

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Trio of Companies to Improve Graphite Thermal Management Products

April 27th, 2015

Three Canadian companies, Terrella Energy Systems, Alpha Technologies, and Westport Innovations, have partnered up to improve low-cost graphite thermal management products. The companies have partnered with researchers at Simon Fraser University and Ontario’s Sheridan College…read more

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