Researchers at the Max Planck Institute of Colloids and Interfaces in Potsdam-Golm, Germany have developed a simpler and more cost-efficient means of creating microchips for electronics applications using paper and a conventional inkjet printer. The…read more
New Method Uses Paper and Inkjet Printer to Create More Heat-Tolerant Carbon Electronics
May 24th, 2013
Two-Phase Evaporative Liquid Cooling Systems for Renewable Energy Power Conversion Systems
May 23rd, 2013
Parker Hannifin Corporation, a developer of motion and control technologies, has released new two-phase evaporative liquid cooling systems for renewable energy power conversion systems. “The Parker system’s inherent cooling efficiency benefits can result total system cost…read more
New Tool Could Provide Better Understanding, Method for More Efficient Thermal Transfer
May 23rd, 2013
Researchers from the University of Toronto Engineering in Canada, with assistance from colleagues from Carnegie Mellon University in Pennsylvania, have published new insights into how materials used in electronics transfer heat, which could lead to…read more
Quiet CPU Coolers for Intel Xeon Workstations and Servers
May 17th, 2013
Cooling component manufacturer Noctua has released a new revision of its NH-U12DX and NH-U9DX quiet CPU coolers for Intel Xeon workstations and servers. “Builders of quiet workstations and servers still have trouble finding quality cooling…read more
U.S. Patent for Two-Stage Enclosure Coolers Awarded
May 17th, 2013
The United States Patent and Trademark Office has awarded U.S. patent No. 8,402,773 to ITW Vortec for its two-stage cooling system Vortex A/C Enclosure Coolers. According to the company, the newly patented Vortex A/C enclosure…read more
Company Acquires Thermal and Vacuum Product Manufacturer
May 17th, 2013
GT Advanced Technology, a provider of crystal growth equipment and solutions for the solar, LED and electronics industries, has acquired Thermal Technology LLC. Located in Santa Rosa, Calif, Thermal Technology manufactures and distributes a range…read more
Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers
May 16th, 2013
Server manufacturers and data center managers are showing a greater concern regarding the energy efficiency and cooling of the new generation of servers for data centers. With very large data centers exceeding 100 000 servers,…read more
Thermal Facts and Fairy Tales: A System Perspective for Electronics Cooling
May 16th, 2013
A friend of mine who was an aspiring plumber once stated that all you need to know to be a plumber is that you get paid on Friday and that waste flows downhill. Maybe there…read more
Electronic Performance Impact of Elevated Humidity Environments — Implications for Free Air Cooling of Data Centers
May 16th, 2013
Introduction The computer industry is exploring various options for reducing the cost and energy consumption associated with cooling data centers. The use of liquid cooling in the data center has long been exploited as a…read more
Parker Aerospace to Supply Thermal Management System for Joint Strike Missile
May 14th, 2013
The Parker Aerospace business segment of Parker Hannifin Corp., which specializes in single-phase liquid and two-phase liquid/vapor thermal management products and systems, has been awarded a contract to provide the thermal management system to Kongsberg…read more
Cooling Filters and Venting Products for Range of Telecommunication Applications
May 13th, 2013
Fluoropolymer technology and manufacturing company W.L. Gore & Associates has announced that it will debut its latest venting products and cooling filters for use by the telecommunications industry at the CTIA 2013 Mobile Marketplace in…read more
Dispensable Thermal Pads for Thermal Management in LED Lighting Applications
May 13th, 2013
Dow Corning, a developer of silicone-based technology, has announced new dispensable thermal pads developed for more cost-effective thermal management in LED lighting applications. Dow Corning’s new product line of dispensable thermal pads features four grades…read more
Liquid Cooling Option for Small and Medium Size IT Installations
May 13th, 2013
Rittal Corporation, a manufacturer of industrial enclosures, server racks, power distribution systems and data center cooling products, has released the Liquid Cooling Package Direct Expansion (LCP DX) cooling option. According to the company, the LCP…read more
Researchers Demonstrate Thermal Invisibility Cloak with Potential for More Effective Heat Management
May 13th, 2013
In recent years, scientists have developed the ability to manipulate light around an object through the use of man-made “metamaterials,” rendering the object seemingly invisible. Now, researchers from the Karlsruhe Institute of Technology (KIT) in…read more
Recent Posts
- New Method Uses Paper and Inkjet Printer to Create More Heat-Tolerant Carbon Electronics
- Two-Phase Evaporative Liquid Cooling Systems for Renewable Energy Power Conversion Systems
- New Finned Ceramic Heat Sinks Released
- New Tool Could Provide Better Understanding, Method for More Efficient Thermal Transfer
- Electronics Cooling June 2013 Issue Now Online
- Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat Rejection
- Quiet CPU Coolers for Intel Xeon Workstations and Servers
- Temperature Controller for Thermoelectric Modules and Supplemental Resistive Heaters
Latest Issue
Don’t miss out on
the June 2013 issue
of Electronics Cooling, which includes feature articles on Thermal Spreading and More Using Open-Source FEA Software; Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers, and more.
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