Inspired by expertise from the Aerospace Industry, Jaro’s new MR-16 LED coolers optimize longevity and temperature with a highly-efficient fluid-bearing structure. At speeds of up to 4200RPM±15%, these very quiet DC coolers provide a chilly,…read more
Company Launches New Energy Efficiency Center
January 17th, 2012
TÜV SÜD America Inc. has opened a new 30,000 square foot Energy Efficiency Center of Excellence located just north of Atlanta, Ga. The new NVLAP* 17025-accredited laboratory allows TÜV SÜD to test and certify products…read more
New Liquid-Cooled LED as Bright as 100W Bulb
January 17th, 2012
SWITCH Lighting’s™ SWITCH bulbs have a ring of metal prongs, each with a computer chip on it to emit light, which is immersed in liquid that fills each bulb. The liquid cools the chips while…read more
Lighting-Class LEDs Deliver Twice the Lumens-Per-Dollar
January 17th, 2012
Cree, Inc.’s new XLamp® XB-D LED delivers twice the lumens-per-dollar of other LEDs, in a small lighting-class footprint of 2.45 mm x 2.45 mm. The XB-D LED is 48 percent smaller than the XLamp XP…read more
Wireless Shortcut to Avoid Data Center Traffic Jams
January 17th, 2012
To better handle data center congestion, researchers are testing a shortcut that doesn’t involve costly rewiring. They are experimenting with wireless links, mounted atop the server racks, to supply extra bandwidth for moving data along…read more
Organic LED Lighting in European Dimensions
January 17th, 2012
Led by Philips Technologie GmbH in Germany, the OLED100.eu team has been working on OLEDs for the last three years. The aims and objectives of the study were to boost the luminous efficacy, strengthen the…read more
LED Design Case Study: Down Lighter Thermal Management with Simulation
January 9th, 2012
Future Facilities released a case study showing that its new CFD software for electronics cooling design, 6SigmaET solves the problem of how to shrink electronics devices that generate heat. The Future Facilities’ case study describes…read more
Companies Form Partnership to Launch Hybrid Electric Drive
January 9th, 2012
Quantum Fuel Systems Technologies Worldwide, Inc. and SBE, Inc. announced a technology partnership. As part of this partnership, SBE, Inc. is providing a novel integrated capacitor/bus structure design solution for Quantum power electronics for automotive…read more
GM to Stop Chevy Volt Battery Coolant Fires
January 9th, 2012
General Motors is going to modify its Chevrolet Volt plug-in car to eliminate the possibility that its batteries can catch on fire hours or days after a serious side-impact crash. It turns out that battery…read more
Self-Healing Electronics Could Work Longer, Reduce Waste
December 22nd, 2011
A team of University of Illinois engineers has developed a self-healing system that restores electrical conductivity to a cracked circuit in less time than it takes to blink. Led by aerospace engineering professor Scott White and materials science and engineering professor Nancy…read more
Thermal Modeling and Testing for LEDs and Luminaires
December 22nd, 2011
Mentor Graphics Corp. has introduced the T3Ster (“trister”) thermal transient tester for LEDs, board-level LED arrays and luminaires. Together with the company’s FloTHERM thermal simulation tool based on computational flow dynamics (CFD), lighting designers can…read more
Direct Current-Powered Data Center Module
December 12th, 2011
ABB and IO have agreed to partner in the development of a new data center module based on direct current (DC) power to meet increasing demand for DC data centers. DC-powered technology is being increasingly…read more
New Light-Cure Conformal Coating
December 12th, 2011
Ellsworth Adhesives and DYMAX Corporation are launching E-MAX 903-E, a new light-cure conformal coating. E-MAX 903-E will be distributed world-wide exclusively by Ellsworth Adhesives. It has been engineered to cure with UV and visible light…read more
Intelligent Control of Data Center Infrastructures
December 12th, 2011
IO is offering IO OS®, a data center operating system, as a stand-alone software product. Initially introduced in IO’s modular data center technology platform, IO Anywhere®, IO OS now provides IT and data center teams…read more
Recent Posts
- Bottlenecks and Interface Materials; Part 2 – When TIMs Go Bad
- Has Your Brand Image Been Hijacked?
- Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point
- Bottlenecks and Interface Materials; Part 1 – Great Thermal Bedfellows
- Mersen Acquires Laminated Busbar Company
- Coolers Utilize Aerospace Fluid-Bearing Technology
- Company Launches YouTube Channel for Engineers
- 40 GHz Bandwidth Socket for 16x16mm, 0.8mm Pitch BGA Packages
Latest Issue
Don’t miss out on
the December 2011 issue
of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Heat pipes for electronics cooling applications 6 comment(s)
- Notes on using thermocouples 4 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- All you need to know about fans 1 comment(s)
- ElectronicsCooling September 2011 Issue 0 comment(s)
- Company launches new energy efficiency center - read more - http://t.co/8pEdpS47 #
- Wireless shortcut avoids data center traffic jams - read more - http://t.co/4qh2RvIH #
- Lighting-class LEDs deliver twice the lumens-per-dollar - read more - http://t.co/QAypwTaz #
- The special TIMs issue of the eNewsletter will be delivered in 2 weeks. Subscribe today to receive your free copy! - http://t.co/uagtDzM7 #
