The 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2025) was held from October 28–30, 2025, at the Hotel Fera Anaheim, a DoubleTree by Hilton, in Anaheim, California. Hosted by the ASME Electronic and Photonic Packaging Division (EPPD), the conference served as a premier forum for advancing … [Read more...]
Introducing THERM-A-GAP GEL 120: Parker Chomerics’ Highest Performing Thermal Gap Filler Gel
As electronic applications become more sophisticated and higher performing, the need for thermal performance that can keep pace is increasing. Parker is excited to continue pushing the bar and helping their customers accelerate innovation with THERM-A-GAP GEL 120 which offers a game-changing thermal conductivity of 12.0 W/m-K. THERM-A-GAP GEL 120 is a one-component, … [Read more...]
Sheetak Solves Micro-Scale Hotspots with New µCENTUM™ Thermoelectric Coolers
High-power cooling in a sub-1.6mm profile provides critical thermal stability for high-density electronics. AUSTIN, TX - To solve the growing challenge of localized hotspots in high-density electronics, Sheetak Inc. has launched its µCENTUM™ series of micro-thermoelectric coolers (TECs). These compact solid-state devices deliver powerful, component-level cooling to uphold … [Read more...]
Sheetak Expands Thermoelectric Offering with New TEG Solutions for Energy Harvesting Applications
Solid-state power generation modules enable reliable, compact energy sources for remote and rugged environments. AUSTIN, TX – Sheetak Inc., a U.S.-based leader in thermoelectric innovation, is expanding its product line with a new range of thermoelectric generators (TEGs), offering reliable, solid-state energy harvesting for applications where conventional power sources fall … [Read more...]
Direct-Die Liquid Cooling: A Scalable Approach for Power Module Thermal Integration
Abstract This paper presents a novel thermal management approach for power semiconductor modules by integrating active liquid cooling directly into the substrate. Utilizing Direct Bond Copper (DBC) structures embedded within liquid cold plates, the method minimizes thermal interfaces, improves power density, and ensures better reliability. It contrasts traditional … [Read more...]
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