Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as…read more
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
May 1st, 1998
Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal…read more
Thermal management of outdoor enclosures using phase change materials
January 1st, 1998
Telephone equipment has traditionally been housed in large buildings, sheds and outdoor cabinets. The cooling of these facilities has been carried out using traditional methods. However, in many of the new systems being developed and…read more
Thermal management of telecommunications cabinets
September 1st, 1997
Figure 1. Thermal analog model of an OSP enclosure Introduction Over the past twenty years, telecommunications electronics have become increasingly decentralized – moving ever furtherfrom the controlled and protected environment of the Central Office intothe…read more
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