Volume 11

Advances In High-Performance Cooling For Electronics

November 1st, 2005

Introduction The need for new cooling techniques is driven by the continuing increases in power dissipation of electronic parts and systems. In many instances standard techniques cannot achieve the required cooling performance due to physical…read more

Cooling Solutions In The Past Decade

November 1st, 2005

Introduction In 1995, a typical thermal design engineer was aware that removing heat was not going to get any easier in the next few years. A look back at the past ten years reveals that…read more

GCS Theory Applied to Thermal Interface Materials

November 1st, 2005

There are 819 kinds of Thermal Interface Material (TIM) – those greases, putties, pads and phase change compounds that go between hot electronic components and their heat sinks – and just as many ways to…read more

A Funny Thing Happened On The Way To The Heatsink

August 1st, 2005

Introduction When faced with the task of calculating the temperature of an IC in a package, which has an external heat sink mounted to it, a thermal engineer usually obtains a values of three thermal…read more

High Powered Chip Cooling — Air and Beyond

August 1st, 2005

Introduction Over the past few years many people in the electronics industry have become concerned with the increases in heat density at both the chip and module level of packaging. This trend is not new…read more

Latest Developments In Thermoelectrically Enhanced Heat Sinks

August 1st, 2005

Nomenclature Q Heat load (W) COP Coefficient of Performance I Electrical current (Amps) T Temperature (°C) R Electrical resistance (Ohms) Z TE Figure of Merit (1/K) where Z = α2 / (ρ λ)    …read more

Liquid Cooling is Back

August 1st, 2005

Introduction IBM announced its return to water cooling on April 19, 2005 with the introduction of a water cooled heat exchanger mounted to the back cover of a 19 inch rack. This is the first…read more

Metals For Thin Wires – Criteria Of Choice

August 1st, 2005

When a designer has to deal with thin current-carrying wires, a number of thermal issues pop up: Joule heating, heat losses and temperature measurement. For standard lead wires, one usually wants minimal Joule heating and…read more

Vibration Analysis For Electronic Equipment

August 1st, 2005

This topic is rather esoteric and usually an afterthought in commercial and industrial applications. In military and defense electronics, it is one of the major drivers for design and product architecture early on in the…read more

Design of Experiments for Numerical Parameter Studies of Electronic Systems: Optimizing the Cooling Strategy of an Ethernet Switch

May 1st, 2005

Introduction As electronic products become more sophisticated and design margins tighten, defining the thermal management strategy early in the design cycle is vital to ensure a cost-effective design for the level of heat dissipation. Optimizing…read more

Phase Change Material Thermal Properties

May 1st, 2005

Table 1. General Solid-Liquid PCM Characteristics [1] When electronics are operated under transient conditions, increasing the thermal capacitance is a useful technique for limiting temperature increases and/or minimizing the performance requirements of a heat sink.…read more

Review of Low Profile Cold Plate Technology for High Density Servers

May 1st, 2005

Introduction Water cooling of computers was introduced more than twenty years ago, but had disappeared from the mainstream by the mid 1990s. The conversion of chip technology from bipolar to CMOS (complementary metal oxide semiconductor)…read more

Threatened With a Pipe

May 1st, 2005

I have become a Heel Dragger. When natural convection was all the rage, I was touting fans. Once fan cooling became the status quo, I started dropping hints about heat pipes and thermoelectric coolers. The…read more

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Using an Equivalent Heat Transfer Coefficient to Model Fins on a Fin

May 1st, 2005

Many readers of ElectronicsCooling are probably familiar with the use of fin efficiency formulas to estimate the thermal resistance of the commonly used parallel plate fin heat sink. Given the heat transfer coefficient, h, acting…read more