News

Thermal Innovations Win Award and Industry Recognition

April 25th, 2016

(April 19th, 2016) Henkel’s Adhesive Technologies recently won two NPI Awards presented at last month’s APEX event in Las Vegas, as reported by EMCNow.com. According to EMCNow.com, Henkel had its third consecutive win in the…read more

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Metal Inverse Opals Could Better Cool Electronics

April 18th, 2016

(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal…read more

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New Approach to Simulate Nanoscale Thermoelectric Materials

April 18th, 2016

(April 7th, 2016) A research group led by Joe Feser, assistant professor in the Department of Mechanical Engineering at the University of Delaware, has developed a new approach to simulating nanoscale heat transfer in materials,…read more

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Small EHD Pump Solution May Cool Space Hardware

April 18th, 2016

(April 13th, 2016) Michal Talmor, a Ph.D. candidate in mechanical engineering at the Worcester Polytechnic Institute (WPI) in Worcester, Massachusetts, is focused on bringing electrohydrodynamic (EHD)-based thermal control to space exploration devices. Now in the…read more

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World’s Thinnest Laptop Runs on ‘Hyperbaric’ Cooling

April 11th, 2016

HP has recently released the world’s thinnest laptop – the Spectre 13.3” notebook, which cools its CPUs with what HP calls ‘hyperbaric cooling technology’. This system features two ultra-thin fans, a heat-pipe, and a special…read more

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Electrocaloric Polymers That Create On-Demand Cooling

April 11th, 2016

A team of researchers from Pennsylvania State University have recently developed a blend of ferroelectric polymers that could cool chips and small scale systems on demand. According to NewElectronics these are called electrocaloric materials, and…read more

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Formula Developed for Heat Transfer Between Near-Field Bodies

April 11th, 2016

Alejandro Rodriguez, a researcher at Princeton, and colleagues at the Massachusetts Institute of Technology have come up with a formula that describes the maximum heat transfer between near-field objects in a recent study. Phys.org claimed…read more

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New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

April 4th, 2016

The US Army has awarded GE Aviation with a contract to develop silicon carbide-based power electronics that will allow high-voltage, next-generation ground vehicles to operate at higher temperatures. “The US Army’s implementation of [this technology…read more

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Overheating Causes 911 System Failure

April 4th, 2016

Due to a problem with the computer cooling system, 911 service was down for about four hours recently in Buffalo, New York’s Erie County. According to Time Warner Cable News, the room at the Public…read more

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Smart Clothing That Automatically Cools Itself

April 4th, 2016

VTT Technical Research Centre of Finland Ltd has recently developed a technology that can be utilized in smart fabrics and clothing to cool or warm the wearer according to his or her needs as part…read more

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Diamonds May Take Silicon’s Place in Future Smartphones

March 28th, 2016

A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Design, Design, Heat Sinks, News, Power, Research, Semiconductor | Comments Off on Diamonds May Take Silicon’s Place in Future Smartphones

New Particle Creates Less Heat, Saves Energy

March 28th, 2016

Researchers have discovered a new particle that doesn’t consume a lot of energy, and thus doesn’t require an elaborate cooling system. It is called the Weyl fermion, a particle that only exists inside materials and…read more

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Study Shows LED Lighting Helps Grow Edible Plants for Space Missions

March 28th, 2016

The University of Arizona Controlled Environment Agriculture Center (CEAC) and Phillips Lighting have conducted a recent study to find that placing LED lighting in a lunar greenhouse prototype increases the amount of high-quality, edible lettuce…read more

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Overcoming Cooling Challenges Downloadable Webinar Now Available

March 21st, 2016

The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat…read more

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