News

Researchers Successfully Measure Thermoelectric Behavior for the First Time

June 9th, 2015

A team from Sandia National Laboratories has made the first measurement of thermoelectric behavior via nanoporous metal-organic framework (MOF). This discovery could produce a new class of materials in the future that would improve upon…read more

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Qualcomm Refutes Overheating Rumors

June 2nd, 2015

In March 2015, Sony’s Xperia Z4 reportedly experienced overheating issues in the Snapdragon 810 processor inside the device.  (Read original article here). The issue began when ArsTechnica tested and confirmed that the Snapdragon 808 runs…read more

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Largest Data Center in Asia to be Completed in July 2015

June 2nd, 2015

LG U+, a telecommunications company in Gyeonggi, South Korea, announced its mega data center will be completed in Pyeongchon in July 2015. When completed, it will be the largest data center in Asia and the…read more

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Optical Transport Could Replace Wires in Computers

June 2nd, 2015

An article published in Nature Photonics announces a breakthrough in creating faster and more efficient computers. Instead of using wires/electricity to send data back and forth in computers, the Stanford team, including electrical engineer Jelena…read more

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165-Year-Old Principle Applied to New Applications – New Measurement Method Discovered

May 26th, 2015

The Technology Partnership (TTP), a European company, introduces a new non-contact way to measure high temperatures that other products or methods cannot reach. This discovery can be beneficial in aircraft engines, braking systems, food processing,…read more

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New Technology Improves Heat Dissipation Performance

May 26th, 2015

OKI Circuit Technology in Japan has developed a mass-production technology for multi-layer copper-coin printed circuit boards that supports high speeds and high frequencies. The technology is a T-Coin (Technology of copper coin insert) structure that…read more

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Doctoral Candidate’s Research Could Improve Efficiency of Data Centers

May 26th, 2015

Husam Alissa, a Binghamton University doctoral candidate in mechanical engineering, has been working to improve the efficiency of data centers at the university’s Center for Energy-Smart Electronic Systems (ES2). Alissa’s work focuses on reducing overheating,…read more

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Electronics Cooling June 2015 Issue Now Online

May 19th, 2015

Don’t miss out on the June 2015 issue of Electronics Cooling, which includes feature articles on Data Center Energy Savings; Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense; Application of Low…read more

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Report: Images on Forum Show How Liquid Cooling is Incorporated into New Products

May 12th, 2015

Three images have appeared on an Asian video card forum named Chiphell of new AMD Fiji GPUs, showcasing compact PCBs pre-fitted with a liquid-cooling heatsink and loop connectors. It has not yet been determined if…read more

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Chinese Company Creates Data Center Tech Advances

May 12th, 2015

Shanghai Data Solution, a company owned by the Chinese government, says it is making large strides in the data center industry. “Shanghai Data Solution (SDS) built its first small network communications site in 2001, and…read more

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UPenn Physicists Discover New Material that May Cool Computers

May 5th, 2015

Heat emitted from computers, laptops and other electronic devices during use is regularly caused by numerous transistors overcrowded in the devices. This also expels large amounts of wasted heat energy. A pair of physicists from…read more

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Cooling System for Computer Processors Could Save Consumers Billions

May 5th, 2015

A patented passive cooling system for computer processors could save U.S. consumers more than 6.3 billion dollars in electricity costs per year. The system is currently being manufactured at the University of Alabama in Huntsville…read more

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Trio of Companies to Improve Graphite Thermal Management Products

April 27th, 2015

Three Canadian companies, Terrella Energy Systems, Alpha Technologies, and Westport Innovations, have partnered up to improve low-cost graphite thermal management products. The companies have partnered with researchers at Simon Fraser University and Ontario’s Sheridan College…read more

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Company Brings Liquid Cooling Technology to Smartphones

April 27th, 2015

Reducing size of liquid cooling systems has been a challenge for companies in the electronics cooling industry for many years.  Fujitsu introduces a 1mm thick liquid cooling heat pipe for compact electronic devices such as…read more

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