Researchers at the Massachusetts Institute of Technology (MIT) and Rutgers University have developed a new method of enhancing the efficiency of thermoelectric devices using embedded nanoparticles, structures created by embedding one material into another. The…read more
New Report on Global Thermal Management Technologies Market Released
February 7th, 2013
Market forecasting company BCC Research has released a new report, titled “The Market for Thermal Management Technologies.” The report covers a period of seven years between 2011 and 2017 and predicts that the thermal management…read more
GE Announces Dual Piezoelectric Cooling Jet Manufacturing Partnership
February 7th, 2013
General Electric has announced a partnership with semiconductor company Texas Instruments to manufacture the company’s dual piezoelectric cooling jet technology first unveiled in December 2012. According to General Electric, the dual piezoelectric cooling jet technology…read more
Laser Cooling Method is “One Step Closer” to Smaller Medical Devices, “Self-Cooling” Computer Chips
February 5th, 2013
Scientists from Nanyang Technological University (NTU) in Singapore have developed a new laser cooling method that could replace extreme refrigerant-based cooling systems in medical devices and satellite cameras and help develop futuristic computer chips capable…read more
Cryogenic Cooler Experiment May Lead to More Affordable and Reliable Version for Cooling Electronics
January 18th, 2013
Scientists from the University of Twente in Enschede, The Netherlands have constructed a micro-sized Joule-Thomson (JT) cryogenic cooler, in an effort to help develop a more affordable and reliable version for cooling electronics. According to…read more
Company Acquires Exclusive Licensing Rights for Electric Vehicle Heat Dissipation Process
January 18th, 2013
Electric Moto Corporation, Inc. (EMOT), a developer and manufacturer of zero-emission vehicles and related products, has announced it has acquired exclusive licensing rights for a patented heat dissipation process in electric vehicles. The patent for…read more
Researchers to Examine Heat Dissipation in Three-Dimensional Integrated Circuits
January 18th, 2013
A team of UT Arlington researchers funded by the National Science Foundation has been formed to examine potential solutions for heat minimization and dissipation in three-dimensional integrated circuits. According to Ankur Jain, assistant professor of…read more
Data Center Project Inspired by Science Fiction
January 17th, 2013
A new Swedish data center in the process of being constructed has been modeled to look like a space station from Star Trek. Designed by John Karlung, the CEO and founder of Swedish ISP and…read more
Ford Assigned Patent for Hybrid Electric Vehicle Thermal Management System
January 4th, 2013
Ford Global Technologies, a wholly-owned subsidiary of Ford Motor Company, has been assigned patent No. 8,246,422 for a “hybrid electric vehicle thermal management system.” According to the abstract of the patent published by the U.S.…read more
Wind Tunnel-Cooled Computer May Help Cure Cancer
January 4th, 2013
Blogger Mike Schropp of “Total Geekdom” recently revealed the construction of his new wind tunnel-cooled computer. Designed for grid computing, Schropp’s new computer is part of the IBM’s World Community Grid, which combines a worldwide…read more
U.S. LED Lighting Manufacturer Develops Industry’s First Extruded Heat Sink “of its Kind”
January 3rd, 2013
A U.S. supplier and manufacturer of LED lighting, LED Waves, has announced that as of December 2012, the company’s LED high bay light will be equipped with “the only extruded heat sink of its kind…read more
New Thermal Management “Centers of Excellence” Optimal for Heat Sink Production
December 31st, 2012
Thermal management solutions company Sapa Extrusions North America has created two thermal management “centers of excellence” at the company’s Mountain Top, Pa. and City of Industry, Calif. locations. According to the company, the “center of…read more
Research Strengthens Knowledge of Electron Cooling Behavior in Graphene
December 19th, 2012
A research team supported by the Kavli Institute at Cornell for Nanoscale Science has released the first known direct measurements of hot electrons cooling down in graphene, in an effort to answer questions about the…read more
Patent Granted for Aircraft Liquid Cooling Apparatus
December 19th, 2012
The United States Patent and Trademark Office has granted patent no. 8,315,053, titled “Aircraft Electronics Cooling Apparatus for an Aircraft Having a Liquid Cooling System,” to Airbus Operations GmbH. According to the abstract released by…read more
Recent Posts
- SEMI-THERM Presents Executive Briefing
- Low-Viscosity Thermally Conductive Silicone Compound
- General Purpose Thermoreflectance Analyzer Released
- Measured Thermal Resistance of Microbumps in 3D Chip Stacks
- Measuring and Predicting Junction Temperature: Thermal Factors Influencing Reliability in GaN HEMTs
- APEC 2013: Applied Power Electronics Conference and Exhibition
- Acquisition of R.O.C. Fan Design and Manufacturing Company Adds New Blowers and Fans to Global Thermal Management Product Line
- Modular Cooling System Designed for Rapid Deployment with Containerized Data Centers
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