A provision on “conflict minerals” that was slipped into a 2010 financial reform law, the Dodd-Frank Act, will help educate American consumers on what is in their smart phones, computers and other electronics and where…read more
Heat Exchange Institute Releases Standards for Air Cooled Condensers
December 12th, 2011
The Heat Exchange Institute (HEI) has released the first edition of Standards for Air Cooled Condensers. The Standard offers technical information from the combined expertise of the members of the HEI Air Cooled Condenser Section…read more
ElectronicsCooling December 2011 Issue
December 1st, 2011
Don’t miss out on the December 2011 issue of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization as well as technical briefs. If you would…read more
Guidelines for Reporting and Using Electronic Package Thermal Information
November 22nd, 2011
This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between…read more
Thermal Conductivity Test Board for Leaded Surface Mount Packages Standard
November 8th, 2011
This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the…read more
Electrical Insulation Systems Standard
October 25th, 2011
IEC/TS 62332-1:2011(E) is applicable to EIS containing solid and liquid components where the thermal stress is the dominant ageing factor, without restriction to voltage class. This part specifies a dual-temperature test procedure for the thermal…read more
Standard Test Method for Pressure Calibration of Thermal Analyzers
October 11th, 2011
This test method describes the calibration or performance confirmation of the electronic pressure signals from thermal analysis apparatus. The values stated in SI units are to be regarded as standard. No other units of measurement…read more
Electrical Insulation Systems Standard
September 27th, 2011
IEC/TS 62332-1:2011(E) is applicable to EIS containing solid and liquid components where the thermal stress is the dominant ageing factor, without restriction to voltage class. This part specifies a dual-temperature test procedure for the thermal…read more
IEC Releases Transformers Standard for Wind Turbine Applications
September 12th, 2011
IEC 60076-16:2011 applies to dry-type and liquid-immersed transformers for rated power 100 kVA up to 10 000 kVA for wind turbine applications having a winding with highest voltage for equipment up to and including 36…read more
IEC Releases Thermal Management Standard
August 22nd, 2011
IEC/TS 62610-2:2011 provides for compatible methods of forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with IEC 60297 and IEC 60917 series. This design guide contains the following: Thermal interfaces of…read more
IEC Releases Photovoltaic Pumping Systems Standard
August 5th, 2011
IEC 62253:2011 defines the requirements for design, qualification and performance measurements of photovoltaic (PV) pumping systems in stand-alone operation. The outlined measurements are applicable for either indoor tests with PV generator simulator or outdoor tests…read more
Standard Test Method for Pressure Calibration of Thermal Analyzers
July 22nd, 2011
This test method, ASTM E2744-10, describes the calibration or performance confirmation of the electronic pressure signals from thermal analysis apparatus. The values stated in SI units are to be regarded as standard. No other units…read more
New Thermal Testing Standard
April 8th, 2011
JEDEC has approved a thermal transient testing-based measurement methodology inspired by an original idea published jointly by Mentor Graphics Corporation’s MicReD® group and the Automotive Power Application group of Infineon in 2005. This newly published…read more
Evaluation Method for Thermoelectrical Cooling Systems
April 27th, 2010
IEC/TS 62610-3 ed1.0 — Mechanical structures for electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series – Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier…read more
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