Technical Brief

Novel Heat Pipe Based Thermal Solutions for Cooling Optical Plug Modules

December 2nd, 2014

Due to rise in both data speed and traffic volume through computers, tablets, and mobile devices, network bandwidth must be continually increased to keep up with the demand. Fiber optic cable is used for high-speed,…read more

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Metal Foam-PCM: Heat Storage Technology: The Thermal Charging Scenario

June 21st, 2012

For optimal operation of electronics, the generated heat must be removed and hot spots must be mitigated. If the junction temperature increases above a specified limit, some electronic components may fail, or experience a decline…read more

Ionic Winds: A New Frontier for Air Cooling

March 13th, 2012

AIR-COOLING IS THE oldest and, in many ways, the easiest method of cooling electronics, whether it be through fan-driven forced convection or simply natural convection. However, with the increasing speed of processors, shrinking of form…read more

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Technical Brief: Design Considerations for High Performance Processor Liquid Cooled Cold Plates

December 22nd, 2011

The meteoric rise in cooling requirements of commercial computer products has been driven by an exponential increase in microprocessor performance over the last decade. The conventional way to cool microprocessors has been to utilize air…read more

ElectronicsCooling December 2011 Issue

December 1st, 2011

Don’t miss out on the December 2011 issue of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization as well as technical briefs. If you would…read more

Electromagnetic, Thermal, Stress and Deformation Analysis of a Space-Based Satellite Dish Antenna

December 28th, 2010

This paper presents a multiphysics analysis of a space-based communication satellite antenna. Electromagnetic losses due to induced high-frequency surface currents lead to partial, asymmetric heating of the structure, causing stress and deformation. A final electromagnetic…read more

ElectronicsCooling Winter 2010 Issue

December 6th, 2010

Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical…read more

technical brief: thermal bottlenecks and shortcut opportunities; innovations in electronics thermal design simulation

September 13th, 2010

Introduction Cooling an electronics system involves transferring heat from various heat sources to the outside ambient. Thermal simulation software provides practitioners with predictions of the temperature and heat flux distributions in and around the system,…read more

integrating vapor chambers into thermal solutions

April 30th, 2010

  Introduction   Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that…read more

Lowering a Notebook CPU Temperature Using a Dual-Tunnel Blower

August 1st, 2009

Figure 1. Side by side comparison of blower technologies. Introduction Notebook computers on the market today may be classified in three categories. In the first category are the super slim and powerful notebooks such as…read more

Small Fans for Cooling Small Electronic Devices

May 1st, 2009

Small Fans for Cooling Small Electronic Devices Masaharu Miyahara, Sunonwealth Electronic Machine Industry Co., Ltd. The growing portable device market boosts the development of small electric devices, such as Ultra Mobile PC, Pico projector, Smart…read more

Advanced Aerodynamics for Electronics Cooling Fans

February 1st, 2009

Introduction The performance of electronics cooling fans has been steadily increasing as flow requirements chase higher thermal loading. These advances have been primarily achieved through mechanical and architecture changes. However, the aerodynamic sophistication of these…read more

Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management

November 1st, 2008

Introduction Due to the increasing power density in today’s industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and…read more

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Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks

August 1st, 2008

Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or…read more