Don’t miss out on the December 2011 issue of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization as well as technical briefs. If you would…read more
Technical Brief: Design Considerations for High Performance Processor Liquid Cooled Cold Plates
November 22nd, 2011
The meteoric rise in cooling requirements of commercial computer products has been driven by an exponential increase in microprocessor performance over the last decade. The conventional way to cool microprocessors has been to utilize air…read more
Electromagnetic, Thermal, Stress and Deformation Analysis of a Space-Based Satellite Dish Antenna
December 28th, 2010
This paper presents a multiphysics analysis of a space-based communication satellite antenna. Electromagnetic losses due to induced high-frequency surface currents lead to partial, asymmetric heating of the structure, causing stress and deformation. A final electromagnetic…read more
ElectronicsCooling Winter 2010 Issue
December 6th, 2010
Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical…read more
technical brief: thermal bottlenecks and shortcut opportunities; innovations in electronics thermal design simulation
September 13th, 2010
Introduction Cooling an electronics system involves transferring heat from various heat sources to the outside ambient. Thermal simulation software provides practitioners with predictions of the temperature and heat flux distributions in and around the system,…read more
integrating vapor chambers into thermal solutions
April 30th, 2010
Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that…read more
Lowering a Notebook CPU Temperature Using a Dual-Tunnel Blower
August 1st, 2009
Figure 1. Side by side comparison of blower technologies. Introduction Notebook computers on the market today may be classified in three categories. In the first category are the super slim and powerful notebooks such as…read more
Small Fans for Cooling Small Electronic Devices
May 1st, 2009
Small Fans for Cooling Small Electronic Devices Masaharu Miyahara, Sunonwealth Electronic Machine Industry Co., Ltd. The growing portable device market boosts the development of small electric devices, such as Ultra Mobile PC, Pico projector, Smart…read more
Advanced Aerodynamics for Electronics Cooling Fans
February 1st, 2009
Introduction The performance of electronics cooling fans has been steadily increasing as flow requirements chase higher thermal loading. These advances have been primarily achieved through mechanical and architecture changes. However, the aerodynamic sophistication of these…read more
Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management
November 1st, 2008
Introduction Due to the increasing power density in today’s industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and…read more
Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks
August 1st, 2008
Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or…read more
2U Rack Mountable Vapor Compression Cooling System For High Power Electronics
May 1st, 2008
Vapor compression refrigeration has long been used to cool telecommunications equipment and some high performance computers. On the whole, however, its usage has been confined to high-value, relatively large, and stationary applications. The advantages of…read more
Thermo-Reflectance Thermography For Submicron Temperature Measurements
February 1st, 2008
The primary approach to maintaining the aggressive progress in the microelectronics industry has been to increase the density of elementary transistors and to reduce the size of their active areas. As a result, the removal…read more
Electronics Cooling At Higher Pressures … a Positive Displacement Pump Solution
November 1st, 2007
Introduction Many liquid cooling solutions in use today employ cooling system devices that result in system pressure drops limited to <0.5 bar (7.25 psi), which allows these systems to fit within the limits of centrifugal…read more
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