Introduction Many liquid cooling solutions in use today employ cooling system devices that result in system pressure drops limited to <0.5 bar (7.25 psi), which allows these systems to fit within the limits of centrifugal…read more
Moisture permeation in electronics
May 1st, 2007
Environmental control for electronic packages and enclosures often involves understanding and managing moisture concentration. Excessive moisture combined with processing temperatures can cause damage. High humidity levels have other potentially harmful effects such as corrosion. Since…read more
Adhesion of thermal interface materials for cpu heatsinks, an overlooked issue
February 1st, 2007
Figure 1. Test joint break load for a range of TIM types. Note that, by definition, PCMs go through a solid/liquid transition above the melting temperature (Tmelt). In the solid phase, PCMs, typically wax-based, show…read more
Effect Of Improved Thermoelectric Zts On Electronic Module Coolability
November 1st, 2006
In recent years there has been a growing interest in the application of thermoelectrics to electronics cooling. Attention has been focused on thermoelectric cooling both as a possible means to enhance module cooling and to…read more
Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective
August 1st, 2006
In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the…read more
Direct Die Attach Using a Room Temperature Soldering Process
May 1st, 2006
As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has increased [2]. The largest contributor to the total thermal resistance…read more
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
February 1st, 2006
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today’s electronics. In these design situations, the proven method of analytical calculations,…read more
Vibration Analysis For Electronic Equipment
August 1st, 2005
This topic is rather esoteric and usually an afterthought in commercial and industrial applications. In military and defense electronics, it is one of the major drivers for design and product architecture early on in the…read more
"Revolutionary" New Thermal Management Materials
May 1st, 2005
Editors tend to frown on use of “revolutionary” in technical papers. However, advances in thermal management material properties in the last few years clearly warrant this word. There are now over a dozen materials with…read more
Solve Thermal Issues Earlier in Updated Board Designs
February 1st, 2005
Introduction Often new products or product concepts only introduce some new aspects and rely heavily on existing designs. At the board level this often means only one section of a board is retooled or upgraded;…read more
Heat Transfer Enhancement By Using Nanofluids For Cooling Of High Heat Output Microprocessor
November 1st, 2004
It is well known that the thermal properties of heating or cooling fluids play a major role in the development of energy-efficient heat transfer equipment. However, conventional heat transfer fluids such as water, ethylene glycol…read more
Keep Cool by Sensing Current to Control Fans
August 1st, 2004
Control of cooling fans has become increasingly popular as efforts are made to reduce system power consumption and mechanical fan noise. The purpose of including a fan is to reduce temperature and keep it as…read more
The Benefits Of Using Hadiabatic In Thinking About Electronics Cooling
February 1st, 2004
The heat transfer coefficient is used to describe convective heat transfer between a solid and a fluid, as in Equation (1). The heat transfer coefficient is a defined parameter, not a physical property like thermal…read more
Prediction of Thermal Contact Resistance
November 1st, 2003
All engineering surfaces exhibit some level of microscopic roughness. The resistance to heat flow through a contact interface occurs because only a small portion (usually 1-2%) [1] of the nominal surface area is actually in…read more
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