Technical Data

ElectronicsCooling Winter 2010 Issue

December 6th, 2010

Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical…read more

Technical Data Summary

August 1st, 2009

ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common…read more

Thermal Conductivity of Filled Plastics

May 1st, 2009

Compared to other solid materials, metals are widely known for their superior heat transfer capabilities. However, these capabilities come at the cost of weight, coefficient of thermal expansion (CTE) mismatch and freedom of design due…read more

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Antifreeze Coolants

February 1st, 2009

Removing waste heat from electronic assemblies using a circulating liquid coolant is a common and effective method with a long and successful history, especially in avionics and data center applications. The choice of coolant depends…read more

Emissivity in Practical Numerical Modeling

November 1st, 2008

In the August 2003 issue, the Technical Data column was devoted to emissivity in practical temperature measurements. But what about the emissivity value that should be entered in your numerical model? Can we use the…read more

Heat of Vaporization

August 1st, 2008

Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data…read more

Thermal Conductivity Of Liquid Metals

May 1st, 2008

This column deals with the thermal conductivity and melting points of liquid metals. Thinking about liquid metals, many people associate them with high temperatures. It is not widely known that some metallic alloys are liquid…read more

Thermal Properties Of Building Materials

February 1st, 2008

Previous Technical Data columns have covered thermal properties for many of the materials that are common to electronics packaging. The Technical Data for this issue is broader in scope and addresses common building materials, some…read more

Thermal Effusivity

November 1st, 2007

The Technical Data column of the previous issue discussed the concept of thermal diffusivity. It makes sense to discuss in this issue a related topic: thermal effusivity. While thermal diffusivity, a, is defined as the…read more

Thermal Diffusivity

August 1st, 2007

Thermal diffusivity is a measure of the transient thermal response of a material to a change in temperature and the term thermal diffusivity (α) is defined asα= k/(ρ x cp) where αis the thermal diffusivity…read more

About viscosity

May 1st, 2007

Table 1. Dynamic Viscosity Values for Various Gases and Liquids When we look at a fluid parcel subject to a velocity gradient in the direction perpendicular to the direction of the flow, we observe that…read more

Thermal conductivity of common alloys in electronics packaging

February 1st, 2007

Thermal conductivity of common alloys in electronics packaging Jim Wilson, Associate Technical Editor   Property Thermal Conductivity (W/mK) @25°C CTE (ppm/°C) @25°C Copper 395 17.1 Aluminum 200 23.5 CuMo 160-185 7.0-9.0 CuW 180-220 6.5-8.5 Kovar…read more

The Seebeck Coefficient

November 1st, 2006

In this issue, we address the Seebeck coefficient, a property that determines the performance of thermocouples and Peltier elements. Basically, the Seebeck coefficient is related to the fact that electrons are both carriers of electricity…read more

Thermal Conductivity of Solders

August 1st, 2006

Soldering has been a primary method of establishing mechanical and electrical connections in electronics for many years and will likely be used in this fashion in the future. While there are several physical properties and…read more