Technical Data

Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon

May 1st, 2006

Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May ’98), SiO2 (Aug ’04) and III-V semiconductors (Feb ’06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1.…read more

Thermal Conductivity of III-V Semiconductors

February 1st, 2006

Silicon dominates the electronics industry as the semiconductor of choice for most applications, but some electrical functions require electronic properties different from those of silicon. A grouping of semiconductors termed “III-V” have desirable electrical properties…read more

Metals For Thin Wires – Criteria Of Choice

August 1st, 2005

When a designer has to deal with thin current-carrying wires, a number of thermal issues pop up: Joule heating, heat losses and temperature measurement. For standard lead wires, one usually wants minimal Joule heating and…read more

Phase Change Material Thermal Properties

May 1st, 2005

Table 1. General Solid-Liquid PCM Characteristics [1] When electronics are operated under transient conditions, increasing the thermal capacitance is a useful technique for limiting temperature increases and/or minimizing the performance requirements of a heat sink.…read more

Seven Years Of Technical Data: An Overview

November 1st, 2004

The first 1997 issue of ElectronicsCooling started with a Technical Data column, the first of a still continuing series of columns devoted to data that are of interest to thermal designers. In the author’s opinion,…read more

The Thermal Conductivity of Silicon Dioxide

August 1st, 2004

Silicon dioxide (SiO2) is one of the most common and also one of the most important materials in the world as it is the basis for our windows, beaches and wine glasses. It is also…read more

Surface Flatness

May 1st, 2004

Surface flatness is an important issue for thermal designers as it is directly related to thermal contact resistance between surfaces. In this column, the definitions of surface flatness related parameters are discussed. These definitions are…read more

The Thermal Conductivity of Moist Air

November 1st, 2003

In the Tech Data series on thermal conductivity, gases – especially air – have been the subject of a few contributions. So far, the influence of two important parameters has been covered: temperature and pressure.…read more

E missivity in Practical Temperature Measurements

August 1st, 2003

When making temperature measurements with infrared cameras and point detectors, we are always facing the question of the emissivity of our sample. In practice we would like to have a single number set in the…read more

Thermal Capacitance

May 1st, 2003

When time enters the equations, the ability of a material to store or release heat becomes a crucial parameter. This issue’s technical data column is devoted to a basic understanding of thermal capacitance. Thermal capacity…read more

Glass: A Group Of Familiar Materials With Varying Properties

February 1st, 2003

The knowledge to manufacture glass products is already 4500 – 5000 years old, and glass in its different compounds is one of the most commonly used man-made materials. The material technical definition of glass is…read more

The Thermal Conductivity of Air at Reduced Pressures and Length Scales

November 1st, 2002

In several earlier issues of ElectronicsCooling, I discussed the thermal conductivity of air as a function of temperature and pressure. Therein, it was stated that the temperature dependence cannot be neglected, but that the pressure…read more

Pyrolytic graphite – thermal performance by structure

August 1st, 2002

Continuing our discussion of different forms of carbon, this column addresses the topic of pyrolytic graphite, a material that opens up many interesting applications not only for cooling but also for scientific measurement equipment. Pyrolytic…read more

The Thermal Conductivity of Thermal Insulators

May 1st, 2002

This issue, we present an overview of a number of materials that are often used as thermal insulators. The world would have been much easier for thermal engineers if only the creator had provided us…read more