Comments for Electronics Cooling Magazine - Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

Comment on On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages by Jim Corzoni

Jim Corzoni — Tue, 31 Jan 2012 20:43:24 +0000

Although this paper provides some useful insight to die measurement techniques, It would be better that you give the thermal resistances of the external elements like the heatsink, bonding method… etc. I am trying to figure out the thermal resistance of the die to the die’s mounting surface to see the limits on packaging.

Comment on A simple method to estimate heat sink air flow bypass by MEHBOOB ALI

MEHBOOB ALI — Fri, 20 Jan 2012 04:12:02 +0000

Dear Sir/Madam,
I want to know that How can i Check the heat sink in simple way?

Comment on LED Lighting Modules for High Heat Applications by Sharron Jourdan

Sharron Jourdan — Mon, 09 Jan 2012 23:22:56 +0000

Hello, I work for the Rail Road and I am seeing a lot more of LESs used on the locomotives. This makes me very happy as I am an electrican working on these units. what we really need is a LED bulb that can withstand high heat as we have lighting in the engine compartments. If you are interested in this endevor please contact me.

Comment on Heat pipes for electronics cooling applications by jorge

jorge — Sun, 08 Jan 2012 23:52:44 +0000

Hello

i have one question for heat pipe

is it posible to manufacture a heat pipe with a pipe with to make a close loop between condensor and evaporator ?

Thanks

Comment on Advances In High-Performance Cooling For Electronics by George Meyer

George Meyer — Thu, 15 Dec 2011 04:07:05 +0000

Great article! One common misconception is the effective thermal conductivities of heat pipes. These numbers are often overstated. In typical electronics cooling designs the numbers often run from about 1500 W/mK to 30,000 W/mK with the higher numbers in applications where the heat is moved some distance to a remote heat exchanger. Yes, there are examples out there with numbers in the 50,000 to 200,000 W/mK range but they are the exception.

Comment on Future trends in heat sink design by berty

berty — Tue, 13 Dec 2011 10:31:31 +0000

great work thanks for the info could of said wht PPM and K stands for in the table

Comment on Advances In High-Performance Cooling For Electronics by Mani Subramanian

Mani Subramanian — Thu, 08 Dec 2011 22:10:19 +0000

Excellent and very comprehensive review. Thanks for publishing this article. A good educational resource.

Comment on Yale Engineers Invent Magnetic Fluid Pump with No Moving Parts by Niraj Bhargava

Niraj Bhargava — Fri, 02 Dec 2011 04:09:34 +0000

This magnetic pump uses a ferroliquid. The availability of this liquid and disintegration after heating may cause effects in the plumbing material. Secondly the application of this liquid in the low temp is doubtful.

Comment on BMW Liquid Cooled Commuter Scooter by 150ccscooter

150ccscooter — Fri, 25 Nov 2011 06:58:38 +0000

Ooh it so nice for design I love it.

Comment on Thermal circuit breaker with rotary knob actuator by extractores de aire

extractores de aire — Thu, 24 Nov 2011 20:29:58 +0000

First class article.

Comment on Software Modeling to Determine Heat-Related Problem Spots by Rajan

Rajan — Thu, 24 Nov 2011 12:04:31 +0000

Hi, Is there any Thermal solutions providers in Bangalore for Networking products. We need someone help us in feasibility of the product and also help us in sorting few thermal challenges.

Comment on carbon nanotubes as high performance thermal interface materials by Business Directory

Business Directory — Mon, 21 Nov 2011 21:00:46 +0000

Very illuminating post..

Comment on Notes on using thermocouples by Vijay

Vijay — Sat, 19 Nov 2011 06:42:01 +0000

Can anyone tell, whether a thermocouple can be used to measure the bulk temperature of a fluid flowing inside a pipe. whether such a measurement will be accurate?

Comment on Advances In High-Performance Cooling For Electronics by Ray T

Ray T — Fri, 18 Nov 2011 18:07:58 +0000

I greatly appreciate the breadth of this review and details for each, though I wish an update could be completed. Much development has happened in the past 5-6 years since the research on this article was completed.

Comment on Thermally Conductive Printed Circuit Board Substrate by Gaming

Gaming — Thu, 17 Nov 2011 15:28:02 +0000

Wonderful article!!