List of articles published in Electronics Cooling Magazine

May 2008, Volume 14, Number 2

• On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages, Li Zhang, Philips Lumileds Lighting, Theo Treurniet, Philips Lighting
• Modeling Multiple Heat Source Problems In Electronic Systems, Mohamed-Nabil Sabry, French University in Egypt
• Heat Spreading:  Not a Trivial Problem, Clemens J.M. Lasance, Philips Research Laboratories
   

Calculation Corner:  Estimating Dew Point Temperature For Water Cooling Applications,  Robert E. Simons, Associate Editor

Technical Data:  Thermal Conductivity Of Liquid Metals, Clemens J.M. Lasance, Editor-in-Chief, May Issue

Technical Brief:  2U Rack Mountable Vapor Compression Cooling System For High Power Electronics, Glenn Deming, Ronald Wysk, and Kang P. Lee, Aspen Systems, Inc.

Editorial:  On The Hate/Love Relationship Between The U.S. And SI, Clemens J.M. Lasance, Editor-in-Chief, May 2008 issue

February 2008, Volume 14, Number 1

• Modeling Air-Cooled Heat Sinks As Heat Exchangers, Robert J. Moffat, Stanford University
• Thermal Modeling Approaches Of GaAs Semiconductors, Steven W. Boslet, Lockheed Martin, Roberto Montañez Morales, Northrop Grumman
• Challenges In Thermal Management Of Memory Modules, Sai Ankireddi and Tony Chen, Sun Microsystems Inc.

Calculation Corner: Estimating Thermal Resistance For Fin-To-Fin Thermal Couplers, Robert E. Simons, Associate Technical Editor

Technical Data: Thermal Properties Of Building Materials, Jim Wilson, Associate Technical Editor

Technical Brief: Thermo-Reflectance Thermography For Submicron Temperature Measurements, Peter E. Raad, Pavel L. Komarov, and Mihai G. Burzo, TMX Scientific Inc. and Southern Methodist University

Editorial: en Route to a Greener Thermal Technology, Bruce Guenin, Editor-in-Chief, February 2008 issue

November 2007, Volume 13, Number 4

• Reliability Testing Of Thermal Greases, Arun Gowda, David Esler, Kaustubh Nagarkar and Sandeep Tonapi, GE Global Research Center
• A Practical Implementation Of Silicon Microchannel Coolers, Evan G. Colgan, R. J. Bezama, Michael Gaynes and Kenneth C. Marston, IBM Corporation
• Advanced Cooling Using Meso-Scale Evaporative Cold Plates, Robert Hannemann and Steven Mackey, Thermal Form & Function, Inc.

Calculation Corner: Thermal Strain in Semiconductor Packages, Part II, Bruce M. Guenin, Associate Technical Editor

Technical Data: Thermal Effusivity, Clemens J.M. Lasance, Associate Technical Editor, Philips Research Laboratories

Technical Brief: Electronics Cooling At Higher Pressures ... a Positive Displacement Pump Solution, Steven E. Owen, P.E., Micropump, Inc.

Editorial: Providing More Value Than Playing Video Games, Jim Wilson, Editor-in-Chief, November 2007 Issue

August 2007, Volume 13, Number 3

• Design For Manufacturability Of Forced Convection Air Cooled Fully Ducted Heat Sinks, Madhusudan Iyengar, IBM, Avram Bar-Cohen, University of Maryland
• Air-Cooled, Pin Fin Coldwall Design For Operation At Altitude, B. Elliott Short Jr., Raytheon Company, Donald C. Price, Southern Methodist University
• Comparison Of Heat Transfer Rates Of Different Nanofluids On The Basis Of The Mouromtseff Number, Devdatta P. Kulkarni, Praveen K. Namburu, Debendra K. Das, University of Alaska Fairbanks
• Top 20 Considerations For Selecting Thermal Interface Materials, Gary Fenical and Richard Elrick, Laird Technologies

Calculation Corner: Thermal Strain In Semiconductor Packages, Part I, Bruce M. Guenin, Associate Editor

Technical Data: Thermal Diffusivity, Jim Wilson, Associate Editor

Editorial: Thanks and Congratulations, Robert Simons, Editor-in-Chief, August 2007 Issue

May 2007, Volume 13, Number 2

• Synthetic jets for forced air cooling of electronics, Raghav Mahalingam, Sam Heffington, Lee Jones and Randy Williams, Nuventix Inc.
• Compact thermal modeling in electronics design, Sarang Shidore, Flomerics Inc.
• Developments with metallic thermal interface materials, David L. Saums, DS&A LLC

Calculation Corner: Estimating the effect of intercoolers for computer rack cooling, Robert E. Simons, Associate Technical Editor

Technical Data: About viscosity, Clemens J.M. Lasance, Associate Technical Editor

Technical Brief: Moisture permeation in electronics, Jim Wilson, Associate Technical Editor

February 2007, Volume 13, Number 1

• Piezo actuators for electronics cooling, Ioan Sauciuc, Intel Corporation
• Microscale heat transfer, Mehdi Asheghi, Ph. D., On-Chip Thermal Solutions and
  Wenjun Liu, University of Notre Dame
• In the data center, power and cooling costs more than the it equipment it supports, Christian L. Belady, P.E., Hewlett-Packard

Calculation Corner: Using a simple air recirculation model to explore computer rack cooling, Robert E. Simons, Associate Technical Editor

Technical Data: Thermal conductivity of common alloys in electronics packaging, Jim Wilson, Associate Technical Editor

Technical Brief: Adhesion of thermal interface materials for cpu heatsinks, 28
an overlooked issue, Margaret B. Stern, Donald Kearns, and Brett Ong, Sun Microsystems, Inc.

November 2006, Volume 12, Number 4

• Liquid Cooling Of A High-Density Computer Cluster, Steven R. LaPlante, Norman Aubry, Louis Rosa, Patrick Levesque, Boehringer Ingelheim (Canada) Ltd., B. (Sam) Aboumrad, F.M. & Engineering Services Inc., Don Porter, Chuck Cavanaugh, Jamie Johnston, IBM
• Cooling Options And Challenges Of High Power Semiconductor Modules, Scott G. Leslie, Powerex, Inc.
• Thermal Challenges In LED Cooling, James Petroski, GELcore, LLC

Calculation Corner: Toward A Thermal Figure Of Merit For Multi-Chip Packages, Bruce M. Guenin, Ph.D., Associate Editor

Technical Data: The Seebeck Coefficient, Clemens J.M. Lasance, Associate Editor

Technical Brief: Effect Of Improved Thermoelectric Zts On Electronic Module Coolability, Robert E. Simons, Associate Editor

August 2006, Volume 12, Number 3

• Exploring the Limits of Air Cooling, Wataru Nakayama, ThermTech International
• Solid-State Microrefrigerator on a Chip, Kazuhiko Fukutani, Yan Zhang, Ali Shakouri, University of California Santa Cruz
• Packaging Challenges For High Heat Flux Devices, Bruce Guenin, Sun Microsystems

Calculation Corner: So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages, Bruce M. Guenin, Associate Editor

Technical Data: Thermal Conductivity of Solders, Jim Wilson, Associate Editor

Technical Brief: Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective, Michael J. Ellsworth, Jr., IBM Corporation

May 2006, Volume 12, Number 2

• On-Chip Electrowetting Cooling, Herman Oprins Imec and Katholieke Universiteit Leuven, Martine BaelmansKatholieke Universiteit Leuven
• An Overview of Liquid Coolants for Electronics Cooling, Satish C. Mohapatra, Dynalene, Inc.
• Micropumping Technologies for Electronics Cooling, Brian D. Iverson and Suresh V. Garimella Purdue UniversityVishal SinghalThorrn Micro Technologies

Calculation Corner: Comparing Heat Transfer Rates of Liquid Coolants Using the Mouromtseff Number, Robert E. Simons, Associate Editor, IBM Corporation

Technical Data: Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon, Clemens J.M. Lasance, Associate Editor, Philips Research Laboratories

Technical Brief: Direct Die Attach Using a Room Temperature Soldering ProcessJai Subramanian, David Van Heerden, Jane He, Reactive NanoTechnologies

February 2006, Volume 12, Number 1

• Integrated Circuit Package Types And Thermal Characteristics, Bennett Joiner and Sriram Neelakantan, Freescale Semiconductor, Inc.
• Thermal Design And NEBS Compliance, Majid Safavi, Lucent Technologies
• Indirect Thermosyphons For Cooling Electronic Devices,
  Phil E. Tuma and Hamid R. Mortazavi, 3M Corporation

Calculation Corner: A Simple Thermal Resistance Model - Isoflux Versus Isothermal, Robert E. Simons, Associate Editor

Technical Data: Thermal Conductivity of III-V Semiconductors, Jim Wilson, Associate Editor

Technical Brief: Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks, Michael D. Haskell, Advanced Thermal Solutions, Inc.

November 2005, Volume 11, Number 4

• Cooling Solutions In The Past Decade, Jim Wilson, Raytheon Space and Airborne Systems, Bruce Guenin, Sun Microsystems
• Advances In High-Performance Cooling For Electronics, Clemens J.M. Lasance, Philips Research Laboratories, Robert E. Simons, IBM Corporation

Kordyban's korner GCS Theory Applied to Thermal Interface Materials, Tony Kordyban

August 2005, Volume 11, Number 3

• High Powered Chip Cooling -- Air and Beyond, Michael J. Ellsworth, Jr. and Robert E. Simons, IBM Corporation
• Latest Developments In Thermoelectrically Enhanced Heat Sinks, Jim Bierschenk and Dwight A. Johnson, Marlow Industries, Inc.
• Liquid Cooling is Back, Roger Schmidt, IBM Corporation

Technical Data: Metals For Thin Wires – Criteria Of Choice, Clemens J.M. Lasance, Associate Editor

Calculation Corner: A Funny Thing Happened On The Way To The Heatsink, Bruce M. Guenin, Associate Editor

Technical Brief: Vibration Analysis For Electronic Equipment, Michael Nikkhoo, Celestica Corporation

May 2005, Volume 11, Number 2

• Review of Low Profile Cold Plate Technology for High Density Servers, David Copeland, Sun Microsystems
• CFD Simulations in Electronic Systems: A Lot of Pitfalls and a Few Remedies, Clemens J.M. Lasance, Philips Research Laboratories
• Design of Experiments for Numerical Parameter Studies of Electronic Systems: Optimizing the Cooling Strategy of an Ethernet Switch, Peter Stehouwer, Centre for Quantitative Methods

Technical Data: Phase Change Material Thermal Properties, Jim Wilson, Associate Editor

Calculation Corner: Using an Equivalent Heat Transfer Coefficient to Model Fins on a Fin, Robert E. Simons, Associate Editor

Technical Brief : "Revolutionary" New Thermal Management Materials, Carl Zweben, Advanced Packaging Materials Consultant

Kordyban's korner: Threatened With a Pipe, Tony Kordyban

February 2005, Volume 11, Number 1

• Server Design Challenges for the High-heat-load Internet Data Center, David S. De Lorenzo, Stanford University & Joseph B. Opdahl, Intel Corporation
• Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs, Marlin Vogel and Guoping Xu, Sun Microsystems
• ASHRAE Committee Formed to Establish Thermal Guidelines for Datacom Facilities, Roger Schmidt, IBM Corporation, & Don Beaty, DLB Associates

Calculation Corner: Estimating Temperatures in an Air-cooled Closed Box Electronics Enclosure, Robert E. Simons, Associate Editor, IBM Corporation

Technical Brief: Solve Thermal Issues Earlier in Updated Board Designs, Alexandra Francois-Saint-Cyr, Flomerics, Inc.

November 2004, Volume 10, Number 4

• Use Of Heat Pipe Cooling Systems In The Electronics Industry, Mohamed Chaker Zaghdoudi, Institute of Applied Sciences and Technology (INSAT), Laboratoire Matériaux, Mesures et Applications (MMA), Christian Tantolin and Claude Godet, Metal Process, Advanced Heat Transfer and Technology Division (AHTT)
• Metal Injection Molding Of Heat Sinks , John L. Johnson, Center for Innovative Sintered Products, The Pennsylvania State University, Lye-King Tan, Advanced Materials Technologies Pte Ltd
• Insulated Metal Printed Circuits - A User-Friendly Revolution In Power Design, James Stratford and Ad Musters, Universal Science

Calculation Corner: Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board, Bruce M. Guenin, Associate Editor, Sun Microsystems

Technical Data: Seven Years Of Technical Data: An Overview, Clemens J.M. Lasance, Associate Editor, Philips Research Laboratories

Technical Brief: Heat Transfer Enhancement By Using Nanofluids For Cooling Of High Heat Output Microprocessor, Cong T. Nguyen, Gilles Roy, Sidi E.B. Maïga, and Paul-R. Lajoie, Université de Monct

August 2004, Volume 10, Number 3

• Opto-electronic Transceiver Modules, a System Design Perspective
  Abdolreza Langari and Fred Morris, Mindspeed Technologies Inc.
• –Communication Network Power Efficiency Assessment, Limitations and Directions, Alex Vukovic, Communications Research Centre (CRC)
• Trends in Cooling of Electronics: The Use of Thermal Roadmaps, Ger Janssen, Arjan Kole, and Alain Leroux, Philips Centre for Industrial Technology (CFT)

Calculation Corner: Thermal Vias – A Packaging Engineer's Best Friend, Bruce M. Guenin, Ph.D., Associate Editor

Technical Data: The Thermal Conductivity of Silicon Dioxide, Clemens J.M. Lasance, Associate Editor

Technical Brief: Keep Cool by Sensing Current to Control Fans, Jerry Steele, Burr-Brown Products from Texas Instruments

May 2004, Volume 10, Number 2

• Critical Cooling Issues in High Power Radio Frequency Transmitter Amplifiers, Luke Maguire, Masud Behnia and Graham Morrison, University of New South Wales
• CFD Prediction of Electronic Component Operational Temperature on PCBs, Peter Rodgers, University of Maryland, Valérie Eveloy, Electronics Thermal Management, Ltd.
• Modeling Heat Conduction in Printed Circuit Boards Using Finite Element Analysis, Allen M. Lush, Harvard Thermal, Inc.

Calculation Corner: Simple Formulas for Estimating Thermal Spreading Resistance, Robert E. Simons, Associate Editor, IBM Corporation

Technical Data: Surface Flatness, Jukka Rantala, Associate Editor

Kordyban's korner: Nostradamitech, Tony Kordyban, Thermal Guru

February 2004, Volume 10, Number 1

• Thermal Interface Materials: A Brief Review of Design Characteristics and Materials, Ravi Mahajan, Chia-Pin Chiu and Ravi Prasher, Intel Corporation
• The Temperature Ratings Of Electronic Parts, Rajeev Mishra, Mohammadreza Keimasi and Diganta Das, University of Maryland
• Air Cooled Compact Heat Exchanger Design For Electronics Cooling, James Marthinuss and George Hall, Northrop Grumman

Calculation Corner: Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance, Robert E. Simons, Associate Editor, IBM Corporation

Technical Brief: The Benefits Of Using Hadiabatic In Thinking About Electronics Cooling, Robert J. Moffat, Professor of Mechanical Engineering (Emeritus), Stanford University

November 2003, Volume 9, Number 4

• Thermal Interface Materials, Daniel Blazej, Ph.D., Emerson & Cuming
• Problems with Thermal Interface Material Measurements: Suggestions for Improvement, Clemens J.M. Lasance, Philips Research Laboratories
• Cooling Technology Options, Part 2, Kaveh Azar, Editor-in-Chief, Advanced Thermal Solutions, Inc.

Technical Data: The Thermal Conductivity of Moist Air, Clemens J.M. Lasance, Associate Editor, Philips Research Laboratories

Calculation Corner: The 45° Heat Spreading Angle – An Urban Legend?
Bruce M. Guenin, Ph.D., Associate Editor

Technical Brief : Prediction of Thermal Contact Resistance
Suresh V. Garimella and Anthony F. Black, Cooling Technologies Research Center, Purdue University

August 2003, Volume 9, Number 3

• Cooling Technology Options, Part 1, Kaveh Azar, Editor-in-Chief, Advanced Thermal Solutions, Inc.
• Hot Spots in Data Centers, Roger Schmidt, IBM Corporation
• Cooling Issues for Automotive Electronics, Bruce A. Myers, Delphi – Delco Electronics Systems

Technical Data: E missivity in Ppractical Temperature Measurements, Jukka Rantala, Associate Editor, Nokia Research Center

Calculation Corner: Calculations for Thermal Interface Materials, Bruce M. Guenin, Ph.D., Associate Editor

Technical Brief: Recognizing the Limits of Conventional Axial Hub-Motor AHS Devices, Edward Lopatinsky and Michael Waldman, Ph.D., Rotys, Inc.

May 2003, Volume 9, Number 2

• Effective Thermal Design for Electronic Systems, Christian L. Belady, Hewlett-Packard Corporation, Angie Minichiello, Utah State University
• Cooling of a Flat TV Monitor, G. A. (Wendy) Luiten, Philips Digital Systems Laboratory, Eindhoven
• How Much Heat can be Extracted from a Heat Sink? K. Azar, and B. Tavassoli, Advanced Thermal Solutions, Inc.
• An Introduction to Pulsating Heat Pipes, Sameer Khandekar, Manfred Groll and Vivak Luckchoura, University of Stuttgart

Technical Data: Thermal Capacitance, Clemens J.M. Lasance, Associate Editor, Philips Research Laboratories

Calculation Corner: Estimating Parallel Plate-fin Heat Sink Pressure Drop, Robert E. Simons, Associate Editor, IBM Corporation

Kordyban's korner: The Weakest Link in Air Cooling, Tony Kordyban, Thermal Guru

February 2003, Volume 9, Number 1

• Optical Measurement Of Flip-Chip Package Warpage And Its Effect On Thermal Interfaces, Bongtae Han, CALCE Electronic Products and Systems Center, University of Maryland
• Challenges In Thermal Control Of Military Electronics Systems, Jim Wilson, Raytheon Electronic Systems
• Packaging And Temperature Control Considerations For Planar Waveguide Circuits, Thomas S. Tarter, Lightwave Microsystems, Inc.
• Power Density Challenges Of Next Generation Telecommunication Networks, Alex Vukovic, Communications Research Centre (CRC)

Technical Data: Glass: A Group Of Familiar Materials With Varying Properties, Jukka Rantala, Associate Editor, Nokia Research Center

Calculation Corner: Estimating Parallel Plate-Fin Heat Sink Thermal Resistance, Robert E. Simons, Associate Editor, IBM Corporation

Technical Brief: A Few Design Techniques On How To Reduce The Power, Vance E. Poteat, Merrimack College

November 2002, Vol.8, No. 4

• EMC and Thermal Design Conflicts in a PC, David P. Johns, Alexandra Francois-Saint-Cyr and Fred German, Flomerics, Inc.
• Electronic Information Exchange, Mouloud Bourbel, MAYA Heat Transfer Technologies Ltd.
• Numerical Modeling and Experimental Verification of High-density Servers, David S. De Lorenzo, Intel Corporation

Technical Data: The Thermal Conductivity of Air at Reduced Pressures and Length Scales, Clemens J.M. Lasance, Associate Editor, Philips Research Laboratories

Calculation Corner: Thermal Calculations for Multi-chip Modules, Bruce M. Guenin, Ph.D., Associate Editor, Sun Microsystems

Technical Brief: Electroosmotic Microchannel Cooling System for Microprocessors, Kenneth Goodson, Juan Santiago, Thomas Kenny, Linan Jiang, Shulin Zeng, Jae-Mo Koo, Lian Zhang, Shuhuai Yao and Evelyn Wang, Stanford University

Kordyban's korner: Selective Surfaces

August 2002, Vol.8, No.3

• Thermal joint conductance for graphite materials, Egidio (Ed) Marotta, Ph.D., & Steve Mazzuca, IBM Corporation, J. Norley, Ph.D., Graftech International Ltd.
• Optical instrumentation for the thermal characterization of electronic devices, Wilfrid Claeys, Stefan Dilhaire, Sébastien Jorez & Stéphane Grauby, University of Bordeaux
• Quick and easy fan/sink characterization, R.A. Wirtz, University of Nevada

Technical Data: Pyrolytic graphite – thermal performance by structure, Jukka Rantala, Associate Editor, Nokia Research Center

Calculation Corner: Simplified transient model for IC packages, Bruce M. Guenin, Ph.D., Associate Editor, Sun Microsystems

Technical Brief: Effects of electrical noise on thermocouple measurements , Alfonso Ortega, Ph.D, University of Arizona

Kordyban's korner: There's something for everybody on talk radio

May 2002, Vol.8, No.2

• Dynamic Temperature Measurements: Tools Providing a Look into Package and Mount Structures, András Poppe, MicReD Ltd. and Vladimír Székely, Budapest University of Technology and Economics
• Dynamic Measurements: A Cornerstone of the European PROFIT Project, Clemens J.M. Lasance, Philips Research Laboratories
• Thermal Design Challenges in Automotive Alternator Power Electronics, Mike Bradfield, Delphi Automotive Systems
• Flash Diffusivity Method: A Survey of Capabilities, Robert C. Campbell, NETZSCH Instruments, Inc. and Stephen E. Smith, Ph.D., NETZSCH Instruments, Inc.

Technical Data: The Thermal Conductivity of Thermal Insulators
Clemens J.M. Lasance, Associate Editor, Philips Research Laboratories

Calculation Corner: Estimating Temperatures in a Water-to-Air Hybrid Cooling System, Robert E. Simons, Associate Editor, IBM Corporation

Technical Brief: Understanding Phase Change Materials, Miksa de Sorgo, Parker Hannifan Corp.

February 2002, Vol.8, No.1

• Thermal Issues in GaAs Analog RF Devices, Jim Wilson, Ph.D., Raytheon Electronic Systems
• Advanced Techniques for IC Surface Temperature Measurement, Josep Altet, Universitat Politècnica de Catalunya, Stephane Grauby, Centre de Physique Moleculaire Optique et Herzienne, University Bordeaux, Sebastian Volz, Laboratoire d'Études Thermiques-ENSMA
• The Many Flavors of Ball Grid Array Packages, Bruce M. Guenin, Ph.D., Sun Microsystems

Kordyban's Korner: Thermal I/O, Tony Kordyban, Thermal Guru

Technical Data: Diamonds are a Thermal Designer's Best Friends, Jukka Rantala, Associate Editor, Nokia Research Center

Calculation Corner: Estimating Natural Convection Heat Transfer for Arrays of Vertical Parallel Flat Plates, Robert E. Simons, Associate Editor, IBM Corporation

Technical Brief: High Resolution, Real Time Micro-thermal Imaging -- Steady State and Pulse Measurements on Microscopic Semiconductor Targets, Grant C. Albright, Quantum Focus Instruments Corporation

November 2001, Vol.7, No.4

• Thermal management of highly integrated electronic packages in avionics applications - Claude Sarno, Georges Moulin, Thales Avionics
• Noise emission of telecommunication devices - Risto Kaivola, Timo Avikainen, Nokia Research Center
• Temperature and reliability in electronics systems - the missing link - John Parry, Flomerics, Ltd., Jukka Rantala, Nokia Research Center Clemens Lasance, Philips Research Laboratories

Technical Brief- Thermomechanical stress modeling in microelectronics and photonics, E. Suhir, Iolon, Inc.

Technical Data- The thermal conductivity of rubbers/elastomers
Clemens J.M. Lasance, Associate Editor, Philips Research Laboratories

August 2001, Vol.7, No.3

• Vapor Compression Cooling for High Performance Applications - John W. Peeples, The Citadel and KryoTech, Inc
• Use of Naphthalene Sublimation Technique for Obtaining Accurate Heat Transfer Coefficients in Electronic Cooling Applications - Roger R. Schmidt, IBM Corporation
• The Challenge of Operating Computers at Ultra-low Temperatures - Michael J. Ellsworth, Jr., IBM Corporation
• Dimensional Analysis for Package Designers - Michael T. Boyle, University of Maine

Calculation Corner- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate - Robert E. Simons, Associate Editor, IBM Corporation

Technical Brief- The Role of Natural Graphite in Electronics Cooling - Julian Norley, Graftech Inc.

Technical Data- The Anisotropic Thermal Conductivity of Plastics - Jukka Rantala, Associate Editor, Nokia Research Center

May 2001, Vol.7, No.2

• Visualization of air flows in electronics systems - Kaveh Azar, Peter Rodgers, Advanced Thermal Solutions, Inc.
• The submerged double jet impingement (SDJI) method for thermal testing of packages - Evelien Driessens, IMEC; Filip Christiaens, Alcatel
• –Parameters affecting package thermal performance a low end system level example - S. B. Sathe, V. V. Calmidi, R.J. Stutzman, IBM Microelectronics
• An alternative approach to junction-to-case thermal resistance measurements - Bernie Siegal, Thermal Engineering Associates, Inc.

Calculation Corner- Characterizing a package on a populated printed circuit board - Bruce M. Guenin, Associate Editor

Technical Brief- General aspects on fan selection and layout - Dr.-Ing. Walter Angelis, Papst-Motoren GmbH & Co Kg

Technical Data- The thermal conductivity of unfilled plastics - Clemens J.M. Lasance, Associate Editor, Philips Research Laboratories

February 2001, Vol.7, No.1

• Future trends in heat sink design - Christopher A. Soule, Aavid Thermalloy
• The treacherous streams - Vitaly Fishman, TELRAD Networks Group
• Component thermal characterization - Bruce M. Guenin, Ph.D, Amkor Technology, Inc.
• Thermal characterization of power ICs using virtual junction temperature - Henk Boezen, Philips Semiconductors

Calculation Corner- Don't underestimate radiation in electronic cooling - Bruce M. Guenin, Ph.D., Associate Editor, Amkor Technology, Inc.

Technical Brief- We still have a headache with Arrhenius - Dr. Michael Osterman, Director of Technology Transfer, CALCE Research Center, University of Maryland.

Technical Data- The thermal conductivity of air - Clemens J.M. Lasance, Associate Editor, Philips Research Laboratories

Kordyban's korner- CFD: One measly letter away from CAD

December 2000, Vol.6, No.4

• Managing power requirements in the electronics industry - Kaveh Azar, Lucent Technologies & J. Morabito, Lucent Technologies

September 2000, Vol.6, No.3

• Low temperature electronic cooling - Roger Schmidt, IBM Corporation
• High accuracy thermal interface resistance measurement using a transient method - Eric G. T. Bosch, Clemens J.M. Lasance, Philips Research Laboratories
• The increasing importance of thermal test dies - Marta Rencz, MicReD, Ltd.
• Natural convection modeling of heat sinks using web-based tools - J. Richard Culham, P. Teertstra, M. M. Yovanovich, University of Waterloo

Calculation Corner- Bruce M. Guenin, Associate Editor, Amkor Technology

Technical Brief- Multilayer circuitry on metal substrates - Goran Matijasevic, Ormet Corporation

Technical Data- The thermal conductivity of fluids - Clemens J.M. Lasance, Philips Research Laboratories

May 2000, Vol.6, No.2

• Application of thermoelectric coolers for module cooling enhancement - Robert E. Simons, IBM
• Temperature of in-line array of electronic components simulated by rectangular blocks - Majid Molki, Ph.D., University of Maryland, Mohammad Fraghri, Ph.D., University of Rhode Island
• A system level cooling solution for cellular phone applications - Abdolreza Langari, Hassan Hashemi, Conexant Systems Inc.
• Thermal challenges in the telecom and networks industry - Bonnie Mack, Tim Venus, Nortel Networks NSPaN

Calculation Corner- Bruce M. Guenin, Associate Editor, Amkor Technology

Technical Brief - Low Noise Axial Fan Applications- Roger Dickenson, Torrington Research Company

Technical Data - How Thermal Conductivity Relates to Electrical Conductivity- Clemens J.M. Lasance, Philips Research Laboratories

January 2000, Vol.6, No.1

• Computer-related thermal packaging at the millenial divide - Avram Bar-Cohen, PhD, University of Minnesota
• The history of power dissipation - Kaveh Azar, PhD - Lucent Technologies
• Ten stupid things engineers do to mess up their cooling - Tony Kordyban, Tellabs
• Thermal analysis moves into the 21st century - Steve Addison, PhD - Flomerics Inc.

Technical Data - Thermal conductivity of composite materials- Clemens J.M. Lasance, Philips Research Laboratories

September 1999, Vol.5, No.3

• Thermal design of fault tolerant and high availability computer systems - Stephen Berestecky, Lucent Technologies
• Design and reliability considerations in avionics electronics packaging - Ali Jamnia and Robert E. Walter, Airtronic Systems, Inc.
• Use of thermal analysis information in avionics equipment development - Diganta Das, University of Maryland
• High performance thermal management materials - Carl Zweben, Composites Consultant

Calculation Corner - Determining the junction temperature in a plastic semiconductor package, part II- Bruce M. Guenin, Associate Editor, Amkor Technology

Technical Brief - Adjusting temperatures for high altitude- Jinny Rhee, Rhee Thermosciences and Kaveh Azar, Lucent Technologies

Technical Data - The thermal conductivity of ceramics- Clemens J.M. Lasance, Philips Research Laboratories

May 1999, Vol.5, No.2

• Test methods for characterizing the thermal transmission properties of phase-change thermal interface materials - Bob Rauch, Power Devices, Inc.
• Heat pipe fundamentals - John. E. Graebner, Bell Labs, Lucent Technologies
• Uncertainty analysis - Robert J. Moffat, Professor of Mechanical Engineering (Emeritus), Stanford University
• Thermal characterization of active components - Heinz Pape, Gerhard Noebauer, Siemens Semiconductor

Calculation Corner - Determining the junction temperature in a plastic semiconductor package, part 1- Bruce M. Guenin, PhD, Associate Editor

Technical Brief - Heatsink attachment and thermal interface effects on production assembly and repair- David R. Riese, Lucent Technologies

Technical Data - The thermal conductivity of aluminum oxide- Clemens J.M. Lasance, Philips Research Laboratories

January 1999, Vol.5, No.1

• Use of junction-to-board thermal resistance in predictive engineering - Bennet Joiner, Motorola
• Acoustic noise emission and communication systems in the next century - D.A. Quinlan, Bell Laboratories, Lucent Technologies
• Beyond the arrow plot - New methods for flow visualization - Jarke J. van Wijk, Eindhoven University of Technology
• Improving productivity in electronic packaging with flow network modeling (fnm) - Christian Belady, Hewlett-Packard and Kanchan M. Kelkar and Suhas V. Patankar, Innovative Research, Inc.

Calculation Corner - Convection and radiation loss from a fin- Bruce M. Guenin, PhD, Associate Editor

Technical Brief - Graphite fiber reinforced al and cu alloys for thermal management applications- Mark Ryals, Metal Matrix Cast Composites, Inc.

Technical Data - The thermal conductivity of pure metals- Clemens J.M. Lasance, Associate Editor, Philips Research Laboratories

September 1998, Vol.4, No.3

• Recent Japanese thermal solutions for portable computers- Wataru Nakayama, International Consultant, ThermTech International.
• Cooling electronics at high altitudes made easy - James Edwin Marthinuss Jr. and George Thomas Hall, Northrop Grumman
• Heat transfer measurements in electronics cooling applications - Ned R. Keltner, Ktech Corporation
• Thermal testing and control by means of built-in temperature sensors - V. Szekely, Technical University of Budapest

Calculation Corner - Convection and radiation heat loss from a printed circuit board-

Technical Brief - Disk drive reliability and thermal management

Technical Data - The thermal conductivity of gases-

May 1998, Vol.4, No.2

• Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example- S. Sathe and B. Sammakia, IBM Microelectronics.
• Forced convection cooling inside an electronics enclosure - G.R. Ahmed, Northern Telecom Ltd.; J.R. Culham, University of Waterloo; and D. Cooper, Northern Telecom Ltd.
• Thermal management of handheld telecommunication products - T. T. Lee, B. Chambers, and K. Ramakrishna, Motorola, Inc.
• Thermal interface under a plastic quad flat pack - M. Okcay, Smiths Industries-Aerospace

Calculation Corner - Conduction heat transfer in a printed circuit board-

Technical Brief - Pressure drop coefficients for thin perforated plates

Technical Data - The thermal conductivity of silicon-

January 1998, Vol.4, No.1

• Measuring fluid velocity in electronic enclosures - K. Azar, Lucent Technologies.
• Thermal management of outdoor enclosures using phase change materials - M. J. Marongiu, MJM Engineering Co. and R. Clarksean, Clarksean & Associates
• Calculating spreading resistance in heat sinks - Seri Lee, Amkor Electronics, Inc.
• Experimental evaluation of the local convective heat transfer from configurations of wall-mounted cubes in a channel flow - E. R. Meinders and K. Hanjalic, Delft University of Technology.

Calculation Corner - Convection and radiation- B. M. Guenin, Associate Editor, Amkor Electronics.

Technical Brief - Fan selection - quick techniques to compare various tube-axial fan designs

Technical Data - The coefficient of thermal expansion- Clemens J. M. Lasance, Associate Editor, Philips Research Laboratories.

September 1997, Vol.3, No.3

• Thermal management of telecommunications cabinets - Renée Estes, Pacific Bell.
• Standardizing heat sink characterization for forced convection- Christian Belady, Hewlett-Packard Company.
• Integrated thermal network models are still useful - Vincent P. Manno, Department of Mechanical Engineering, Tufts University.
• A practical formula for air-cooled boards in ventilated enclosures - Mario Misale, Dipartimento di Termoenergetica e, Condizionamento Ambientale, University of Genoa.

Calculation Corner - One-dimensional heat flow- Bruce M. Guenin, Ph.D., Associate Editor.

Technical Brief - Highly emissive ion beam textured surfaces for improved cooling of electronic devices

Technical Data - Coefficient of thermal expansion- Clemens J M Lasance, Associate Editor.

May 1997, Vol.3, No.2

• Packaging: designing for thermal performance - Bruce M. Guenin, Ph.D., Amkor Electronics, Inc.
• Thermal resistance: an oxymoron? - Clemens Lasance, Philips Research Laboratories.
• Calculating interface resistance - M. M. Yovanovich, J. R. Culham and P. Teertstra, Microelectronics Heat Transfer Laboratory Department of Mechanical Engineering University of Waterloo.
• Forced convection cooling of airborne electronics - Yannick Assouad, Thermal and Mechanical Analysis Group Thomson-CSF Radars & Contre-Mesures.

Technical Brief - A simple method to estimate heat sink air flow bypass- Robert E. Simons, Electronics Cooling Applications and Roger R. Schmidt, IBM Corporation.

Tech Data - Thermal Conductivity, Clemens J M Lasance, Associate Editor.

January 1997, Vol.3, No.1

• Notes on using thermocouples - Dr. Robert J. Moffat, Stanford University.
• Measuring chip temperatures with thermochromic liquid crystals - Dr. Kaveh Azar, Lucent Technologies - Bell Laboratorie and Dino J. Farina Image Therm Engineering, Inc.
• Electrical temperature measurement using semiconductors - Dr. John W Sofia, Analysis Tech.
• Microthermal imaging in the infrared - John McDonald, Latigo Optics and Grant Albright EDO/Barnes Engineering Division.

Technical Brief - Temperature measurement using optical fibers- Chuck Schietinger, Luxtron Corp.

Tech Data- Clemens J M Lasance, Associate Editor.

September 1996, Vol.2, No.3

• Thermal Interface Materials - Dr. Miksa deSorgo, Chomerics Division, Parker Hannifin Corporation.
• Heat pipes for electronics cooling applications - Scott D. Garner, PE., Thermacore Inc.
• Thermal control of space electronics - Patrick Zemlianoy And Charles Combes, Alcatel Espace.
• An introduction to thermoelectric coolers - Sara Godfrey, Melcor Corporation.

Technical Brief - Thermal resistance of interface materials as a function of pressure- Carol A. Latham, Thermagon Inc.

May 1996, Vol.2, No.2

• All you need to know about fans - Mike Turner, Comair Rotron
• Minimizing acoustical noise in electronic systems - George Maling, Noise Control Center and David M. Yeager, Motorola Corp.
• How to evaluate fan life - Sung Kim and Alan Claassen, IBM Corp.
• Direct liquid immersion cooling for high power density microelectronics - Robert E. Simons, Electronics Cooling Applications.

Technical Brief - Thermoelectric thermal regulation systems- Robert DeVilbiss and Sathya Rajasubramanian, ThermoTek, Inc.

January 1996 - Vol.2, No.1

• Why the traditional reliability prediction models do not work - is there an alternative? - Michael Pecht, CALCE Electronic Packaging Research Center, University of Maryland.
• Electronic package characterization per JEDEC standard - Frank McMaye, ZealTech Design.
• Environmental stress testing - a product improvement method - Harry I. Saraidaridis, AT&T Bell Laboratories.
• Applying computational fluid dynamics to heat sink design and selection - Catharina R. Biber, Wakefield Engineering Inc.

Technical Brief - DELPHI - A status report on the European -union funded project for the creation and validation of thermal models on electronic parts- Harvey Rosten, Flomerics Limited.

Technical Brief - A valve-less fluid pump for electronic cooling- Erik Stemme and Goran Stemme, Royal Institute of Technology

October 1995 - Vol.1, No.2

• Making surface temperature measurements using liquid crystal thermography - Dino J. Farino, Image Therm Engineering, Inc.
• Fan cooled enclosure analysis using a first order method - Gordon N. Ellison, Thermal Computations, Inc.
• Specifying filters for forced convection cooling - Alan Woolfolk, McLean Engineering.
• The need for a change in thermal design philosophy - Clemens J. M. Lasance, Philips Research.

Technical Brief - Thermal conductivity of printed wiring boards- J.E. Graebner, AT&T Bell Laboratories.

June 1995 - Vol.1, No.1

• How to select a heat sink - Seri Lee, Aavid Thermal Technologies
• Safety tips and techniques for FEA in modeling solids - Tony Rizzo, Lucent Technologies (Bell Labs)
• Elements of device thermal characterization - Bernie Siegal, OAI
• Evaluation of different heat transfer coefficient definitions - Kaveh Azar, AT&T Bell Laboratories and Robert Moffat, Stanford University

Technical Brief - Radial nozzles- Maurice Marongiu, MJM Consulting Services.