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Consultants
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Flomerics Thermal Modeling Services
When designing your electronic equipment, do any of these questions arise?
- Can I reduce the size of or eliminate the fans
- Do I have enough air, at the right temperature, flowing over my critical components?
- Can I reduce the size of the chassis for this design?
- If I move or change the size of a vent, will it improve the thermal design?
- What heat sink design should I use for a critical component?
- What happens if I replace a component/disk drive/mother board etc., with a new one in the existing configuration?
- How long before the system overheats if one or all the fans fail?
If you would like reliable answers to these questions prior to building a prototype, let Flomerics Thermal Modeling Services help you.
Using FLOTHERM software, an advanced Computational Fluid Dynamics tool designed specifically for Electronic Applications, Flomerics
engineers will simulate the full 3-dimensional Convective, Conductive, and Radiative heat transfer characteristics of your electronic component or equipment in Steady-State or Transient
mode.
With a copy of FLOTHERM'S Post Processor on your own computer, you can view the solution and examine the:
- air flow and temperature distribution throughout the system
- temperature within solids
- pressure distribution
The model can subsequently be used to perform parametric studies in order to optimize the design.
For more information or an assessment of your needs, call 1-508-460-0112.
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MJM Engineering Co.
MJM Engineering Co. is an R&D and consulting firm specialized in the cooling of electronics and telecommunication components and
systems. We are a small company and can guarantee you personalized service, attention to detail, and the shortest turnaround time, world-wide.
MJM Engineering Co. was founded by Maurice J. Marongiu, who has over 15 years experience in the thermal management fields. He has a Ph.D.
degree from the University of Illinois, Urbana, USA in Mechanical Engineering, and has published widely in both conferences and trade journals. Dr. Marongiu has taught at the University of
Illinois-Urbana, Texas A&M University and IIT.
Contact:
Tel: 630-653-5452
Fax: 630-245-1218
e-mail: mjmeng@ix.netcom.com
Web: http://www.netcom.com/~mjmeng/small.html
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Humm Associates
Specializing in using thermal analysis to avoid cooling problems related to electronics. Offering cost effective design solutions by outsourcing
the experience you need for only the time required. Temperature and velocity measurement instrumentation provided for testing. Frequent use of thermal/fluid software "FLOTHERM" to: design and
optimize cooling solutions, reduce prototype requirements, lower risk, shorten time to market and increase predictability of cooling design.
Services include:
- Cooling design from concept to production
- Thermal management, analysis, and testing
- Courses in "Cooling of Electronics"
- Evaluation of thermal problems and solutions
Recent clients include: NEC Technologies, Bay Networks, Smith & Nephew Dyonics, EML Research, Modulus Design, Bose, Foster-Miller, Sun
Microsystems, VideoServer, Sequoia Systems, Westgate Medical, Agile Networks, Excel, Fore Systems, Design Continuum, PixelVision, Aspect Medical Systems, Zenith Data Systems and UB Networks.
Examples of recent work completed include:
- Redesign of the cooling system for networking hardware to solve thermal problems experienced in "Vicor" power modules and PC cards.
- Tested and modified a medical electronic unit to solve a cooling problem with illumination lamps
- Tested new workstations and analyzed adequacy of cooling
- Provided training at major computer company to establish thermal department
- Analyzed 32 new products including fault tolerant main-frame computer using FLOTHERM
Contact:
Tel. 508-369-3512
Fax 508-287-9534
Address:
Humm Associates
P.O.Box 152
Carlisle, MA 01741
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Heat Technology Inc.
Heat Technology, Inc.
106 Pratt's Junction Road
P.O. Box 430
Sterling, MA 01564
Tel: 978-422-7100
Fax: 978-422-7191
Email: General@heattechnology.com
Web Address: http://www.heattechnology.com
Ralph Larson managed Digital Equipment's Thermal Engineering Group for over ten years. As a principal of Heat Technology, Inc. (HTI),
Ralph and his group of consultants provide a truly valuable service for companies in need of thermal management services. In today's environment most consultants can develop a product's thermal characteristics by utilizing industry software. This is a significant step in the cooling requirements for client products. HTI uses FLOTHERM and SINDA for this part of its process in identifying these thermal characteristics. HTI performs a second and equally important step by testing a variety of options in its lab; and then, based upon price and performance, we provide recommendations intended to optimize client investments in thermal products such as heat sinks. In conjunction with its lab and proprietary products HTI is well positioned to provide total consultative solutions.
HTI carries product liability insurance as security for its recommendations.
Additional information regarding HTI can be found in the
Supplier's Directory - Laboratories, and Heat Sink listings, of this web page.
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Mechanical Solutions Inc
Thermal Analysis, Design, and Testing
Mechanical Solutions Inc is a small firm specializing in electronics cooling. We can simulate or test your product or
idea from chip to enclosure. We provide a range of design choices that focus on practical solutions.
Kevin O'Connor, principal consultant, is an Electronics Cooling Specialist. He has over 20 years experience in the electronics packaging industry as a hands-on
mechanical engineer and manager and has been a licensed Flotherm CFD consultant for 8 years.
He designs cooling for many leading server computers, consumer products, telecom products, display systems, embedded computers, and test equipment. Customers include
Intel server, network, chip packaging, and test divisions, Radisys, IMS, Flir, NEC, and many others.
He has direct experience with top suppliers of heatsinks, heat pipes, mounting methods, interface materials, fans, blowers, and coolers. He knows their capabilities
and limitations. He also understands chip packaging and how and when to enhance circuit board conduction.
Whether you want a quick recommendation or a complete solution, our work is guaranteed and references are outstanding. You will receive a fast response tailored to
your needs.
Email: ko99@earthlink.net
Phone: (503) 466-1343
Fax: (503) 466-0982
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Harvard Thermal, Inc.
249 Ayer Road
Harvard, MA 01451-1133
USA
Telephone: 978-772-3800
FAX: 978-772-9765
E-mail: info@HarvardThermal.com
Web Address: http://www.HarvardThermal.com
Contact: David Rosato
Harvard Thermal can provide expert thermal and mechanical consulting services. We have over 35 years of thermal analysis experience in
commercial and military systems.
These include microelectronics, printed circuit boards and their enclosures and liquid and air-cooled systems. Our services include thermal modeling using our TAS (Thermal Analysis System) product, SINDA/G, TRASYS and CFD analysis using Flotherm. Our experience is extremely varied including electronic components and systems, satellites, steel furnaces, flame testing of fighter oil tanks. If you are or plan to be a TAS user then we supply the models generated. We can not only model your system but also recommend alternative designs and optimize your thermal design. We can prepare test plans, perform brass board testing and reduce the results. No job is too small or too large.
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Thermal Computations, Inc.
The Company
Thermal Computations, Inc. provides design analysis, advising, special purpose software and training for the thermal analysis of electronic components and systems. Thermal
Computations, Inc. has been in existence since 1986. The principal investigator is Gordon Ellison, a retired Tektronix, Inc. Chief Scientist and Tektronix Fellow. Thermal Computations, Inc. is located in
Newberg, Oregon, which is a forty five minute drive from downtown Portland.
Products
Design Analysis/Advising:
We use FLOTHERM (FLOMERICS, INC.) computational fluid dynamics, TAS (Harvard Thermal, Inc.) finite difference, SINDA/G (Network Analysis, Inc.)
network modeling, ALGOR (ALGOR, Inc.) finite element, and our own TAMS, PTAMS, and TNETFA programs. The actual software used on your project is selected on a "most appropriate" basis.
Special Purpose Software:
We also sell the TAMS, PTAMS, and TNETFA programs with Windows pre/post processors at modest prices.
Training:
Intensive short courses are offered at your site. We can provide one or two day courses, depending on your time and interest. Our courses are
intended to entice you to purchase our software, but are comprehensive and emphasize fundamentals applicable to almost any problem. Each attendee of our two day course is provided the full TAMS, PTAMS,
and TNETFA executable code.
Contact information:
Gordon N. Ellison
29935 NE Benjamin Rd.
Newberg, OR 97132
USA
Telephone: 503-537-1120
Fax: 503-537-1120
e-mail: gordone@open.org
Web Address: http://www.thermalcomputations.com
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Electronic Cooling Solutions Inc.
July, 2001
Electronic Cooling Solutions is a thermal management company that focuses on providing solutions to companies in the electronics industry.
We have extensive experience designing the cooling system for Telecommunications, Networking, Consumer and Computing products. Our design and analysis capabilities include system level, board level, and package level.
Design and Simulation
Electronic Cooling Solutions uses Flotherm a state-of-the-art Computational Fluid Dynamics (CFD) software program to do the simulation of airflow and heat transfer
in proposed designs prior to the availability of hardware that can be tested.
Our experience and expertise range from products that must be cooled without fans to systems that use powerful blowers to remove kilowatts of heat from a vertical rack enclosure.
We specialize in
fan and blower selection and placement.
We utilize both our modeling as well as our experimental capabilities to properly size and position the air movers and to efficiently utilize plenum space. Since we work with many fan vendors we can offer the best solution for any given product.
In some cases ducts or baffles are required to properly distribute airflow through a system. Our experience and CFD know how are applied to the design of efficient, cost-effective solutions.
We have relations with many heatsink vendors and work closely with them to provide cost effective solutions for processors, ASICs and other components.
Test Capabilities
Our
laboratory facilities complement our CFD modeling tools and our design expertise. These facilities are also used for prototype testing and design verification.
We have tools to make
volumetric airflow, air velocity, temperature, and sound pressure measurements.
We can also do testing in an environmental chamber to simulate high temperature or high altitude conditions if such testing is required.
At the package level, we collaborate with Thermal
Engineering Associates (TEA) to calibrate thermal test chips and to then use the test chips for thermal design and evaluation purposes.
Staffing
Members of our engineering staff have
many years of thermal management experience. Our staff is customer driven and trained to work closely with our clients so that thermal design issues are effectively addressed.
Customers
We work with some of the biggest names in the electronic industry.
Our staff has provided services to Hewlett-Packard, Compaq Computers, Intel Corporation, Apple Computer, Cisco Systems, Brocade Communications, Marconi Communications, Nortel Networks, Lucent Technologies, Nokia, Philips Electronics, Sanmina, Network Appliance and Motorola.
Electronic Cooling Solutions Inc.
612 National Avenue
Mountain View, CA 94043
Phone: (650) 988-1155, Fax: (650) 988-1153
info@ecooling.com
www.ecooling.com
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Heat Transfer Associates, Inc.
HTA
is a group of engineers providing consultation in the thermal design, analysis and testing of electronic parts, assemblies and systems. Our experience ranges from analysis of the transistor junction to the thermal design of spacecraft.
30 plus years experience + state of the art software = practical, reliable design with a minimum unit cost.
HTA
recognizes the relationship between the critical temperature of an electronic device and its reliability. We are sensitive to the economics of obtaining a reliable electronic design that ideally employs low cost commercial parts and avoids use of relatively unreliable cooling methods such as fans, pumps, etc.
HTA has developed procedures and documents to maximize customer to HTA interfacing efficiency resulting in minimum customer time and expense.
HTA
can produce accurate models that significantly reduce engineering and testing time.
HTA specializes in thermal analysis of printed circuit boards.
HTA
customers are international and in various markets (commercial, military, aerospace, medical, etc.)
HTA guarantee's its work and, where practical, will quote a fixed price.
HTA can be contacted at 941 642 7621 / FAX 941 642 7646 / e-mail FWG@.HTAinc.net
Please visit our web site http://www.HTAinc.Net
Heat Transfer Associates, Inc.
1115 Gayer Way, Suite 201
Marco Island, FL , USA 34145
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QSIGMA Associates
- Is my product reliable?
- Will my product over heat and experience failures during normal operation?
- How can I be sure my product meets all environmental specifications?
- Can I reduce my product volume and still cost effectively remove the same amount of heat ?
- Can I use a passive natural convection cooling or do I need active cooling?
If you are asking these type of questions let QSIGMA help you find practical solutions. High operating temperature and thermal cycling stresses are
the primary failure modes for electronic devices. Product failure impacts your future revenues, warranty costs, market share, and your company's brand image. QSIGMA can help you improve your product
reliability and MTBF (mean time between failures).
QSIGMA Associates
is a professional engineering consulting firm specializing in thermal management. Our services include thermal analysis, thermal modeling, thermal products, product design verification, system trade studies, thermal data acquisition, IR thermography, and mechanical analysis services. Our customers include some of the most well known and respected brand names in commercial electronics, telecommunications, aerospace, and the medical industries. Our staff consists entirely of degreed professionals who have over 25 years of industrial experience solving real world thermal problems. We use Fluents's software package
ICEPAK. A state of the art CFD (computational fluid dynamics) tool designed specifically for electronic cooling applications.
Why call QSIGMA?
We are a small company with the correct mixture of experience, tools, and training that can quickly respond to your needs and schedule with
one-on-one personal service at an affordable price. The service to our customers does not end when you receive a technical report. We will continually follow up to insure you are a satisfied customer.
QSIGMA relies on the repeat business and referrals of satisfied customers therefore your success is our success. We are confident in our work and stand behind it with a money back guarantee.
When should you call?
At the very beginning of a project is the best time to consider thermal management. Unfortunately we are called to resolve problems that would not
have occurred if considered during the beginning of the design process. If you believe you have a potential thermal issue with an existing product QSIGMA can perform a thermal survey of your product
using both thermocouples and infrared thermography. QSIGMA looks forward to working with you until your thermal issues are resolved to your satisfaction.
Contact:
Tel: 407-694-4865
Fax: 407-888-1190
e-mail: mtharp@qsigma.net
Web: www.qsigma.net
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Romny Scientific
Romny Scientific provides a broad range of consulting, analysis and design services for customers in the optoelectronics, microelectronics, nanotechnology, and MEMS fields.
Services and areas of expertise include:
- Thermal modeling, design, simulation and optimization using numerical, analytic and combined techniques.
- Analysis of thermal fluidic, solid conduction, radiative, and multi-mode thermal systems.
- Design and analysis to allow firms to evaluate the applicability of emerging and alternative thermal management technologies to their products including, heat pipes,
thermosiphons, thermoelectric generators, nanomaterials, phase change materials, single / two phase liquid cooling, and active cooling (including thermoelectric coolers and vapor compression cycles).
- Services enabling a company to secure, execute, and report on government funded research programs including the SBIR program. Consulting on issues facing small
businesses including securing intellectual property and startup formation.
- Process design, mask design, and system modeling and optimization for MEMS systems.
Romny Scientific is located in the San Francisco bay area and serves firms throughout the United States.
Email Contact: info@romny-scientific.com
Web Address: www.romny-scientific.com
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Biber Thermal Design, Ltd.
Biber Thermal Design offers consulting in thermal design for products and equipment. With a strong background in optical display technology and end-user products, we can
help you design-in your thermal solution by making the product thermally capable and quiet, whether it is a complete system or an OEM subsystem. We've worked with UL, safety, acoustic, EMI and
environmental qualification targets. Manufacturability, service, and cost targets are always considered. Various consulting arrangements, both on-site and remote, and educational materials are available
– call or e-mail for details.
Approach
We solve practical problems by:
- Developing and implementing creative design strategies;
- Using analysis and experiments efficiently; and
- Communicating underlying thermo-fluid principles to cross-functional teams.
Tools
We have a range of thermal tools to use, from spreadsheets to flow network modeling to Flotherm (TM).
Background
The principal, Cathy Biber, has nearly two decades of experience implementing thermal solutions. Her background includes process equipment, electronics cooling, heat sinks,
projectors, and a PhD from MIT.
Biber Thermal Design, Ltd.
Portland, OR, USA
Phone 503.892.3771
E-mail cathy@biberthermal.com
Web site www.biberthermal.com
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