Articles from June 1995 Issue

Elements of device thermal characterization

June 1st, 1995

The increased power dissipation of today’s integrated circuits has made knowledge of thermal resistance important to those who manufacture and use these devices. Thermal resistance is a device (i.e. semiconductor chip mounted in a package)…read more

Evaluation of different heat transfer coefficient definitions

June 1st, 1995

The analysis of convective heat transfer problems pivots on the accurate knowledge of the heat transfer coefficient, h. The heat transfer coefficient is affected by many parameters which have been defined differently by various investigators.…read more

How to select a heat sink

June 1st, 1995

With the increase in heat dissipation from microelectronics devices and thereduction in overall form factors, thermal management becomes a more a moreimportant element of electronic product design. Both the performance reliability and life expectancy of…read more

Radial nozzles

June 1st, 1995

In a quest to increase surface heat removal rates for electronics packaging, impinging jet cooling promises to be effective and inexpensive. Most impingement cooling systems use open pipes. These are effective but have drawbacks such…read more

Safety tips and techniques for FEA in modeling solids

June 1st, 1995

Using commercially available finite element analysis (FEA) software is easier today than it has ever been. Software vendors have made great progress toward providing programs that are as easy to use as they are powerful.…read more