Articles from January 2000 Issue

Computer-related thermal packaging at the millenial divide

January 1st, 2000

Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as…read more

Ten stupid things engineers do to mess up their cooling

January 1st, 2000

Editor’s Note: On the eve of the new millenium, the editors of ElectronicsCooling have decided to depart from our normal serious tone just this once, unless, of course, we can convince Tony to contribute another…read more

The history of power dissipation

January 1st, 2000

Figure 1. Transistor counts on Intel processors from inception to present superimposed on Moore’s prediction. In his fascinating book, “Visions,” Michio Kaku [1] predicts a future driven by silicon and quantum computers. Based on the…read more

Thermal analysis moves into the 21st century

January 1st, 2000

In the last decade, we’ve come a long way in the application of thermal analysis to the design of electronics. And there’s no sign of the pace of innovation changing. Engineers are still being challenged…read more

Thermal conductivity of composite materials

January 1st, 2000

A composite material can be defined as a material in which two or more different materials are bonded together. It is sensible to make a distinction between macrocomposites and microcomposites. The first group usually has…read more