Articles from August 2001 Issue

Dimensional Analysis for Package Designers

August 1st, 2001

The care with which we express the dimensions of important parameters makes the difference between conveying useful information or conveying useless or misleading data. Taking the issue of units one more step, the purpose of…read more

Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate

August 1st, 2001

Although most of the emphasis today in the electronics cooling community is devoted to extending forced convection cooling capability, many applications still depend upon natural convection cooling. Basically, natural convection cooling combined with radiation is…read more

The Anisotropic Thermal Conductivity of Plastics

August 1st, 2001

The easiest way to tailor thermal conductivity of plastics is to incorporate some highly thermal conductive filler material into the plastic molding compound. Here the filler particles act as heat carriers in the thermally isolating…read more

The Challenge of Operating Computers at Ultra-low Temperatures

August 1st, 2001

Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance.…read more

The Role of Natural Graphite in Electronics Cooling

August 1st, 2001

Graphite is available as a variety of different material forms, the most useful in the electronics cooling market being pyrolytic graphite, graphite fiber reinforced carbon and polymer matrix composites, graphite foams and, the subject of…read more

Use of Naphthalene Sublimation Technique for Obtaining Accurate Heat Transfer Coefficients in Electronic Cooling Applications

August 1st, 2001

The naphthalene sublimation technique has been demonstrated by a number of investigators to be an excellent method for obtaining heat transfer results [1,2] and a few have applied this technique to applications focused on electronic…read more

Vapor Compression Cooling for High Performance Applications

August 1st, 2001

Vapor compression refrigeration is being adapted to cool computer and telecommunications equipment in a limited number of high performance applications. Vapor compression can lift large heat loads and can heat sink at below ambient temperatures.…read more