Electronic data exchange represents a very important link for integrating PCB electrical layout, analysis and mechanical design. It has become, in fact, the basis for enhanced economic and industrial growth. The Intermediate Data Format (IDF)…read more
Electroosmotic Microchannel Cooling System for Microprocessors
November 1st, 2002
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and…read more
EMC and Thermal Design Conflicts in a PC
November 1st, 2002
Thermal and EMC design in high-speed digital electronics systems has become a battle of conflicting requirements. Faster switching has led to increased electromagnetic (EM) emissions due to the extended bandwidth of signals. Higher-density components are…read more
Numerical Modeling and Experimental Verification of High-density Servers
November 1st, 2002
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a…read more
Selective Surfaces
November 1st, 2002
“Who’s that guy with the gigantic novelty scissors?” I asked. “That’s Percy,” Herbie said, “VP of the Biological Intercommunications Group, BIG for short. The Lost Pet Tracking System has been his baby since Day One.”…read more
The Thermal Conductivity of Air at Reduced Pressures and Length Scales
November 1st, 2002
In several earlier issues of ElectronicsCooling, I discussed the thermal conductivity of air as a function of temperature and pressure. Therein, it was stated that the temperature dependence cannot be neglected, but that the pressure…read more
Thermal Calculations for Multi-chip Modules
November 1st, 2002
Due to the flexible manufacturing processes for producing BGA packages, there has been an explosion of new package designs, many of which contain more than one integrated circuit chip [1]. Existing industry standards for IC…read more
Recent Posts
- New Method Uses Paper and Inkjet Printer to Create More Heat-Tolerant Carbon Electronics
- Two-Phase Evaporative Liquid Cooling Systems for Renewable Energy Power Conversion Systems
- New Finned Ceramic Heat Sinks Released
- New Tool Could Provide Better Understanding, Method for More Efficient Thermal Transfer
- Electronics Cooling June 2013 Issue Now Online
- Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat Rejection
- Quiet CPU Coolers for Intel Xeon Workstations and Servers
- Temperature Controller for Thermoelectric Modules and Supplemental Resistive Heaters
Latest Issue
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the June 2013 issue
of Electronics Cooling, which includes feature articles on Thermal Spreading and More Using Open-Source FEA Software; Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers, and more.
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