Articles from August 2003 Issue

Calculations for Thermal Interface Materials

August 1st, 2003

It’s no news to any of the readers of this publication that the increased power dissipation of integrated circuits has led to continuous refinement of package designs and component materials. This trend has increased the…read more

Cooling Issues for Automotive Electronics

August 1st, 2003

Electronic content in cars and trucks has significantly increased in the last 30 years. Much of the functional content of these vehicles is now generated or controlled by electronic systems. This trend will continue in…read more

Cooling Technology Options

August 1st, 2003

(Editor’s Note: Part 2 of this article will appear in the November 2003 issue of ElectronicsCooling.)  Cooling electronic systems is one of the major focal points of the design process and the key to a…read more

E missivity in Practical Temperature Measurements

August 1st, 2003

When making temperature measurements with infrared cameras and point detectors, we are always facing the question of the emissivity of our sample. In practice we would like to have a single number set in the…read more

Hot Spots in Data Centers

August 1st, 2003

Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat load has been documented by a Thermal Management Consortium of 17 companies [1] as shown in Figure 1. Also…read more

Recognizing the Limits of Conventional Axial Hub-Motor AHS Devices

August 1st, 2003

Conventional axial hub-motor AHS (Active Heatsink) devices (Figure 1) have reached their functional and cost limits and may not be improved significantly. These devices have a number of inherent, severe contradictions (design limitations) that determine…read more