Articles from February 2004 Issue

Air Cooled Compact Heat Exchanger Design For Electronics Cooling

February 1st, 2004

Introduction This article will discuss air-cooled compact heat exchanger design using published data. Kays & London’s Compact Heat Exchangers [1] contains measured heat transfer and pressure drop data on a variety of circular and rectangular…read more

Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance

February 1st, 2004

In past issues of Electronics Cooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by…read more

The Temperature Ratings Of Electronic Parts

February 1st, 2004

Introduction Semiconductor parts are most often specified for use in the “commercial” 0 to 70°C and, to a lesser extent, in the “industrial” -40 to 85°C operating temperature range. These operating temperature ratings generally satisfy…read more

Thermal Interface Materials: A Brief Review of Design Characteristics and Materials

February 1st, 2004

Introduction In the past few decades, as microprocessors have continued to evolve along Moore’s law, providing increased functionality and performance, there has been an associated increase in cooling demand driven both by the increase in…read more

The Benefits Of Using Hadiabatic In Thinking About Electronics Cooling

February 1st, 2004

The heat transfer coefficient is used to describe convective heat transfer between a solid and a fluid, as in Equation (1). The heat transfer coefficient is a defined parameter, not a physical property like thermal…read more