Articles from November 2004 Issue

Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board

November 1st, 2004

Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins…read more

Heat Transfer Enhancement By Using Nanofluids For Cooling Of High Heat Output Microprocessor

November 1st, 2004

It is well known that the thermal properties of heating or cooling fluids play a major role in the development of energy-efficient heat transfer equipment. However, conventional heat transfer fluids such as water, ethylene glycol…read more

Insulated Metal Printed Circuits – A User-Friendly Revolution In Power Design

November 1st, 2004

Introduction The growing pressure to fit as much circuitry into the smallest space possible has created new and more acute thermal problems for the design engineer. More high power components in a smaller space means…read more

Metal Injection Molding Of Heat Sinks

November 1st, 2004

Introduction New thermal management solutions are needed to provide cost-effective means of dissipating heat from future generation microelectronic devices. A relatively new process to reduce the costs of fabricating large quantities of complex components, such…read more

Seven Years Of Technical Data: An Overview

November 1st, 2004

The first 1997 issue of ElectronicsCooling started with a Technical Data column, the first of a still continuing series of columns devoted to data that are of interest to thermal designers. In the author’s opinion,…read more

Use Of Heat Pipe Cooling Systems In The Electronics Industry

November 1st, 2004

Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use…read more