Articles from February 2005 Issue

ASHRAE Committee Formed to Establish Thermal Guidelines for Datacom Facilities

February 1st, 2005

Introduction The environment of every data center is complex and unique. Air currents within the data center have hot and cold air streams colliding, cold air exhausting upward from perforated tiles, hot air streams exhausting…read more

Estimating Temperatures in an Air-cooled Closed Box Electronics Enclosure

February 1st, 2005

Introduction In the majority of air-cooling applications, openings or vents are provided in the enclosure or box in which the electronic components are housed. The required cooling air is drawn in from outside the box…read more

Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs

February 1st, 2005

Introduction The electronic industry requires increased forced-air cooling limits to cool high-end server CPUs adequately. Improving air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of…read more

Server Design Challenges for the High-heat-load Internet Data Center

February 1st, 2005

Introduction Microprocessor and system thermal management are linked to facility cooling: power dissipation and cooling techniques employed at one end of the size scale have cascading impacts at the other extreme (Figure 1). For example,…read more

Solve Thermal Issues Earlier in Updated Board Designs

February 1st, 2005

Introduction Often new products or product concepts only introduce some new aspects and rely heavily on existing designs. At the board level this often means only one section of a board is retooled or upgraded;…read more