Articles from February 2006 Issue

A Simple Thermal Resistance Model – Isoflux Versus Isothermal

February 1st, 2006

In most cases today thermal design for electronic products is performed with the aid of sophisticated computational fluid dynamics and heat transfer codes. Nonetheless, there may still be occasions when a thermal designer needs a…read more

Indirect Thermosyphons For Cooling Electronic Devices

February 1st, 2006

Nomenclature Variables R Thermal Resistance [°C/W] or [°C-mm2/W] Q Power [W] Q” Heat Flux [W/cm2] T Temperature [°C] or [K] h Heat Transfer Coefficient [W/cm2-K] Subscripts sat saturation tc thermocouple s sink or boiler w…read more

Integrated Circuit Package Types And Thermal Characteristics

February 1st, 2006

Introduction Integrated circuits range in power consumption from mW (or maybe microwatts) to hundreds of Watts with the number of electrical connections to the next level packaging ranging from eight to over 1,000. With such…read more

Thermal Design And NEBS Compliance

February 1st, 2006

Introduction As part of contractual and design requirements, telecom equipment destined for certain networks in the North American market has to be tested to the Network Equipment Building System (NEBS) standard and comply with its…read more

Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks

February 1st, 2006

Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today’s electronics. In these design situations, the proven method of analytical calculations,…read more

Thermal Conductivity of III-V Semiconductors

February 1st, 2006

Silicon dominates the electronics industry as the semiconductor of choice for most applications, but some electrical functions require electronic properties different from those of silicon. A grouping of semiconductors termed “III-V” have desirable electrical properties…read more