Articles from May 2006 Issue

An Overview of Liquid Coolants for Electronics Cooling

May 1st, 2006

Introduction The cooling of electronic parts has become a major challenge in recent times due to the advancements in the design of faster and smaller components. As a result, different cooling technologies have been developed…read more

Comparing Heat Transfer Rates of Liquid Coolants Using the Mouromtseff Number

May 1st, 2006

As many readers of ElectronicsCooling are aware, there is a growing interest in the electronics cooling community in the possible use of liquid cooling. This interest is, of course, due to the trend of increased…read more

Direct Die Attach Using a Room Temperature Soldering Process

May 1st, 2006

As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has increased [2]. The largest contributor to the total thermal resistance…read more

Micropumping Technologies for Electronics Cooling

May 1st, 2006

Introduction Traditional cooling approaches, consisting typically of external air-cooled heat sinks, are increasingly falling short in meeting the thermal management challenges of emerging electronic systems. Integrated cooling designs are being investigated to eliminate some of…read more

On-Chip Electrowetting Cooling

May 1st, 2006

Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the…read more

Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon

May 1st, 2006

Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May ’98), SiO2 (Aug ’04) and III-V semiconductors (Feb ’06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1.…read more