Articles from August 2006 Issue

Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective

August 1st, 2006

In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the…read more

Exploring the Limits of Air Cooling

August 1st, 2006

Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However,…read more

Packaging Challenges For High Heat Flux Devices

August 1st, 2006

Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in…read more

So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages

August 1st, 2006

Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use…read more

Solid-State Microrefrigerator on a Chip

August 1st, 2006

Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of…read more

Thermal Conductivity of Solders

August 1st, 2006

Soldering has been a primary method of establishing mechanical and electrical connections in electronics for many years and will likely be used in this fashion in the future. While there are several physical properties and…read more