Articles from November 2006 Issue

Cooling Options And Challenges Of High Power Semiconductor Modules

November 1st, 2006

Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more

Effect Of Improved Thermoelectric Zts On Electronic Module Coolability

November 1st, 2006

In recent years there has been a growing interest in the application of thermoelectrics to electronics cooling. Attention has been focused on thermoelectric cooling both as a possible means to enhance module cooling and to…read more

Liquid Cooling Of A High-Density Computer Cluster

November 1st, 2006

Introduction Recent advances in computer clusters have resulted in the introduction of higher density server equipment that consumes significant amounts of electrical power and produces an extraordinary amount of heat. Due to this latter attribute,…read more

The Seebeck Coefficient

November 1st, 2006

In this issue, we address the Seebeck coefficient, a property that determines the performance of thermocouples and Peltier elements. Basically, the Seebeck coefficient is related to the fact that electrons are both carriers of electricity…read more

Thermal Challenges In LED Cooling

November 1st, 2006

Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting…read more

Toward A Thermal Figure Of Merit For Multi-Chip Packages

November 1st, 2006

Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue’s Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP)…read more