Articles from February 2007 Issue

In the data center, power and cooling costs more than the it equipment it supports

February 1st, 2007

Historically, the cost of energy and the cost of the data center power and cooling infrastructure have not been on the radar for most Chief Financial Officers (CFO) and Chief Information Officers (CIO) and have…read more

Microscale heat transfer

February 1st, 2007

Advances in microfabrication processes have led to a continuous miniaturization of Field Effect Transistors (FET) that contain semiconductor (e.g., silicon), insulator (e.g., silicon dioxide), and metallic (e.g., copper interconnects) layers only a few nanometers thick.…read more

Piezo actuators for electronics cooling

February 1st, 2007

Introduction Today, there is a specific demand by the electronics consumer market: more devices using low power processors with multiple simultaneous CPU functions. Due to the significant demand in computing needs, the International Technology Roadmap…read more

Thermal conductivity of common alloys in electronics packaging

February 1st, 2007

Thermal conductivity of common alloys in electronics packaging Jim Wilson, Associate Technical Editor   Property Thermal Conductivity (W/mK) @25°C CTE (ppm/°C) @25°C Copper 395 17.1 Aluminum 200 23.5 CuMo 160-185 7.0-9.0 CuW 180-220 6.5-8.5 Kovar…read more

Using a simple air recirculation model to explore computer rack cooling

February 1st, 2007

Figure 1. Schematic diagram of simple computer rack air recirculation model. Figure 2. Schematic diagram of computer rack air recirculation model with heat exchanger in rear of computer rack. In an article in the November…read more

Adhesion of thermal interface materials for cpu heatsinks, an overlooked issue

February 1st, 2007

Figure 1. Test joint break load for a range of TIM types. Note that, by definition, PCMs go through a solid/liquid transition above the melting temperature (Tmelt). In the solid phase, PCMs, typically wax-based, show…read more