Articles from May 2007 Issue

About viscosity

May 1st, 2007

Table 1. Dynamic Viscosity Values for Various Gases and Liquids When we look at a fluid parcel subject to a velocity gradient in the direction perpendicular to the direction of the flow, we observe that…read more

Compact thermal modeling in electronics design

May 1st, 2007

Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years.…read more

Developments with metallic thermal interface materials

May 1st, 2007

Electronics industry needs for improved performance of thermal interface materials (TIMs) are driving continued reductions in thermal resistance. These reductions are being achieved with materials that become liquidous or near-liquidous at predictable operating temperatures, with…read more

Estimating the effect of intercoolers for computer rack cooling

May 1st, 2007

Figure 1. Four board high rack with serial air flow configuration. Figure 2. Rack with intercoolers cooled by water flowing parallel to air flow direction. In the February 2007 issue of ElectronicsCooling the Calculation Corner…read more

Moisture permeation in electronics

May 1st, 2007

Environmental control for electronic packages and enclosures often involves understanding and managing moisture concentration. Excessive moisture combined with processing temperatures can cause damage. High humidity levels have other potentially harmful effects such as corrosion. Since…read more

Synthetic jets for forced air cooling of electronics

May 1st, 2007

Introduction As increasing functionality is packaged into ever-shrinking electronics, cooling requirements rise exponentially. While there have been continued advances in high heat flux technologies [1], commercial, consumer-oriented systems continue to focus on aircooling for reasons…read more