Articles from August 2007 Issue

Air-Cooled, Pin Fin Coldwall Design For Operation At Altitude

August 1st, 2007

Introduction Numerous thermal management techniques exist depending on the system, application, and power level. For airborne electronic systems, the most direct approach to thermal management would be to use ambient air or chilled air, provided…read more

Comparison Of Heat Transfer Rates Of Different Nanofluids On The Basis Of The Mouromtseff Number

August 1st, 2007

Nanofluids are dispersions of nanometer-sized particles in a base fluid such as water, ethylene glycol or propylene glycol. In the last decade, nanofluids have attracted more attention as a new generation of coolants for various…read more

Design For Manufacturability Of Forced Convection Air Cooled Fully Ducted Heat Sinks

August 1st, 2007

Introduction The requisite thermal management for a microprocessor is most often achieved via an aluminum heat sink (fin structure) and a small fan. The effort discussed herein deals with the development of a ‘design for…read more

Thanks and Congratulations

August 1st, 2007

Since the first issue of ElectronicsCooling magazine emerged in June 1995, I have had the privilege of publishing a number of feature articles in the magazine. Writing these articles came relatively easy because the topics…read more

Thermal Diffusivity

August 1st, 2007

Thermal diffusivity is a measure of the transient thermal response of a material to a change in temperature and the term thermal diffusivity (α) is defined as α = k/(ρ x cp) where α is…read more

Thermal Strain In Semiconductor Packages, Part I

August 1st, 2007

Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low,…read more

Top 20 Considerations For Selecting Thermal Interface Materials

August 1st, 2007

Introduction Heat is often considered the limiting factor in the advancement of electronics systems. Lower thermal resistance will drive, not follow, future electronic designs. These solutions must be cost effective, user friendly and developed quickly.…read more