Articles from November 2007 Issue

A Practical Implementation Of Silicon Microchannel Coolers

November 1st, 2007

Introduction More than twenty-five years ago, Tuckerman and Pease first described the use of silicon microchannel cooling for very high power densities [1]. However, the coolers could not be fabricated easily and pressure drops were…read more

Advanced Cooling Using Meso-Scale Evaporative Cold Plates

November 1st, 2007

Introduction Thermal management of servers and communications equipment has become significantly more challenging over the past several years. As is well known, processor powers have increased to 150 W or more and are projected to…read more

Electronics Cooling At Higher Pressures … a Positive Displacement Pump Solution

November 1st, 2007

Introduction Many liquid cooling solutions in use today employ cooling system devices that result in system pressure drops limited to <0.5 bar (7.25 psi), which allows these systems to fit within the limits of centrifugal…read more

Providing More Value Than Playing Video Games

November 1st, 2007

ElectronicsCooling magazine was founded more than 12 years ago with a mission of providing current and practical thermal management information with archival value. I hope you agree this magazine is still delivering on its original…read more

Reliability Testing Of Thermal Greases

November 1st, 2007

Introduction Thermal Interface Materials (TIMs) play a key role in the thermal management of electronic systems by providing a path of low thermal resistance between the heat generating devices and the heat spreader/sink. Typical TIM…read more

Thermal Effusivity

November 1st, 2007

The Technical Data column of the previous issue discussed the concept of thermal diffusivity. It makes sense to discuss in this issue a related topic: thermal effusivity. While thermal diffusivity, a, is defined as the…read more

Thermal Strain in Semiconductor Packages, Part II

November 1st, 2007

Introduction This Calculation Corner continues Part I, published in the previous issue [1]. Part I described the construction of a typical flip-chip package configuration for high-power chips, consisting of a laminate assembly of materials adhesively…read more