Vapor compression refrigeration has long been used to cool telecommunications equipment and some high performance computers. On the whole, however, its usage has been confined to high-value, relatively large, and stationary applications. The advantages of…read more
Estimating Dew Point Temperature For Water Cooling Applications
May 1st, 2008
Over the past several years thermal engineers and others in the computer industry have become acutely aware of the challenge of increasing power dissipation and the potential of liquid (principally water) cooling to provide a…read more
Modeling Multiple Heat Source Problems In Electronic Systems
May 1st, 2008
Introduction Readers of ElectronicsCooling know about the rapid pace of technological developments towards an increasingly higher level of miniaturization and, hence, an incredible increase of dissipation power densities. Thus, restating some very well known facts…read more
On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages
May 1st, 2008
Introduction In recent years, high-power, high-brightness Light Emitting Diodes (LEDs) have penetrated into an ever-increasing number of lighting applications. For such devices, maintaining a low die temperature is becoming a huge challenge because of the…read more
On The Hate/Love Relationship Between The U.S. And SI
May 1st, 2008
Last year I devoted some words on correligion: the religious belief in the usefulness of correlations to solve real-life problems. I forgot to mention that correlations have one big advantage; they are dimensionless meaning that…read more
Heat Spreading: Not a Trivial Problem
May 1st, 2008
Introduction Heat spreading is essentially area enlarging: the larger the area, the more heat can be removed at the same temperature difference (subject to certain limits). Unfortunately, except for the simplest of cases, the equations…read more
Recent Posts
- Research Company Names Top Thermal Management Supplier
- Thin-Film Thermoelectrics with Improved Cooling Efficiency
- Temperature/Process Controller Panel CNI-CB120SB
- New Version of Software for Modeling Data Centers
- New Data Center Infrastructure Management Software
- Thermocouple Virtual Chart Recorder
- Company Sets World Record for Solar Module Efficiency
- Cooling Semiconductor with Laser Light
Latest Issue
Don’t miss out on
the December 2011 issue
of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Heat pipes for electronics cooling applications 6 comment(s)
- Notes on using thermocouples 4 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- All you need to know about fans 1 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- @ztechsales Thanks for tweeting our article! We have added you to our follower list. If you like, feel free to add us! #
- Molten metal ceramic sheath thermocouple - read more - http://t.co/b0UmtWy7 #
- Look for the special TIMs issue of the newsletter next week! Subscribe today to get your copy - http://t.co/g5vHe7TA #
- Read about a 40 GHz bandwidth socket for 16x16mm, 0.8mm pitch packages - http://t.co/2HUoSENS #
