Introduction A thermoelectric cooler (TEC) is a solid-state refrigerator that operates on the Peltier effect. The absence of moving parts, compact size, precise temperature control ability and reliability all combine to make the TEC a…read more
A Simple Method To Estimate The Physical Characteristics Of A Thermoelectric Cooler From Vendor Datasheets
August 1st, 2008
Heat of Vaporization
August 1st, 2008
Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data…read more
Heat Spreading Calculations Using Thermal Circuit Elements
August 1st, 2008
Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of…read more
Liquid Cooling for Datacom Equipment Centers
August 1st, 2008
Introduction The increasing heat load densities in datacom equipment centers require ever more sophisticated approaches to cooling. Air-cooled systems are now struggling to provide the needed level of thermal performance for many installations and energy…read more
Reader Poll Declares ElectronicsCooling a Winner!
August 1st, 2008
Reader Poll Declares ElectronicsCooling a Winner! Here in the United States we are in the midst of the campaign season leading to our national election in November to choose our next president. While Senator John…read more
Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks
August 1st, 2008
Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or…read more
Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems
August 1st, 2008
Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, “gaming” PCs, or tower servers that utilize…read more
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