Introduction A review of the technical and market impediments overcome in the development and eventual acceptance of cryocoolers for space-borne applications may shine light on the prospects for the use of such mechanical refrigeration systems…read more
Emissivity in Practical Numerical Modeling
November 1st, 2008
In the August 2003 issue, the Technical Data column was devoted to emissivity in practical temperature measurements. But what about the emissivity value that should be entered in your numerical model? Can we use the…read more
Giving Back
November 1st, 2008
haring, Tech nical knowledgeThe A&D group represents a large number of subscribers but their contribution rate measured against authored articles in ElectronicsCooling is underrepresented. Soliciting targeted articles from my coworkers within this industry group has…read more
Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management
November 1st, 2008
Introduction Due to the increasing power density in today’s industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and…read more
Power Map Calculations Using Image Sources and Superposition
November 1st, 2008
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more…read more
Pushing the Boundaries of Heat Pipe Operation
November 1st, 2008
Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures…read more
Recent Posts
- Research Company Names Top Thermal Management Supplier
- Thin-Film Thermoelectrics with Improved Cooling Efficiency
- Temperature/Process Controller Panel CNI-CB120SB
- New Version of Software for Modeling Data Centers
- New Data Center Infrastructure Management Software
- Thermocouple Virtual Chart Recorder
- Company Sets World Record for Solar Module Efficiency
- Cooling Semiconductor with Laser Light
Latest Issue
Don’t miss out on
the December 2011 issue
of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Heat pipes for electronics cooling applications 6 comment(s)
- Notes on using thermocouples 4 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- All you need to know about fans 1 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- @ztechsales Thanks for tweeting our article! We have added you to our follower list. If you like, feel free to add us! #
- Molten metal ceramic sheath thermocouple - read more - http://t.co/b0UmtWy7 #
- Look for the special TIMs issue of the newsletter next week! Subscribe today to get your copy - http://t.co/g5vHe7TA #
- Read about a 40 GHz bandwidth socket for 16x16mm, 0.8mm pitch packages - http://t.co/2HUoSENS #
