Introduction
Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely…read more
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
May 9th, 2009
Posted in Aerospace, Applications, Automotive, Communications, Consumer, Defense, Design, IT Products, Industrial, Industries, Medical, Power, Test & Measurement | No Comments »
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Introduction
The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and…read more
Posted in Aerospace, Applications, Automotive, Communications, Consumer, Defense, IT Products, Industrial, Industries, Medical, Power, Test & Measurement | No Comments »
Numerical Simulation of Complex Submicron Devices
May 1st, 2009
Introduction
Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal…read more
Posted in Aerospace, Applications, Automotive, Communications, Consumer, Defense, IT Products, Industrial, Medical, Power, Semiconductor, Test & Measurement | No Comments »
On (the Lack of) Thermal Education
May 1st, 2009
Some like it hot, others do not. And those others for sure include the designers of products that contain electronics. There is a growing need…read more
Posted in Editorial | No Comments »
Small Fans for Cooling Small Electronic Devices
May 1st, 2009
Small Fans for Cooling Small Electronic Devices
Masaharu Miyahara, Sunonwealth Electronic Machine Industry Co., Ltd.
The growing portable device market boosts the development of small electric devices,…read more
Posted in Technical Brief | No Comments »
Thermal Conductivity of Filled Plastics
May 1st, 2009
Compared to other solid materials, metals are widely known for their superior heat transfer capabilities. However, these capabilities come at the cost of…read more
Posted in Technical Data | No Comments »
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
May 1st, 2009
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are…read more
Posted in Calculation Corner | No Comments »
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