Articles from August 2009 Issue

Back to the Future with a Liquid Cooled Supercomputer

August 1st, 2009

Introduction: Evolution of Air and Water Cooling for Electronic Systems Since the development of the first electronic digital computers in the 1940s, efficient removal of heat has played a key role in insuring the reliable…read more

The Better Box Model

August 1st, 2009

Introduction For the consumer, natural convection cooling or fan-less cooling is the method of choice. It is silent, it is reliable, it is simple, and it is environmentally sound because no additional energy is used…read more

Use of Power Law Regression in Packaging Thermal Calculations

August 1st, 2009

Introduction In today’s demanding business climate, thermal engineers are often called upon to produce thermal analyses rapidly. For example, there is frequently the need for a quick calculation of a JEDEC-standard thermal performance metric, such…read more

Direct Spray Cooling and System-level Comparisons

August 1st, 2009

Introduction As power densities of embedded electronics increase, cooling becomes a challenge especially in harsh environments. Liquid cooling is accepted as an attractive cooling method for an increasing number of applications. Direct spray is a…read more

Change and Communication

August 1st, 2009

We live in an age of change. Of course this is not new, the history of the human race has been one of change and adaptation throughout the ages. However, it seems that never before…read more

Technical Data Summary

August 1st, 2009

ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common…read more

Lowering a Notebook CPU Temperature Using a Dual-Tunnel Blower

August 1st, 2009

Figure 1. Side by side comparison of blower technologies. Introduction Notebook computers on the market today may be classified in three categories. In the first category are the super slim and powerful notebooks such as…read more

New Products

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High Thermal Conductivity Mounting Tape

MH&W International’s Keratherm KL 90 is a highly thermally conductive, double-sided adhesive tape. It provides 1.4 W/mK of thermal conductivity – nearly three times higher than other thermal tapes – for more effective heat transfer…read more

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Water and Air Coolers for Converters

AMS Technologies offers customized Webra water and air cooling solutions for use in various converters and inverters in wind power, traction and industry applications. Offerings include water coolers for 62 mm IGBT modules, SKiiP, Primepack,…read more

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Two-Phase Cooling System

Parker Hannifin Corporation has released a two-phase cooling system to manage the heat of high- power electronics safely and efficiently. The Precision Electronics Cooling System Technology permits power electronics design platforms to have up to…read more

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Microscale Heat Pump

Nextreme Thermal Solutions’ OptoCooler HV14 thermoelectric cooler (TEC) is the first module in a new class of high voltage and high heat pumping thermoelectric coolers that operate at low currents and are optimized for standard…read more

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Easy Release Thermal Gap Pads

Fujipoly has introduced specially formulated thermal interface gap pad materials that simplify board-level maintenance by reducing material tearing during disassembly for re-work and repair. Sarcon GR-H and XR-H thermal interface materials feature a unique hardened…read more

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High-Performance Vane-Axial DC Fans

Orion Fans has introduced a new line of vane-axial fans with superior airflow in exceptionally high static pressure environments. High performance VA Series DC fans feature a dual ball bearing system with a brushless DC,…read more