Articles from August 2009 Issue

Back to the Future with a Liquid Cooled Supercomputer

August 1st, 2009

Levi Campbell and Michael J. Ellsworth, Jr.

Introduction: Evolution of Air and Water Cooling for Electronic Systems
Since the development of the first electronic digital computers in the 1940s, efficient removal of heat…read more

Posted in Coolers, Liquid Cooling | No Comments »

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The Better Box Model

August 1st, 2009

G.A. (Wendy) Luiten

Introduction
For the consumer, natural convection cooling or fan-less cooling is the method of choice. It is silent, it is reliable, it is simple, and it…read more

Posted in Applications, Blowers / Fans / Filters, Communications, Consumer, Design, IT Products, Industries, Test & Measurement | No Comments »

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Use of Power Law Regression in Packaging Thermal Calculations

August 1st, 2009

Bruce Guenin

Introduction
In today’s demanding business climate, thermal engineers are often called upon to produce thermal analyses rapidly. For example, there is frequently the need for a…read more

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Direct Spray Cooling and System-level Comparisons

August 1st, 2009

Andy Finch and Eric Ballew

Introduction
As power densities of embedded electronics increase, cooling becomes a challenge especially in harsh environments. Liquid cooling is accepted as an attractive cooling method for…read more

Posted in Aerospace, Applications, Defense, Design, Industries, Liquid Cooling | No Comments »

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Change and Communication

August 1st, 2009

Robert Simons

We live in an age of change. Of course this is not new, the history of the human race has been one of change and…read more

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Technical Data Summary

August 1st, 2009

Jim Wilson

ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use…read more

Posted in Applications, Ceramics, Design, Materials, Compounds, Adhesives, Substrates, Plastics, Technical Data, Test & Measurement | No Comments »

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Lowering a Notebook CPU Temperature Using a Dual-Tunnel Blower

August 1st, 2009

Wen-Chun Zheng

Figure 1. Side by side comparison of blower technologies.
Introduction
Notebook computers on the market today may be classified in three categories. In the first category are…read more

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New Products

High Thermal Conductivity Mounting Tape

MH&W International’s Keratherm KL 90 is a highly thermally conductive, double-sided adhesive tape. It provides 1.4 W/mK of thermal conductivity – nearly three times higher…read more

Water and Air Coolers for Converters

AMS Technologies offers customized Webra water and air cooling solutions for use in various converters and inverters in wind power, traction and industry applications. Offerings…read more

Two-Phase Cooling System

Parker Hannifin Corporation has released a two-phase cooling system to manage the heat of high- power electronics safely and efficiently. The Precision Electronics Cooling System…read more

Microscale Heat Pump

Nextreme Thermal Solutions’ OptoCooler HV14 thermoelectric cooler (TEC) is the first module in a new class of high voltage and high heat pumping thermoelectric coolers…read more

Easy Release Thermal Gap Pads

Fujipoly has introduced specially formulated thermal interface gap pad materials that simplify board-level maintenance by reducing material tearing during disassembly for re-work and repair. Sarcon…read more

High-Performance Vane-Axial DC Fans

Orion Fans has introduced a new line of vane-axial fans with superior airflow in exceptionally high static pressure environments. High performance VA Series DC fans…read more