Don’t miss out on the March 2012 issue of Electronics Cooling, which includes the 2012 Buyers’ Guide, feature articles on Iconic Winds: A New Frontier for Air Cooling, Thermal Ground Plane Technology Impacts Electronics Packaging,…read more
Enhancement of Microchannel Cooling with Oblique Technology
March 14th, 2012
MICROCHANNEL cooling has emerged as an effective method to enhance cooling for electronics devices [1]. However, the problem of boundary layer development, as liquid coolant travels downstream, persists in conventional microchannel heatsinks. Consequently, convective heat…read more
Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power and Packaging Density Electronic Systems
March 14th, 2012
SINCE 2008, collaborative research conducted at Raytheon Company, Thermacore Incorporated, Purdue University and Georgia Tech Research Institute has pursued the development of Thermal Ground Plane (TGP) technology. The DARPA-sponsored Radio Frequency Thermal Ground Plane (RFTGP)…read more
Calculation Corner: Transient Modeling of a High Power IC Package, Part 2
March 13th, 2012
Part 1 can be found here. Part 1 of this article provided the groundwork for the present discussion [1]. It demonstrated the use of three different methodologies for performing a transient thermal analysis of a…read more
Ionic Winds: A New Frontier for Air Cooling
March 13th, 2012
AIR-COOLING IS THE oldest and, in many ways, the easiest method of cooling electronics, whether it be through fan-driven forced convection or simply natural convection. However, with the increasing speed of processors, shrinking of form…read more
Thermal Facts & Fairy Tales: Heat Spreading Revisited
March 13th, 2012
AS PROMISED IN MY editorial of the 2011 Fall issue, I will devote this issue’s column on the topic of heat spreading. The reason is that I, while writing a white paper on basic thermal…read more
Editorial: Forward Looking
March 13th, 2012
IN THE LAST WINTER ISSUE OF ELECTRONICS COOLING, our friend and colleague Bob Simons used his editorial column to inform us that he was resigning his position as an associate technical editor and this issue…read more
New Products
Thermally Conductive Compounds for Enhanced LED Luminaires
Global custom engineered thermoplastics compounder RTP Company has introduced a line of thermally conductive compounds for replacing metal heat sinks and housings in light-emitting diode (LED) luminaires. The new compounds have been specially formulated to…read more
Enclosure Models Meet European ATEX Directive
Pentair Technical Products announces a fully featured, expanded line of Hoffman™ brand ZONEX™ ATEX-Certified* Enclosures. ZONEX hinge-cover and screw-cover enclosures are designed for use in applications where “increased safety” protection (Ex e), as defined by…read more
3D Fluid-Flow Analysis Software
TriStar increases its expertise in the CAD design market by taking part in the area of pre-physical prototype production. The Mentor Graphics® FloEFD™ product is a full-feature 3D fluid-flow analysis package that enables engineers to…read more
Lithium-Ion Battery Option for DIN Rail Industrial UPS
A lithium-ion-based battery is now available for Phoenix Contact’s Quint UPS-IQ line. The new battery’s longer lifespan and extended temperature range minimize the need for frequent battery replacement. The lithium technology has a lifespan of…read more
Heat Sink for Packing Densities up to 100W/cm2
Ceramtec’s CeramCool Box is made for homogeneous and efficient cooling of packing densities up to 100W/cm2. For example, with an edge length of just 16 x 40 x 40 mm it has a total cooling…read more
Thermal Solutions Company Earns AS9100 Rev. C Certification
Thermacore, Inc. has achieved AS9100:2009 Rev. C certification and was re-certified to ISO 9001:2008. AS9100 Rev. C imposes a number of requirements for the business process that must be fulfilled to achieve customer satisfaction, including…read more
Company Demonstrates Thermal Cooling Jet Technology
GE Global Research presented its advanced, dual piezoelectric, thermal cooling jet (DCJ) during a vendor workshop at SEMI-THERM 28. The DCJ, a 1 mm thick, ultra-compact bellows device provides air flow more efficiently than a…read more
Range of Diamond Materials Used in Thermal Management Applications
Element Six has developed a range of polycrystalline diamond and synthetic diamond composite materials that can be used in a wide range of thermal management applications. Synthetic diamond is an ideal material for a range…read more
Non-Silicone Thermal Interface Products
AOS Thermal Compounds showcased its thermally conductive interface material, thermal grease and gap filler at SEMI-THERM 28 in San Jose, California. The company’s Micro-Faze®A is a dry-to-touch thermal interface pad formulated with non-silicone thermal grease.…read more
Thermal Interface Materials Improve Heat Management
Intermark offers thermal interface materials (silicone based, silicone free, EMC and Thermal management dual function types), heat spreader sheets, thin thermal tape, and other solutions to improve the heat management of any application including LED Lighting, laptops,…read more
Gap Fillers and Thermal Greases on Display at SEMI-THERM
Fujipoly will be at SEMI-THERM showcasing its Sarcon® 50G-Hm high performance, low resistance gap filler pad, Sarcon® GR-SL low compression thermal gap filler material, and Sarcon® SG-26SL silicone-based thermal grease. The Sarcon® 50G-Hm is manufactured…read more
High Temperature Felt and Millboard Ideal for Industrial Appliances
Morgan Thermal Ceramics announces the availability of its Superwool® HT™ Felt and Superwool® HT™ Millboard, ideal for fabricating gaskets and heat shields for industrial appliances, including ovens, fryers and cooking equipment. The lightweight, multi-purpose products…read more
Thermal Fuse Series Meets High Current Application Requirements
In response to market demand for applications requiring thermal cut-outs with high current capabilities, Selco Products has introduced the SWTC3 Thermal Fuse Series. The SWTC3 features a 20 Amp rating at 120/250VAC and is suited…read more
Thin Label Material Made of 0.5 Mil Polyimide Film
Polyonics has designed an ultra-thin, white coated, polyimide label material that uses a 0.5 mil film for space constrained electronics. The XF-616 is a high temperature, thermal transfer printable material with an aggressive acrylic adhesive…read more
Recent Posts
- Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat Rejection
- Quiet CPU Coolers for Intel Xeon Workstations and Servers
- Temperature Controller for Thermoelectric Modules and Supplemental Resistive Heaters
- Fans for Low-Noise, Low-Airflow Applications
- Programmable Digital Temperature Control for Electronic Enclosures
- U.S. Patent for Two-Stage Enclosure Coolers Awarded
- Company Acquires Thermal and Vacuum Product Manufacturer
- Thermal Spreading and More Using Open-Source FEA Software
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