Scientists at ETH Zurich used a set of laser beams to create a honeycomb-like structure similar to that found in graphene. By loading ultracold atoms into this optical lattice, they can simulate electronic properties of…read more
New 60-Watt Thermoelectric Temperature Controller
April 24th, 2012
ILX Lightwave has added the LDT-5940C to its portfolio of thermoelectric temperature controllers designed for testing of laser diodes and other optoelectronic devices. The LDT-5940C features 60W of temperature control, an intuitive front panel, and…read more
The Fifteenth Meeting of the Symposium on Polymers
April 23rd, 2012
May 8 -10, Winterthur Museum & Gardens, Wilmington, Del. From its origins in polyimide materials and processes, The Symposium on Polymers has evolved into a comprehensive technical meeting with a broad focus on organic and…read more
SAE 2012 World Congress
April 23rd, 2012
April 24-26, Cobo Center, Detroit, Mich. The SAE 2012 World Congress theme, Get Connected, represents the new and diverse connections that will drive significant advancements in the auto industry of tomorrow. Not only does the…read more
Luminescent ‘LED-type’ Design Breaks Efficiency Record
April 23rd, 2012
To produce the maximum amount of energy, solar cells are designed to absorb as much light from the Sun as possible. Now researchers from the University of California, Berkeley, have demonstrated a counterintuitive concept: solar…read more
Nanoscale Phenomena with Potential for Computer Speed Advances
April 23rd, 2012
A team of University of Maryland scientists have discovered that when electric current is run through carbon nanotubes, objects nearby heat up while the nanotubes themselves stay cool. Understanding this completely unexpected new phenomenon could…read more
Air-to-Air Thermoelectric Cooling Assembly
April 22nd, 2012
Marlow Industries announced the availability of a new high-performance air-to-air thermoelectric cooling assembly—Climatherm. The new assemblies provide up to 125 percent greater performance than current air-to-air thermoelectric assemblies, in an exceptionally light and compact package.…read more
Magnetic Testing Ensures Reliability of Microelectronic Devices
April 21st, 2012
Researchers at the Georgia Institute of Technology have developed a new technique for measuring the adhesion strength between thin films of materials used in microelectronic devices, photovoltaic cells and MEMS using magnetic repulsion. The fixtureless…read more
New R&D Performance Record with 254 Lumen-Per-Watt Power LED
April 20th, 2012
Cree, Inc. delivers another industry first with a barrier-breaking 254 lumen-per-watt white R&D power LED. This significant milestone exceeds Cree’s previous R&D industry record of 231 lumens per watt and demonstrates Cree’s continued commitment to…read more
Researcher Finds Cheaper Way To Cool Electronic Devices
April 20th, 2012
A North Carolina State University researcher has developed a technique that uses a “heat spreader” made of a copper-graphene composite, which is attached to the electronic device using an indium-graphene interface film, both of which…read more
Pricey LED Bulb Gives off 940 Lumens
April 19th, 2012
Philips new L Prize LED has a suggested price of $50. The general lighting bulb came out of the Department of Energy’s L Prize competition to develop long-lasting, efficient, and less expensive LED lamps. Philips…read more
Dual High Temperature Cabinet Cooler Systems for Large Enclosures
April 19th, 2012
EXAIR’s new Dual High Temperature Cabinet Cooler® Systems purge and cool overheated electrical control panels in harsh environments up to 200°F (93°C). Cabinet Coolers keep electrical enclosures cool with air as cold as 20°F (-7°C)…read more
New Coolers for LED Thermal Management
April 18th, 2012
Nuventix, Inc. announced four new additions to the company’s award-winning line of SynJet coolers for LED lights: the Wall Wash Cooler 77W, Outdoor Cooler 70W and 77W and Spotlight Cooler 57W. Each of these devices…read more
Thermal Control Accessories Socket BGA/QFN IC’s
April 17th, 2012
Ironwood Electronics’ new high performance thermal socket lid -TSL-ST-01 allows any IC devices to be placed inside any socket and operated at IC’s extreme temperature to determine its thermal capability.Thermal Socket Lid & Control Systems enable…read more
Recent Posts
- Researchers Control Heat Flow with Atoms
- SEMICON West 2012
- Summer Heat Transfer Conference
- IMS2012 International Microwave Symposium
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- 55°C Cooling Performance Thin-Film Thermoelectric Coolers
- A Little Goes A Long Way (But A Lot Doesn’t Go Much Further)
- Significant Changes to the NFPA 70E Standard 2012 Edition
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