Introduction The electronic industry requires increased forced-air cooling limits to cool high-end server CPUs adequately. Improving air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of…read more
Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs
February 1st, 2005
Posted in Design, Heat Pipes, Heat Sinks, Test & Measurement | No Comments »
Server Design Challenges for the High-heat-load Internet Data Center
February 1st, 2005
Introduction Microprocessor and system thermal management are linked to facility cooling: power dissipation and cooling techniques employed at one end of the size scale have cascading impacts at the other extreme (Figure 1). For example,…read more
Posted in Blowers / Fans / Filters, Computer, Coolers, Data Centers, Design, Heat Sinks, Test & Measurement | No Comments »
Air Cooled Compact Heat Exchanger Design For Electronics Cooling
February 1st, 2004
Introduction This article will discuss air-cooled compact heat exchanger design using published data. Kays & London’s Compact Heat Exchangers [1] contains measured heat transfer and pressure drop data on a variety of circular and rectangular…read more
Posted in Coolers, Design, Heat Sinks, Test & Measurement | No Comments »
Hot Spots in Data Centers
August 1st, 2003
Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat load has been documented by a Thermal Management Consortium of 17 companies [1] as shown in Figure 1. Also…read more
Posted in Blowers / Fans / Filters, Communications, Data Centers, Design, IT Products, Test & Measurement | No Comments »
Recognizing the Limits of Conventional Axial Hub-Motor AHS Devices
August 1st, 2003
Conventional axial hub-motor AHS (Active Heatsink) devices (Figure 1) have reached their functional and cost limits and may not be improved significantly. These devices have a number of inherent, severe contradictions (design limitations) that determine…read more
Posted in Blowers / Fans / Filters, Design, Technical Brief | No Comments »
The Weakest Link in Air Cooling
May 1st, 2003
So far, this 21st Century has been a big disappointment. I grew up on the science fiction of the 1950′s and 60′s. Plus I knew that the stories of Jules Verne and H. G. Wells…read more
Posted in Blowers / Fans / Filters, Design, Kordyban's Korner | No Comments »
Numerical Modeling and Experimental Verification of High-density Servers
November 1st, 2002
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a…read more
Posted in Blowers / Fans / Filters, Computer, Design, Heat Sinks, IT Products, Power, Semiconductor, Test & Measurement | No Comments »
Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate
August 1st, 2001
Although most of the emphasis today in the electronics cooling community is devoted to extending forced convection cooling capability, many applications still depend upon natural convection cooling. Basically, natural convection cooling combined with radiation is…read more
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
General aspects on fan selection and layout
May 1st, 2001
Introduction and Description of Fan Types Small ventilators are generally called fans. Depending on the geometrical design of the impeller, various constructional types are distinguished to indicate the main direction of the airflow. Here are…read more
Posted in Blowers / Fans / Filters, Design, Technical Brief | No Comments »
Future trends in heat sink design
February 1st, 2001
In today’s electronics equipment, total system dissipated power levels are increasing with every new design. Increases in power levels combined with the market expectation of reduced package sizes lead to heat problems that, if uncontrolled,…read more
Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Heat Pipes, Heat Sinks, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Test & Measurement | 1 Comment »
The treacherous streams
February 1st, 2001
During the development of a telecommunications product, an unpredictable phenomenon of air streams within the maze of cards and module was encountered. It could only be compared to suddenly confronting powerful inner streams in a…read more
Posted in Blowers / Fans / Filters, Design, Heat Sinks, Test & Measurement | No Comments »
Computer-related thermal packaging at the millenial divide
January 1st, 2000
Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as…read more
Posted in Communications, Computer, Coolers, Data Centers, Design, Heat Sinks, IT Products, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Power, Semiconductor | No Comments »
Adjusting temperatures for high altitude
September 1st, 1999
Many companies design products with electronics that must function reliably at high altitude, typically 1,500m (5,000 ft) or 3,000m (10,000 ft) above sea level. Estimating the increase in operating temperatures is necessary to design and…read more
Posted in Aerospace, Blowers / Fans / Filters, Design, Heat Sinks, Technical Brief, Test & Measurement | No Comments »
Determining the junction temperature in a plastic semiconductor package, part II
September 1st, 1999
In the majority of applications involving plastic surface-mount packages, most of the heat generated by integrated circuits will flow to the printed circuit board (PCB) by way of the package leads and then to In…read more
Posted in Calculation Corner, Design, Plastics, Semiconductor, Test & Measurement | No Comments »
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