Automobiles, military vehicles, even large-scale power generating facilities may someday operate far more efficiently thanks to a new alloy developed at the U.S. Department of Energy’s Ames Laboratory. A team of researchers at the Lab…read more
New Material Provides Greater Thermoelectric Conversion Efficiency
February 22nd, 2011
Posted in Automotive, Defense, TECs | No Comments »
Thermal conductivity of common alloys in electronics packaging
February 1st, 2007
Thermal conductivity of common alloys in electronics packaging Jim Wilson, Associate Technical Editor Property Thermal Conductivity (W/mK) @25°C CTE (ppm/°C) @25°C Copper 395 17.1 Aluminum 200 23.5 CuMo 160-185 7.0-9.0 CuW 180-220 6.5-8.5 Kovar…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Data | No Comments »
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