TDK-EPC, a group company of TDK Corporation, has developed snap-in aluminum electrolytic capacitors from EPCOS that enable optimal contact to heat sinks. This permits link circuit capacitors to be efficiently cooled, significantly increasing their ripple current…read more
New Snap-in Aluminum Electrolytic Capacitors
December 27th, 2010
Posted in Industries, New Products, Power | No Comments »
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
February 1st, 2006
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today’s electronics. In these design situations, the proven method of analytical calculations,…read more
Posted in Aerospace, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement | No Comments »
Graphite fiber reinforced al and cu alloys for thermal management applications
January 1st, 1999
Technological advances in the electronics industry have revolutionized the way the world communicates and conducts business. Today’s electronic products, from cellular phones to sophisticated imaging satellites, demand lightweight, low-cost materials that provide more functionality in…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Brief | No Comments »
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