Previous Technical Data columns have covered thermal properties for many of the materials that are common to electronics packaging. The Technical Data for this issue is broader in scope and addresses common building materials, some…read more
Thermal Properties Of Building Materials
February 1st, 2008
Posted in Materials, Compounds, Adhesives, Substrates, Technical Data | No Comments »
Recent Posts
- Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures
- Research Company Names Top Thermal Management Supplier
- Thin-Film Thermoelectrics with Improved Cooling Efficiency
- Temperature/Process Controller Panel CNI-CB120SB
- New Version of Software for Modeling Data Centers
- New Data Center Infrastructure Management Software
- Thermocouple Virtual Chart Recorder
- Company Sets World Record for Solar Module Efficiency
Latest Issue
Don’t miss out on
the December 2011 issue
of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Heat pipes for electronics cooling applications 6 comment(s)
- Notes on using thermocouples 4 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- All you need to know about fans 1 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- Look for the March issue of Electronics Cooling featuring the 2012 Buyers' Guide - Subscribe today - http://t.co/RGtouuDk #
- @ztechsales Thanks for tweeting our article! We have added you to our follower list. If you like, feel free to add us! #
- Molten metal ceramic sheath thermocouple - read more - http://t.co/b0UmtWy7 #
- Look for the special TIMs issue of the newsletter next week! Subscribe today to get your copy - http://t.co/g5vHe7TA #
