Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years.…read more
Compact thermal modeling in electronics design
May 1st, 2007
Posted in Design, Test & Measurement | No Comments »
A Simple Thermal Resistance Model – Isoflux Versus Isothermal
February 1st, 2006
In most cases today thermal design for electronic products is performed with the aid of sophisticated computational fluid dynamics and heat transfer codes. Nonetheless, there may still be occasions when a thermal designer needs a…read more
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
CFD Simulations in Electronic Systems: A Lot of Pitfalls and a Few Remedies
May 1st, 2005
Introduction In the past 15 years, we have observed a significant increase in the use of Computational Fluid Dynamics (CFD) codes to calculate the thermal behavior of electronic systems. The benefits are undisputed when it…read more
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Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs
February 1st, 2005
Introduction The electronic industry requires increased forced-air cooling limits to cool high-end server CPUs adequately. Improving air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of…read more
Posted in Design, Heat Pipes, Heat Sinks, Test & Measurement | No Comments »
CFD Prediction of Electronic Component Operational Temperature on PCBs
May 1st, 2004
Introduction The thermal design of today’s electronic equipment relies significantly on the use of Computational Fluid Dynamics (CFD) software for the prediction of electronics operational temperature. In the early to intermediate product design phase, CFD…read more
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Thermal characterization of active components
May 1st, 1999
In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), the methods for thermal characterization of active components developed in the predecessor DELPHI (Development of Libraries of PHysical models for an Integrated design environment)…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
Improving productivity in electronic packaging with flow network modeling (fnm)
January 1st, 1999
As the complexity and power density of electronics systems increase, so too does the demand for tools to improve both product quality and designer productivity. This is especially true for thermal designers who use Computational…read more
Posted in Blowers / Fans / Filters, Coolers, Heat Sinks, Liquid Cooling, Semiconductor, Test & Measurement | No Comments »
Use of junction-to-board thermal resistance in predictive engineering
January 1st, 1999
The readers of “Electronics Cooling” are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you…read more
Posted in Design, Test & Measurement | No Comments »
DELPHI – A status report on the European -union funded project for the creation and validation of thermal models on electronic parts
January 1st, 1996
The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development…read more
Posted in Design, Software, Technical Brief, Test & Measurement | No Comments »
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