Posts tagged Chip Cooling

LED Chip Manufacturing Facility Opens in Huizhou, China

December 27th, 2010

Cree Huizhou Solid State Lighting Co., Ltd. marked the opening on Dec. 8 of its LED chip manufacturing facility at the Huizhou Zhongkai High-tech Industrial Development Zone in Huizhou City, Guangdong Province, China. Cree signed…read more

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Carbon Nanotubes Enable Pumpless Liquid Cooling System for Computers

August 23rd, 2010

Purdue University researchers, led by Suresh V. Garimella, have developed a new design employing carbon Nanotubes and small copper spheres that wicks water passively towards hot electronics that could meet the challenges brought on by…read more

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Compact Water-Circulation System Prevents Stacks of Electronic Chips

May 25th, 2010

A research team from the A*STAR Institute of Microelectronics and Nanyang University in Singapore has designed and built a water circulation system to cool stacks of integrated electrical circuits.  “The heat must be removed from…read more

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3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges

March 30th, 2010

A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively…read more

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Using a Matrix Inverse Method to Solve a Thermal Resistance Network

May 1st, 2009

Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a…read more

Posted in Calculation Corner, Liquid Cooling | 2 Comments »

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When Moore Is Less: Exploring the 3rd Dimension in IC Packaging

February 1st, 2009

Introduction As consumers of electronics we have become spoiled. We not only expect our electronic devices to get smaller, faster, more functional, cheaper, more interconnected, and more reliable, we actually demand it. It would not…read more

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High Powered Chip Cooling — Air and Beyond

August 1st, 2005

Introduction Over the past few years many people in the electronics industry have become concerned with the increases in heat density at both the chip and module level of packaging. This trend is not new…read more

Posted in Blowers / Fans / Filters, Design, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Semiconductor | Comments Off

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