Cree Huizhou Solid State Lighting Co., Ltd. marked the opening on Dec. 8 of its LED chip manufacturing facility at the Huizhou Zhongkai High-tech Industrial Development Zone in Huizhou City, Guangdong Province, China. Cree signed…read more
LED Chip Manufacturing Facility Opens in Huizhou, China
December 27th, 2010
Posted in Industries, LED / Lighting, News | No Comments »
Carbon Nanotubes Enable Pumpless Liquid Cooling System for Computers
August 23rd, 2010
Purdue University researchers, led by Suresh V. Garimella, have developed a new design employing carbon Nanotubes and small copper spheres that wicks water passively towards hot electronics that could meet the challenges brought on by…read more
Posted in Computer, Liquid Cooling, News | No Comments »
Compact Water-Circulation System Prevents Stacks of Electronic Chips
May 25th, 2010
A research team from the A*STAR Institute of Microelectronics and Nanyang University in Singapore has designed and built a water circulation system to cool stacks of integrated electrical circuits. “The heat must be removed from…read more
Posted in Applications, Computer, Coolers, Industries, Liquid Cooling, News | No Comments »
3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges
March 30th, 2010
A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively…read more
Posted in Applications, Liquid Cooling, News | No Comments »
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
May 1st, 2009
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a…read more
Posted in Calculation Corner, Liquid Cooling | 2 Comments »
When Moore Is Less: Exploring the 3rd Dimension in IC Packaging
February 1st, 2009
Introduction As consumers of electronics we have become spoiled. We not only expect our electronic devices to get smaller, faster, more functional, cheaper, more interconnected, and more reliable, we actually demand it. It would not…read more
Posted in Design, Semiconductor | No Comments »
High Powered Chip Cooling — Air and Beyond
August 1st, 2005
Introduction Over the past few years many people in the electronics industry have become concerned with the increases in heat density at both the chip and module level of packaging. This trend is not new…read more
Posted in Blowers / Fans / Filters, Design, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Semiconductor | No Comments »
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