Contamination accumulated on electronic circuit boards will cause temperatures in electronics to rise, triggering cooling fans to work harder to keep the equipment below its operating temperature limit, according to a new research paper by…read more
Cooling Fans Work Harder when Contamination Accumulates on Circuit Boards
February 22nd, 2011
Posted in Blowers / Fans / Filters, Data Centers, News | No Comments »
Board Level Air Velocity Sensor Protects Electronics from Overheating
November 22nd, 2010
Degree Controls, Inc. of Milford, N.H., has announced the F600 board level air velocity sensor for continuous monitoring of airflow in small locations. The revolutionary F600 airflow sensor has a small form factor of 0.5”…read more
Posted in News | 1 Comment »
Software Modeling to Determine Heat-Related Problem Spots
November 22nd, 2010
Managing heat generation and dissipation in today’s compact and complex electronic world requires the attention of designers and manufacturers alike. It is also a system-wide problem, because optimizing a thermal problem in one area—whether it’s…read more
Posted in Design, News, Software | 1 Comment »
System Measures Pressure Distribution between Heat Sinks, Components
September 27th, 2010
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and its source.…read more
Posted in Heat Sinks, New Products, Test & Measurement | No Comments »
Solve Thermal Issues Earlier in Updated Board Designs
February 1st, 2005
Introduction Often new products or product concepts only introduce some new aspects and rely heavily on existing designs. At the board level this often means only one section of a board is retooled or upgraded;…read more
Posted in Computer, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief | No Comments »
Thermal testing and control by means of built-in temperature sensors
September 1st, 1998
Introduction This paper will discuss a new approach to the measurement of the thermal properties of PCBs and the packages mounted to them. It is intended to replace traditional solutions, such as using thermocouples and…read more
Posted in Blowers / Fans / Filters, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
A practical formula for air-cooled boards in ventilated enclosures
September 1st, 1997
Fig. 1 – Ventilated cabinet Introduction Natural air convection is commonly applied as a cooling technique for electronic equipment of moderate power density such as telecommunication boxes. The main advantage of natural convection isits intrinsic…read more
Posted in Design | 2 Comments »
Thermal conductivity of printed wiring boards
October 1st, 1995
The thermal management of printed circuit boards is of increasing importanceas the power density of components and circuits continues to rise. Thesituation is complicated by the use of boards with multiple sheets of copperembedded in…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement | No Comments »
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