Posts tagged CMOS

Back to the Future with a Liquid Cooled Supercomputer

August 1st, 2009

Introduction: Evolution of Air and Water Cooling for Electronic Systems Since the development of the first electronic digital computers in the 1940s, efficient removal of heat has played a key role in insuring the reliable…read more

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Exploring the Limits of Air Cooling

August 1st, 2006

Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However,…read more

Posted in Blowers / Fans / Filters, Coolers, Design, Heat Sinks, Liquid Cooling, Semiconductor, Test & Measurement | 1 Comment »

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Liquid Cooling is Back

August 1st, 2005

Introduction IBM announced its return to water cooling on April 19, 2005 with the introduction of a water cooled heat exchanger mounted to the back cover of a 19 inch rack. This is the first…read more

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The Challenge of Operating Computers at Ultra-low Temperatures

August 1st, 2001

Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance.…read more

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Vapor Compression Cooling for High Performance Applications

August 1st, 2001

Vapor compression refrigeration is being adapted to cool computer and telecommunications equipment in a limited number of high performance applications. Vapor compression can lift large heat loads and can heat sink at below ambient temperatures.…read more

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Parameters affecting package thermal performance a low end system level example

May 1st, 2001

Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly rising power…read more

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Low temperature electronic cooling

September 1st, 2000

The potential for low temperature enhancement of CMOS performance has been recognized for some time, going back as far as the late 1960′s and mid-1970′s. A collection of articles focusing on low temperature electronics is…read more

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Application of Thermoelectric Coolers for Module Cooling Enhancement

May 1st, 2000

Figure 1. Cooling power density for different T.E. cooler designs (adaped from Vandersande and Fleurial [6]). Introduction Many advances in computer technology have been made possible by increases in the packaging density of electronics. These…read more

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The history of power dissipation

January 1st, 2000

Figure 1. Transistor counts on Intel processors from inception to present superimposed on Moore’s prediction. In his fascinating book, “Visions,” Michio Kaku [1] predicts a future driven by silicon and quantum computers. Based on the…read more

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Computer-related thermal packaging at the millenial divide

January 1st, 2000

Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as…read more

Posted in Communications, Computer, Coolers, Data Centers, Design, Heat Sinks, IT Products, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Power, Semiconductor | Comments Off

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