Introduction This Calculation Corner continues Part I, published in the previous issue [1]. Part I described the construction of a typical flip-chip package configuration for high-power chips, consisting of a laminate assembly of materials adhesively…read more
Thermal Strain in Semiconductor Packages, Part II
November 1st, 2007
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Thermal Strain In Semiconductor Packages, Part I
August 1st, 2007
Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low,…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
The coefficient of thermal expansion
January 1st, 1998
This is the second technical data feature that deals with the coefficient of thermal expansion (CTE). The first technical data feature, incorporated in the September 1997 issue, covered semiconductor materials, leadframes and solder alloys. This…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Data, Test & Measurement | No Comments »
Coefficient of thermal expansion
September 1st, 1997
As complexity increases and dies and packages become even larger, temperature gradients also increase, leading to problems with thermal mismatch. Hence, thermomechanical analysis grows in importance. Apart from the temperature differences, the most important parameter…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Technical Data | No Comments »
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