Compact thermal modeling in electronics design Sarang Shidore Flomerics Inc Introduction The challenge of accurately predicting junction temperatures of IC components in system-level CFD simulations has engaged the engineering community for a number of years.…read more
Compact thermal modeling in electronics design
May 1st, 2007
Posted in Design, Test & Measurement | No Comments »
Dynamic Temperature Measurements: Tools Providing a Look into Package and Mount Structures
May 1st, 2002
Today it is commonly accepted that dynamic thermal measurements, which have been used for more than 20 years [1], [2], [3], [4], are superior to steady-state ones. The temperature vs. time function – often called…read more
Posted in Design, Test & Measurement | No Comments »
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