Posts tagged Conduction

Forced-Air Enclosure for Conduction-Cooled Embedded Computing Boards

June 21st, 2010

Extreme Engineering Solutions (X-ES) in Middleton, Wis., is introducing the 8.8 pound XPand4200, a sub-half-ATR, forced-air-cooled enclosure for conduction-cooled modules for embedded computing in vetronics and avionics applications in unmanned aerial vehicles (UAVs), helicopters, fixed-wing…read more

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Modeling Multiple Heat Source Problems In Electronic Systems

May 1st, 2008

Introduction Readers of ElectronicsCooling know about the rapid pace of technological developments towards an increasingly higher level of miniaturization and, hence, an incredible increase of dissipation power densities. Thus, restating some very well known facts…read more

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