Researchers at the Niels Bohr Institute have discovered a new method for laser cooling semiconductor membranes. Semiconductors are vital components in solar cells, LEDs and many other electronics, and the efficient cooling of components is…read more
Cooling Semiconductor with Laser Light
February 7th, 2012
Posted in Coolers, LED / Lighting, News, Semiconductor, TECs | No Comments »
New Ford Model Updates Cooling System
November 21st, 2011
The latest high performance variant of the Ford Mustang bearing the Shelby name has a 5.8-liter supercharged V8 producing a 650 horsepower and 600 lb-ft of torque. The new 5.8-liter engine also sees updates to…read more
Posted in Automotive, Blowers / Fans / Filters, News | No Comments »
Little Layer Cakes of Crystal Could Help Shrink Computers
February 22nd, 2011
In research aimed at making computers even smaller and more powerful, two engineers at Duke University have made headway in the quest to control the beams of light generated by tiny lasers. The two Duke…read more
Posted in Computer, Industries, News | No Comments »
New Laptop and iPad™ Cooling Products Introduced
January 10th, 2011
ThermaPAK’s new products incorporate the company’s HeatShift Technology®, which brings down the temperature of long-running electronic devices to comfortable operating temperatures. The HeatShift Technology begins working once the gadget is placed on the pad. Grooved…read more
Posted in Computer, Consumer, Coolers, Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
20 MW Flywheel Frequency Regulation Plant Nears Completion
December 27th, 2010
Beacon Power Corporation has made substantial progress toward completion and partial start-up of the 20-megawatt (MW) flywheel frequency regulation plant the company is building in Stephentown, N.Y. More than 10 MW of energy storage capacity…read more
Posted in Industrial, Industries, News | No Comments »
Cooling Units Designed for Outdoor Enclosure Applications
October 11th, 2010
A new range of cooling units, specifically designed for outdoor enclosure applications, has been unveiled by Rittal. Rittal offers several standard outdoor enclosures with twin walls, separated by a 25mm air gap, which provides a…read more
Posted in Coolers, New Products | No Comments »
Firms partner for manufacture of SynJet thermal management solutions
March 30th, 2010
Nuventix, Inc., innovator of SynJet® active thermal management solutions, has signed a Manufacturing Services Agreement with Nypro Inc., which provides plastic injection molding and turn-key assembly of Nuventix products. Under the terms of the agreement,…read more
Posted in Applications, Materials, Compounds, Adhesives, Substrates, News | No Comments »
Company to validate next-generation cooling system for aircraft avionics with Air Force
March 30th, 2010
Fairchild Controls Corporation, an EADS North America company, has signed a teaming agreement with the U.S. Air Force Research Laboratory (AFRL) to evaluate innovative cooling system technologies for avionics and mission systems aboard military aircraft.…read more
Posted in Aerospace, News | No Comments »
Department of Energy announces $100 million for innovative research projects
March 30th, 2010
At the inaugural ARPA-E Energy Innovation Summit, U.S. Energy Secretary Steven Chu announced $100 million in Recovery Act funding will be made available to accelerate innovation in green technology, increase America’s competitiveness and create new…read more
Posted in Applications, Coolers, News | No Comments »
Advanced Aerodynamics for Electronics Cooling Fans
February 1st, 2009
Introduction The performance of electronics cooling fans has been steadily increasing as flow requirements chase higher thermal loading. These advances have been primarily achieved through mechanical and architecture changes. However, the aerodynamic sophistication of these…read more
Posted in Technical Brief | 1 Comment »
Cooling Issues for Automotive Electronics
August 1st, 2003
Electronic content in cars and trucks has significantly increased in the last 30 years. Much of the functional content of these vehicles is now generated or controlled by electronic systems. This trend will continue in…read more
Posted in Automotive, Design | No Comments »
Thermal management of highly integrated electronic packages in avionics applications
November 1st, 2001
The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic…read more
Posted in Aerospace, Defense, Design, Heat Pipes, Semiconductor, Test & Measurement | No Comments »
The Challenge of Operating Computers at Ultra-low Temperatures
August 1st, 2001
Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance.…read more
Posted in Computer, Coolers, Design, IT Products | No Comments »
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